Patents by Inventor Chee-Way Oh

Chee-Way Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High frequency flip chip package structure of polymer substrate
    Patent number: 8258606
    Abstract: A high frequency flip chip package substrate of a polymer is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: September 4, 2012
    Inventors: Edward-yi Chang, Li-Han Hsu, Chee-Way Oh, Wei-Cheng Wu, Chin-te Wang
  • High frequency flip chip package process of polymer substrate and structure thereof
    Patent number: 8033039
    Abstract: In a high frequency flip chip package process of a polymer substrate and a structure thereof, the structure is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: October 11, 2011
    Assignee: National Chiao Tung University
    Inventors: Edward-yi Chang, Li-Han Hsu, Chee-Way Oh, Wei-Cheng Wu, Chin-te Wang
  • HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
    Publication number: 20110186974
    Abstract: A high frequency flip chip package substrate of a polymer is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.
    Type: Application
    Filed: April 13, 2011
    Publication date: August 4, 2011
    Inventors: Edward-yi Chang, Li-Han Hsu, Chee-Way Oh, Wei-Cheng Wu, Chin-te Wang