Abstract: The embodiment of the disclosure provides a method for training a pattern enhancing model and an electronic device. The method includes: reading a first pattern with a defect via a pattern reader, and determining whether the pattern reader reads successfully; if a reading is successful, performing a pattern reconstruction operation based on pattern information of the read first pattern to obtain a second pattern; training the pattern enhancing model based on the first pattern and the second pattern as a training data set.

Abstract: An optical pickup head is provided, which includes a silicon substrate, in which an aperture and an objective lens are disposed on the silicon substrate; and a laser diode (LD), a 135-degree tilted reflector, and a 135-degree tilted holographic reflector are disposed on the silicon substrate. The two 135-degree tilted reflectors and a holographic optical element (HOE) are fabricated on a slant face structure of an optical platform using a semiconductor process, so all the elements are disposed at a straight zone, and then in combination with bonding of the LD and an optical sensor element, an miniaturization objective is achieved and an optical path is shortened.

Abstract: An optical pickup head is provided, which includes a silicon substrate, in which an aperture and an objective lens are disposed on the silicon substrate; and a laser diode (LD), a 135-degree tilted reflector, and a 135-degree tilted holographic reflector are disposed on the silicon substrate. The two 135-degree tilted reflectors and a holographic optical element (HOE) are fabricated on a slant face structure of an optical platform using a semiconductor process, so all the elements are disposed at a straight zone, and then in combination with bonding of the LD and an optical sensor element, an miniaturization objective is achieved and an optical path is shortened.

Abstract: A three-dimensional oblique microstructure with press down and engagement mechanisms. A pair of corresponding first lugs is disposed on the both sides of the oblique body, and the bottom part of the oblique body has a first push pad. A pair of corresponding second lugs respectively disposed on the inner sides of the two supports of the ?-shaped supporting rack, a second push pad is disposed on the bottom part of the U-shaped supporting rack. Thus, by pressing down the first and the second push pad, the oblique body rotates through the first twist bar and the U-shaped supporting rack rotates through the second twist bar so as to engage the first lugs with the second lugs, such that the three-dimensional microstructures with different angles can be packed to satisfy the needs of varied optical platform applications, and simplify semiconductor fabrication for higher production efficiency and product yield.