Patents by Inventor Chein-Hsun Wang
Chein-Hsun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133745Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.Type: ApplicationFiled: October 19, 2022Publication date: April 25, 2024Inventors: Chein-Hsun WANG, Ming LE, Tung-Yang LEE, Yu-Chih LIANG, Wen-Chie HUANG, Chen-Tang HUANG, Jenping KU
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Patent number: 11918387Abstract: An infant care apparatus includes a piezoelectric sensor and an infrared array sensor. The piezoelectric sensor senses a respiration rate and a heart rate of an infant. The infrared array sensor senses a body temperature and an occupancy state of the infant in a non-contact manner. The abovementioned infant care apparatus can assist in determining an abnormality of the respiration rate and the heart rate of the infant based on the occupancy state of the infant output by the infrared array sensor, so as to reduce a false alarm rate.Type: GrantFiled: December 4, 2020Date of Patent: March 5, 2024Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.Inventors: Chein-Hsun Wang, Chun-Chiang Chen, Wen-Chie Huang, Ming Le
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Patent number: 11808633Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.Type: GrantFiled: August 16, 2021Date of Patent: November 7, 2023Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.Inventors: Chein-Hsun Wang, Da-Jun Lin, Chun-Chiang Chen, Chih-Yung Tsai, Yu-Chih Liang, Ming Le, Chen-Tang Huang, Tung-Yang Lee, Jenping Ku
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Publication number: 20230349768Abstract: A temperature sensor device for a power distribution panel includes a Power over Ethernet (PoE) interface, a DC-to-DC step down converter, at least one infrared temperature sensor array, a microcontroller and a communication interface. The PoE interface is used to obtain a required power supply from the Ethernet network. The DC-to-DC step down converter steps down the power supply from a first voltage to a second voltage. The infrared temperature sensor array receives infrared rays radiated from a monitored area of the power distribution panel and generates a corresponding sensation signal. The microcontroller receives the sensation signal and generates an alert signal when the sensed temperature of the monitored area exceeds a preset threshold. The threshold can be dynamically adjusted according to time of day or day of months. The communication interface enables the communication between an external electronic device and the temperature sensor device for the power distribution panel.Type: ApplicationFiled: April 27, 2023Publication date: November 2, 2023Inventors: Chun-Chiang Chen, Chein-Hsun Wang, Chen-Tang Huang, Jenping Ku
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Publication number: 20230047601Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.Type: ApplicationFiled: August 16, 2021Publication date: February 16, 2023Inventors: Chein-Hsun WANG, Da-Jun LIN, Chun-Chiang CHEN, Chih-Yung TSAI, Yu-Chih LIANG, Ming LE, Chen-Tang HUANG, Tung-Yang LEE, Jenping KU
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Publication number: 20220341789Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.Type: ApplicationFiled: May 20, 2021Publication date: October 27, 2022Inventors: Wen-Chie HUANG, Yu-Chih LIANG, Chein-Hsun WANG, Ming LE, Chen-Tang HUANG, Chein-Hsing YU, Tung-Yang LEE, Jenping KU
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Patent number: 11480471Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.Type: GrantFiled: December 21, 2020Date of Patent: October 25, 2022Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.Inventors: Jenping Ku, Chein-Hsun Wang, Chein-Hsing Yu, Wen-Chang Yu
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Publication number: 20220316951Abstract: An infrared temperature sensor comprises a thermopile sensor and an infrared reflector, wherein the infrared reflector reflects the infrared ray radiated by a target to a first thermopile sensing element of the thermopile sensor to sense the temperature of the target. By appropriately designing the reflecting surface of the infrared reflector, a horizontal viewing angle of a sensing range of the infrared temperature sensor can be larger, while a vertical viewing angle is smaller. The thermopile sensor further comprises a second thermopile sensing element, which can sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by the temperature variation of the package structure, which results from the variation of the environmental temperature. Thus, the measurement accuracy is increased.Type: ApplicationFiled: June 3, 2021Publication date: October 6, 2022Inventors: Ming LE, Jenping KU, Chein-Hsun WANG, Yu-Chih LIANG
