Patents by Inventor Chee Keong Chin
Chee Keong Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230402323Abstract: A semiconductor die is separated from a semiconductor wafer using a method that involves performing a partial cut on the semiconductor wafer, applying tape lamination to a front side of the semiconductor wafer, grinding a back side of the semiconductor wafer, mounting the semiconductor wafer to a die attach film (DAF) layer, removing the tape lamination from the front side of the semiconductor wafer, and performing a DAF-die separation operation to separate the semiconductor die from the adjacent semiconductor die. A DAF laser is not used during the method of separating a semiconductor die from a semiconductor wafer. The front side is the side of the semiconductor wafer where integrated circuits are exposed. The partial cut is between the semiconductor die and an adjacent semiconductor die. The back side is opposite of the front side and the back side is a silicon layer of the semiconductor die.Type: ApplicationFiled: June 13, 2022Publication date: December 14, 2023Applicant: Western Digital Technologies, Inc.Inventors: Zhengjie ZHU, Junrong YAN, Chee Keong CHIN, Cheng CHANG, Zhonghua QIAN
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Publication number: 20220181208Abstract: Semiconductor dies formed on a wafer may be picked from the wafer with little or no stress, thus preventing cracking and damage to the semiconductor dies. A die attach film (DAF) layer is laminated onto an inactive surface of the wafer and the DAF layer is cut in the outline of the dies. The inactive surface of the wafer may then be supported on a vacuum chuck without using a dicing tape, and dies transferred from the wafer using a pick and place robot.Type: ApplicationFiled: February 12, 2021Publication date: June 9, 2022Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.Inventors: Xin Tian, Junrong Yan, Chee Keong Chin, Weili Wang, Yang Lei
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Patent number: 11289395Abstract: A process includes forming one or more apertures on a component backside, creating a vacuum in a mold chase, and engaging the component backside with a mold compound in the mold chase. The one or more apertures form an aperture structure. The aperture structure may include multiple apertures parallel or orthogonal to each other. The apertures have an aperture width, aperture depth, and aperture pitch. These characteristics may be altered to minimize the likelihood of trapped air remaining after creating the vacuum in the mold chase.Type: GrantFiled: March 17, 2020Date of Patent: March 29, 2022Assignee: Western Digital Technologies, Inc.Inventors: Junrong Yan, Chee Keong Chin, Xin Lu
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Patent number: 11177241Abstract: A semiconductor device is disclosed including a die stack including a number of dies aligned with each other with respect to an axis, and a top die that is offset along the axis the to prevent die cracking.Type: GrantFiled: March 10, 2020Date of Patent: November 16, 2021Assignee: Western Digital Technologies, Inc.Inventors: Junrong Yan, Jianming Zhang, Min Zhao, Kailei Zhang, Chee Keong Chin, Kim Lee Bock
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Publication number: 20200381401Abstract: A semiconductor device is disclosed including a die stack including a number of dies aligned with each other with respect to an axis, and a top die that is offset along the axis the to prevent die cracking.Type: ApplicationFiled: March 10, 2020Publication date: December 3, 2020Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.Inventors: Junrong Yan, Jianming Zhang, Min Zhao, Kailei Zhang, Chee Keong Chin, Kim Lee Bock
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Publication number: 20200335481Abstract: A process includes forming one or more apertures on a component backside, creating a vacuum in a mold chase, and engaging the component backside with a mold compound in the mold chase. The one or more apertures form an aperture structure. The aperture structure may include multiple apertures parallel or orthogonal to each other. The apertures have an aperture width, aperture depth, and aperture pitch. These characteristics may be altered to minimize the likelihood of trapped air remaining after creating the vacuum in the mold chase.Type: ApplicationFiled: March 17, 2020Publication date: October 22, 2020Applicant: Western Digital Technologies, Inc.Inventors: Junrong Yan, Chee Keong Chin, Xin Lu
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Patent number: 10483239Abstract: A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.Type: GrantFiled: February 28, 2018Date of Patent: November 19, 2019Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.Inventors: Junrong Yan, Xiaofeng Di, Harjashan Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu, Jian Bin Gu
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Patent number: 10418334Abstract: A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.Type: GrantFiled: June 22, 2017Date of Patent: September 17, 2019Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.Inventors: Hang Zhang, Weili Wang, Junrong Yan, Kim Lee Bock, Chee Keong Chin, Chong Un Tan, Xin Tian
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Patent number: 10283485Abstract: A semiconductor device is disclosed including semiconductor die stacked in a stepped, offset configuration, where die bond pads of semiconductor die on different levels are interconnected using one or more conductive bumps.Type: GrantFiled: June 8, 2017Date of Patent: May 7, 2019Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.Inventors: Junrong Yan, Xiaofeng Di, Chee Keong Chin, Kim Lee Bock, Mingxia Wu
