Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: An electronic device including a main body, a supporting layer and at least one press element is provided. The main body has an inner space. The supporting layer is disposed on the main body and covers the inner space, wherein the supporting layer has at least one first opening. The press element is disposed on the supporting layer and has a chamber and at least one second opening, wherein the first opening and the second opening are connected to the chamber. When the press element is pressed and elastically deformed, air inside the chamber flows to the inner space through the first opening. When the press element is stopped being pressed and restored, air outside the chamber flows to inside the chamber through the second opening. In addition, a heat dissipation method adapted to the electronic device is also provided.

Abstract: An electronic device including a main body, a supporting layer and at least one press element is provided. The main body has an inner space. The supporting layer is disposed on the main body and covers the inner space, wherein the supporting layer has at least one first opening The press element is disposed on the supporting layer and has a chamber and at least one second opening, wherein the first opening and the second opening are connected to the chamber. When the press element is pressed and elastically deformed, air inside the chamber flows to the inner space through the first opening. When the press element is stopped being pressed and restored, air outside the chamber flows to inside the chamber through the second opening. In addition, a heat dissipation method adapted to the electronic device is also provided.

Abstract: A fan speed control method for a computer system is disclosed. The computer system includes a Central Processing Unit (CPU), a Voltage Regulator Module (VRM) and at least one computer fan. The VRM is disposed near the CPU, to provide electrical power required by the CPU. The method includes steps of disposing a thermal sensor near the VRM to detect an ambient temperature of the VRM; and controlling speed of the at least one computer fan according to the ambient temperature.