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Patent number: 11408781Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.Type: GrantFiled: June 14, 2019Date of Patent: August 9, 2022Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.Inventors: Chein-Hsun Wang, Ming Le, Yu-Chih Liang, Tung Yang Lee, Chih-Yung Tsai
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Publication number: 20220125391Abstract: An infant care apparatus includes a piezoelectric sensor and an infrared array sensor. The piezoelectric sensor senses a respiration rate and a heart rate of an infant. The infrared array sensor senses a body temperature and an occupancy state of the infant in a non-contact manner. The abovementioned infant care apparatus can assist in determining an abnormality of the respiration rate and the heart rate of the infant based on the occupancy state of the infant output by the infrared array sensor, so as to reduce a false alarm rate.Type: ApplicationFiled: December 4, 2020Publication date: April 28, 2022Inventors: Chein-Hsun WANG, Chun-Chiang CHEN, Wen-Chie HUANG, Ming LE
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Publication number: 20220113203Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.Type: ApplicationFiled: December 21, 2020Publication date: April 14, 2022Inventors: Jenping Ku, Chein-Hsun Wang, Chein-Hsing Yu, Wen-Chang Yu
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Publication number: 20210364359Abstract: An infrared temperature sensor comprises a thermopile sensing chip. The thermopile sensing chip includes a chip substrate, a thermopile sensing unit, a heater and a temperature sensing element. The thermopile sensing unit is disposed on the chip substrate, receives infrared thermal radiation from a target and outputs a corresponding infrared sensation signal. The heater is disposed on the chip substrate and used to heat the chip substrate to a working temperature. The temperature sensing element is disposed on the chip substrate, senses the working temperature of the chip substrate and outputs a corresponding working temperature signal. In operation, the infrared temperature sensor can maintain the thermopile sensing unit at the preset working temperature. Thereby, a single-point temperature calibration is sufficient to obtain more accurate measurement results in a broad environmental temperature range.Type: ApplicationFiled: July 9, 2020Publication date: November 25, 2021Inventors: Chein-Hsun WANG, Chen-Tang HUANG, Yu-Chih LIANG, Jenping KU
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Publication number: 20200249101Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.Type: ApplicationFiled: June 14, 2019Publication date: August 6, 2020Inventors: Chein-Hsun WANG, Ming LE, Yu-Chih LIANG, Tung Yang LEE, Chih-Yung TSAI
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Patent number: 10303915Abstract: An ultrasonic biometric sensor comprises a detection chip. The detection chip includes a substrate, an ultrasonic transducer array and a control circuit. The ultrasonic transducer array is arranged on the substrate, including a plurality of arrayed piezoelectric elements. Each piezoelectric element is disposed on a floating membrane. The floating membrane is suspended in the opening side of a cavity by at least one support arm extending transversely. The control circuit is also arranged on the substrate and electrically connected with each piezoelectric element through the support arm to control the ultrasonic transducer array to generate an ultrasonic signal and read the reflected ultrasonic signal received by the ultrasonic transducer array. The ultrasonic biometric sensor is easy to fabricate and has a high yield.Type: GrantFiled: January 8, 2018Date of Patent: May 28, 2019Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.Inventors: Chein-Hsun Wang, Wen-Chie Huang
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Patent number: 10060072Abstract: A dryer includes a cylinder, a heater, a motor, a temperature sensor and a controller. The heater heats air and delivers the heated air into the cylinder. The motor is used to drive the cylinder to rotate. The temperature sensor includes a thermopile array sensor and a signal processor. The thermopile array sensor is used to sense an infrared light radiated from clothing and output a sensing signal. The signal processor is used to process the sensing signal to obtain at least one of a temperature distribution uniformity and an average temperature of the clothing, and output a control signal according to the at least one of the temperature distribution uniformity and the average temperature of the clothing. The controller determines to stop the drying schedule according to the control signal. The above-mentioned dryer can stop the drying schedule automatically, so as to save energy.Type: GrantFiled: April 10, 2017Date of Patent: August 28, 2018Assignee: Oriental System Technology Inc.Inventors: Chen-Tang Huang, Chein-Hsun Wang, Chein-Hsing Yu, Jenping Ku, Ming-Tsung Yang
