Patents by Inventor CHEE-WAN GO

CHEE-WAN GO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12647090
    Abstract: A capacitive coupling isolation device and a receiving circuit are provided. The capacitive coupling isolation device includes an external coupling capacitor and the receiving circuit. The external coupling capacitor is electrically connected to a transmitting circuit and the receiving circuit. The receiving circuit includes a protection circuit architecture, which includes an input bonding pad structure and a filter resistor. The input bonding pad structure is formed by alternatively disposing patterned metal layers and dielectric layers, and the input bonding pad structure includes a pad capacitor and a filter capacitor. The pad capacitor is electrically connected to the external coupling capacitor and a filter capacitor. The filter capacitor and the filter resistor are both electrically connected to the pad capacitor and a ground end. The filter capacitor and filter resistor form a low-pass filter. The external coupling capacitor is a built-in package capacitor.
    Type: Grant
    Filed: October 21, 2024
    Date of Patent: June 2, 2026
    Assignee: LITE-ON SINGAPORE PTE. LTD.
    Inventors: You-Fa Wang, Chee-Wan Go, Jonah Mendoza Herrera
  • Publication number: 20250132745
    Abstract: A capacitive coupling isolation device and a receiving circuit are provided. The capacitive coupling isolation device includes an external coupling capacitor and the receiving circuit. The external coupling capacitor is electrically connected to a transmitting circuit and the receiving circuit. The receiving circuit includes a protection circuit architecture, which includes an input bonding pad structure and a filter resistor. The input bonding pad structure is formed by alternatively disposing patterned metal layers and dielectric layers, and the input bonding pad structure includes a pad capacitor and a filter capacitor. The pad capacitor is electrically connected to the external coupling capacitor and a filter capacitor. The filter capacitor and the filter resistor are both electrically connected to the pad capacitor and a ground end. The filter capacitor and filter resistor form a low-pass filter. The external coupling capacitor is a built-in package capacitor.
    Type: Application
    Filed: October 21, 2024
    Publication date: April 24, 2025
    Inventors: YOU-FA WANG, CHEE-WAN GO, Jonah Mendoza Herrera