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Publication number: 20180337161Abstract: A semiconductor device is disclosed including semiconductor die stacked in a stepped, offset configuration, where die bond pads of semiconductor die on different levels are interconnected using one or more conductive bumps.Type: ApplicationFiled: June 8, 2017Publication date: November 22, 2018Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.Inventors: Junrong Yan, Xiaofeng Di, Chee Keong Chin, Kim Lee Bock, Mingxia Wu
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Patent number: 10128218Abstract: A semiconductor device is disclosed that is formed with die bond pads at an edge of the semiconductor die. The die bond pads may be formed partially in a kerf area between semiconductor die on a wafer. When the wafer is diced, the die bond pads are severed along their length, leaving a portion of the die bond pads exposed at an edge of the diced semiconductor die. Having die bond pads at the edge of the die minimizes the offset between die when stacked into a package.Type: GrantFiled: June 22, 2017Date of Patent: November 13, 2018Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.Inventors: Junrong Yan, Chee Keong Chin, Chong Un Tan, Ming Xia Wu, Kim Lee Bock, Shrikar Bhagath
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Publication number: 20180190621Abstract: A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.Type: ApplicationFiled: February 28, 2018Publication date: July 5, 2018Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.Inventors: Junrong Yan, Xiaofeng Di, Harjashan Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu, Jian Bin Gu
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Publication number: 20180174983Abstract: A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.Type: ApplicationFiled: June 22, 2017Publication date: June 21, 2018Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.Inventors: Hang Zhang, Weili Wang, Junrong Yan, Kim Lee Bock, Chee Keong Chin, Chong Un Tan, Xin Tian
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Publication number: 20180175006Abstract: A semiconductor device is disclosed that is formed with die bond pads at an edge of the semiconductor die. The die bond pads may be formed partially in a kerf area between semiconductor die on a wafer. When the wafer is diced, the die bond pads are severed along their length, leaving a portion of the die bond pads exposed at an edge of the diced semiconductor die. Having die bond pads at the edge of the die minimizes the offset between die when stacked into a package.Type: ApplicationFiled: June 22, 2017Publication date: June 21, 2018Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.Inventors: Junrong Yan, Chee Keong Chin, Chong Un Tan, Ming Xia Wu, Kim Lee Bock, Shrikar Bhagath
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Patent number: 8946878Abstract: An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.Type: GrantFiled: December 6, 2007Date of Patent: February 3, 2015Assignee: STATS ChipPAC Ltd.Inventors: Chee Keong Chin, Jae Hak Yee, Yu Feng Feng, Frederick Cruz Santos
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Patent number: 8901439Abstract: An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.Type: GrantFiled: August 18, 2006Date of Patent: December 2, 2014Assignee: STATS ChipPAC Ltd.Inventors: Chee Keong Chin, Yu Feng Feng, Guo Qiang Shen
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Patent number: 8541886Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a stacking carrier having a cavity; placing a base integrated circuit in the cavity, the base integrated circuit having a base interconnect facing the cavity; mounting a stack integrated circuit to the base integrated circuit; and picking the stack integrated circuit mounted to the base integrated circuit out of the stacking carrier.Type: GrantFiled: March 9, 2010Date of Patent: September 24, 2013Assignee: STATS ChipPAC Ltd.Inventor: Chee Keong Chin
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Patent number: 8288860Abstract: An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a base contact pad on and adjacent to a second end of the base package for connection to an electrical interconnect.Type: GrantFiled: September 9, 2008Date of Patent: October 16, 2012Assignee: Stats Chippac Ltd.Inventors: Chee Keong Chin, Yu Feng Feng, Wen Bin Qu
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Patent number: 8242607Abstract: A method of manufacture of an integrated circuit package system comprises: providing a first integrated circuit die; attaching a second integrated circuit die over the first integrated circuit die and offset from the first integrated circuit die in substantially one dimension; forming an interdie layer over the second integrated circuit die; attaching a third integrated circuit die over the interdie layer and substantially aligned to the second integrated circuit die; and attaching a fourth integrated circuit die over the third integrated circuit die and offset from the third integrated circuit die in substantially the same magnitude and substantially the opposite direction as the second integrated circuit die to the first integrated circuit die.Type: GrantFiled: December 4, 2007Date of Patent: August 14, 2012Assignee: Stats Chippac Ltd.Inventor: Chee Keong Chin
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Patent number: 8138017Abstract: A method of manufacture of an integrated circuit package system includes: providing a package substrate; mounting a first integrated circuit die, having through silicon vias, on the package substrate; coupling cylindrical studs to the package substrate adjacent to the first integrated circuit die; and mounting a second integrated circuit die, having through silicon vias, on the first integrated circuit die and the cylindrical studs for forming an electrical connection among the second integrated circuit die, the first integrated circuit die, the package substrate, or a combination thereof.Type: GrantFiled: December 21, 2010Date of Patent: March 20, 2012Assignee: Stats Chippac Ltd.Inventor: Chee Keong Chin