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Publication number: 20180211081Abstract: An ultrasonic biometric sensor comprises a detection chip. The detection chip includes a substrate, an ultrasonic transducer array and a control circuit. The ultrasonic transducer array is arranged on the substrate, including a plurality of arrayed piezoelectric elements. Each piezoelectric element is disposed on a floating membrane. The floating membrane is suspended in the opening side of a cavity by at least one support arm extending transversely. The control circuit is also arranged on the substrate and electrically connected with each piezoelectric element through the support arm to control the ultrasonic transducer array to generate an ultrasonic signal and read the reflected ultrasonic signal received by the ultrasonic transducer array. The ultrasonic biometric sensor is easy to fabricate and has a high yield.Type: ApplicationFiled: January 8, 2018Publication date: July 26, 2018Inventors: Chein-Hsun Wang, Wen-Chie Huang
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Publication number: 20180119331Abstract: A dryer includes a cylinder, a heater, a motor, a temperature sensor and a controller. The heater heats air and delivers the heated air into the cylinder. The motor is used to drive the cylinder to rotate. The temperature sensor includes a thermopile array sensor and a signal processor. The thermopile array sensor is used to sense an infrared light radiated from clothing and output a sensing signal. The signal processor is used to process the sensing signal to obtain at least one of a temperature distribution uniformity and an average temperature of the clothing, and output a control signal according to the at least one of the temperature distribution uniformity and the average temperature of the clothing. The controller determines to stop the drying schedule according to the control signal. The above-mentioned dryer can stop the drying schedule automatically, so as to save energy.Type: ApplicationFiled: April 10, 2017Publication date: May 3, 2018Inventors: Chen-Tang Huang, Chein-Hsun Wang, Chein-Hsing Yu, Jenping Ku, Ming-Tsung Yang
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Patent number: 9740908Abstract: A capacitive fingerprint sensor includes a plate, a frame, a capacitive fingerprint sensor chip and a package body. The plate comprises a first surface, an opposite second surface and a plurality of first conductive pads arranged on the first surface. A plurality of second conductive pads and third conductive pads are respectively arranged on opposite surfaces of the frame, wherein the second conductive pads are electrically connected with the corresponding first conductive pads and third conductive pads. The capacitive fingerprint sensor chip is disposed at the central area of the frame by a flip chip manner and electrically connected with the first conductive pads. The package body is filled in the central area of the frame to cover the chip. The above-mentioned sensor has a flat sensing surface with wear resistance and better ESD toleration. A package method of the above-mentioned sensor is also disclosed.Type: GrantFiled: November 9, 2015Date of Patent: August 22, 2017Assignee: CONTEK LIFE SCIENCE CO., LTD.Inventors: Chein-Hsun Wang, Yen Ju Lo
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Patent number: 9697410Abstract: A capacitive fingerprint sensor includes a compensation memory which stores a direct current offset parameter and a gain compensation parameter of each sensing unit of a capacitive sensing array. Therefore, the above-mentioned capacitive fingerprint sensor is able to individually compensate sensing signals measured by each the sensing unit and the sensing signals measured by each sensing unit have better uniformity and signal to noise ratio (SNR).Type: GrantFiled: February 23, 2016Date of Patent: July 4, 2017Assignee: CONTEK LIFE SCIENCE CO., LTD.Inventors: Yen Ju Lo, Chein-Hsun Wang, Dai-Chi Wu
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Publication number: 20170161539Abstract: A capacitive fingerprint sensor includes a compensation memory which stores a direct current offset parameter and a gain compensation parameter of each sensing unit of a capacitive sensing array. Therefore, the above-mentioned capacitive fingerprint sensor is able to individually compensate sensing signals measured by each the sensing unit and the sensing signals measured by each sensing unit have better uniformity and signal to noise ratio (SNR).Type: ApplicationFiled: February 23, 2016Publication date: June 8, 2017Inventors: Yen Ju LO, Chein-Hsun WANG, Dai-Chi WU