Patents by Inventor Chel Woo Park

Chel Woo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and fabricating method thereof
    Patent number: 11961797
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20220130752
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: September 8, 2021
    Publication date: April 28, 2022
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • Semiconductor package and fabricating method thereof
    Patent number: 11121071
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: September 14, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20200350241
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: March 9, 2020
    Publication date: November 5, 2020
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • Semiconductor package and fabricating method thereof
    Patent number: 10586761
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: March 10, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20180096928
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • Semiconductor package and fabricating method thereof
    Patent number: 9859203
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: January 2, 2018
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20160225692
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: April 23, 2015
    Publication date: August 4, 2016
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park