Patents by Inventor Che-Han Jerry Li

Che-Han Jerry Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System in package (SIP)
    Patent number: 10629507
    Abstract: A system in package is described comprising a substrate having a top side and a bottom side, having redistribution layers therein, and having a cavity extending partially into the top side of the substrate. At least one passive component is mounted on the top side of the substrate and into the cavity and embedded in a first molding compound. At least one silicon die is mounted on the bottom side of the substrate and embedded in a second molding compound wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. Solder balls are mounted through openings in the second molding compound to the redistribution layers wherein the solder balls provide package output.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: April 21, 2020
    Assignee: Dialog Semiconductor (UK) Limited
    Inventors: Che-Han Jerry Li, Jesus Mennen Belonio, Jr., Ernesto Gutierrez, III, Shou Cheng Eric Hu