Abstract: A semiconductor package structure includes a semiconductor package structure includes a first supporting bar, a second supporting bar and an encapsulant. The second supporting bar is adjacent to the first supporting bar. The first supporting bar and the second supporting bar extend substantially along a first direction. The encapsulant covers the first supporting bar and the second supporting bar. The encapsulant defines a first recess and a second recess recessed from a lower surface of the encapsulant. The first recess extends substantially along a second direction different from the first direction. The second recess is located between the first recess and the second supporting bar.

Abstract: An illumination system including a first light source device, a light guide device, a light splitting device, and a light converging element is provided. The first light source device provides first, second, and third light beams and a first compensation light beam. The light guide device reflects the first, second, and third light beams and the first compensation light beam. The light splitting device includes a first half reflecting element configured to reflect a part of a light beam and being pervious to another part of the light beam. The light converging element receives first and second combined light beams formed by the first, second, and third light beams and the first compensation light beam, where distances between light spots formed on the light converging element by the first and second combined light beams and a central axis of the light converging element are identical and greater than zero.

Abstract: Disclosed herein is a method of quantifying a mutant allele burden of a target gene in a subject. The method includes providing a first plasmid that includes a mutant allele sequence and an internal control sequence, and a second plasmid that includes a wild-type allele sequence and the internal control sequence, and subjecting DNA of the subject to quantitative polymerase chain reaction to measure a mutant allele expression level of the target gene, so as to determine the mutant allele burden of the target gene in the subject based on a standard curve of the mutant allele burden of the target gene created by serial dilution of the first and second plasmids.

Abstract: A testing system for an image processing algorithm including a control unit, an image processing device, an image processing hardware, and a testing device is disclosed. The control unit provides an original image and parameters. The image processing device obtains the original image and the parameters, and drives the image processing hardware to perform a first image processing procedure to the original image based on the parameters to generate a hardware-processed image. The testing device obtains the original image, the parameters, and the hardware-processed image, and performs, through a simulation software, a second image processing procedure to the original image based on the parameters to generate a software-processed image. The testing device compares the hardware-processed image with the software-processed image through a testing software to generate a comparing result that shows a pixel difference of the hardware-processed image and the software-processed image.

Abstract: A method includes forming a first metallic feature, forming a dielectric layer over the first metallic feature, etching the dielectric layer to form an opening, with a top surface of the first metallic feature being exposed through the opening, and performing a first treatment on the top surface of the first metallic feature. The first treatment is performed through the opening, and the first treatment is performed using a first process gas. After the first treatment, a second treatment is performed through the opening, and the second treatment is performed using a second process gas different from the first process gas. A second metallic feature is deposited in the opening.

Abstract: A power supply unit (PSU) housing configured to receive a PSU is disclosed. The PSU housing includes a top panel, a bottom panel opposite to the top panel, a first side panel, a second side panel opposite to the first side panel, and a PSU cover. The first side panel and the second side panel define a width of the PSU housing. The PSU cover extends along the width of the PSU housing. The PSU cover includes a first elongated plate and a second elongated plate, which are perpendicular to each other. The PSU cover is rotatable relative to the top panel, such that (i) in a first orientation, the first elongated plate of the PSU cover is above and parallel to the top panel, and (ii) in a second orientation, the second elongated plate of the PSU cover is about flush and parallel to the top panel.

Abstract: A diode array includes a substrate and a plurality of light emitting diodes disposed on the substrate and arranged in an array. Each of the light emitting diodes includes a stack of functional layers includes a first semiconductor layer, a second semiconductor layer, and a light emitting layer located between the first semiconductor layer and the second semiconductor layer. At least one of the light emitting diodes includes a first current limiting region covering at least a portion of the first semiconductor layer, the light emitting layer or the second semiconductor layer; a first electrode electrically connected to the first semiconductor layer; and a second electrode electrically connected to the second semiconductor layer, wherein the first electrode and the second electrode are disposed at the same side of the first semiconductor layer.

Abstract: A semiconductor package structure includes a semiconductor package structure includes a first supporting bar, a second supporting bar and an encapsulant. The second supporting bar is adjacent to the first supporting bar. The first supporting bar and the second supporting bar extend substantially along a first direction. The encapsulant covers the first supporting bar and the second supporting bar. The encapsulant defines a first recess and a second recess recessed from a lower surface of the encapsulant. The first recess extends substantially along a second direction different from the first direction. The second recess is located between the first recess and the second supporting bar.

Abstract: A signal receiver and a signal transceiver are provided, which may avoid unnecessary leakage current. The signal receiver includes a termination switch pair, a first resistor, a second resistor, and a pull-down circuit. The termination switch pair receives an operation power supply. The termination switch pair has a common control end. The first resistor is coupled between a first signal input end and the common control end. The second resistor is coupled between a second signal input end and the common control end. The pull-down circuit is coupled between the common control end and a reference voltage end. The pull-down circuit determines whether to pull down a first control voltage on the common control end to a reference voltage according to a power-on state or a power-off state of the signal receiver.

Abstract: A light source module and a projection apparatus comprising the same are provided. The light source module comprises a light source unit, a light splitting element, and a condenser lens. The light source unit is configured to provide first color light beams including a first sub-light beam and a third sub-light beam, and second color light beams including a second sub-light beam and a fourth sub-light beam. The light source unit comprises a first light source unit to provide the first and second sub-light beams, and a second light source unit to provide the third and fourth sub-light beams. One of the first sub-light beam and the third sub-light beam is transmitted to the condenser lens after being reflected by the light splitting element, and the other of the first sub-light beam and the third sub-light beam is transmitted to the condenser lens after passing through the light splitting element.

Abstract: The disclosure provides a projection system and a projection method. The projection system includes a projection device. The projection device includes a projection module, a controller, and an audio player. The controller is coupled to the projection module. The audio player is coupled to the controller. When the controller executes the prepare-for-sleep mode, the controller operates the projection module to dim a projection beam or to project a predetermined projection image and operates the audio player to play a predetermined sound.

Abstract: A diode array is provided. The diode array includes a substrate and a plurality of light emitting diodes disposed on the substrate and arranged in an array, wherein each of the light emitting diodes includes a stack of functional layers comprising a first type semiconductor layer, a second type semiconductor layer, and a light emitting layer located between the first type semiconductor layer and the second type semiconductor layer, wherein at least one of the light emitting diodes includes: a first current limiting region abutting a vertically extending boundary of the second semiconductor layer; wherein, with respect to a top down view, the first current limiting region is formed about an outer edge of the light emitting diode and an outer perimeter of the first current limiting region is equal to or less than 400 micrometers (?m).

Abstract: A light emitting-diode (LED) display device is provided. The display device comprises plural pixels arranged in array and each pixel includes at least one LED chip. The LED chip is disposed at a cavity of a black matrix (BM) layer and electrical connected to a transistor of a circuit substrate, wherein the transistor is below the BM layer.

Abstract: An adjusting module and a projector are provided. The adjusting module includes a frame, an optical assembly, an elastic assembly and an adjusting member. The optical assembly is fixed to the elastic assembly. The elastic assembly is detachably assembled on the frame, and includes a fixing portion, a first elastic portion and a second elastic portion. The fixing portion is fixed to the optical assembly. The first and second elastic portions respectively include first and second hooks and first and second elastic arms. The first and second elastic arms are respectively connected to the fixing portion, and the first and second hooks are respectively assembled to the frame. The adjusting member penetrates through the through hole and leans against the optical assembly. When the adjusting member is adjusted, the optical assembly is displaced relative to the frame in a plane perpendicular to an incident optical axis.

Abstract: A wireless disinfection device, comprising a housing with a grip hole and a through hole. A spraying unit is fitted to the through hole. An air-intake motor, a liquid delivery tube, a nozzle unit and a liquid storage unit are disposed within the housing. A first tube end of the nozzle unit is connected to the spraying unit. A second tube end of the nozzle unit is connected to an air outlet tube of the air-intake motor. A third tube end of the nozzle unit is fitted downwardly to the liquid storage unit. The liquid delivery tube extends from the liquid storage unit and enters into the nozzle unit. The spraying unit includes a nozzle structure. After the air-intake motor is driven, the air can be blown into the nozzle unit such that each tube end of the nozzle unit generates an airflow pressure difference, thereby shooting an disinfecting liquid in the liquid storage unit to a first spray end of the nozzle structure located outside the nozzle orifice.

Abstract: A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.

Abstract: A method comprises depositing a protection layer over a first substrate, wherein the first substrate is part of a first semiconductor die, forming an under bump metallization structure over the protection layer, forming a connector over the under bump metallization structure, forming a first dummy plane along a first edge of a top surface of the first semiconductor die and forming a second dummy plane along a second edge of the top surface of the first semiconductor die, wherein the first dummy plane and the second dummy plane form an L-shaped region.

Abstract: A system is disclosed that is configured to secure a connection between a component and at least one wire, such as an antenna, within a computer. The system includes a retainer configured to move between a first position and a second position. The retainer in the first position is configured to secure a connection between at least one connector of the component and the at least one wire within the computer. The retainer in the second position is configured to permit release of the connection between the at least one connector of the component and the at least one wire within the computer, such as by providing access to the connection.

Abstract: The present invention provides a method for manufacturing a water-in-oil-in-water multiple emulsion, comprising: (a) mixing an active component with an internal aqueous phase to form a homogenized mixture; (b) mixing the homogenized mixture with an oleaginous phase to form a water-in-oil emulsion; and (c) mixing the water-in-oil emulsion with an external aqueous phase to form the water-in-oil-in-water multiple emulsion, wherein the external aqueous phase comprises water and an excipient, and wherein the excipient comprises a whey protein concentrate and a modified starch.

Abstract: Techniques and systems are provided for processing image data. A first image having a first resolution can be obtained. In some aspects, the first image is generated based on a pixel binning process. A second image can be obtained having a second resolution that is greater than the first resolution. In some aspects, the second image is generated based on a remosaicing process. One or more weight maps can be generated based on characteristics determined based on pixels of the first image, pixels of the second image, or pixels of both the first image and the second image. A fused image can be generated based on the one or more weight maps that includes a first set of pixels from the first image and a second set of pixels from the second image.