Abstract: A manufacturing method of a circuit board comprises the following steps. Firstly, provide a first core layer, a second core material layer, and a central dielectric material layer. Secondly, press the first core layer, the second core material layer, and the central dielectric material layer to form a composite circuit structure. Thirdly, removing a portion of the central dielectric material layer located at a periphery of a pre-removing area and a portion of the second core material layer located at the periphery of the pre-removing area. Finally, remove a portion of the central dielectric material layer located within the pre-removing area and a portion of the second core material layer located within the pre-removing area to form a central dielectric layer and a second core layer.

Abstract: A lighting system includes a carrier unit, and a lamp holder including a holder plate for mounting of a light emitting unit, and a first positioning plate and a second positioning plate extending from the holder plate and spaced apart from each other. The holder plate is disposable at a first or second position when the first or second positioning plate is connected to the carrier unit. A light emitting characteristic of the light emitting unit when the holder plate is in the first position is different from a light emitting characteristic of the light emitting unit when the holder plate is in the second position.

Abstract: A method comprises: accessing data representing a layout of a layer of an integrated circuit (IC) comprising a plurality of polygons defining circuit patterns to be divided among a number (N) of photomasks for multi-patterning a single layer of a semiconductor substrate, where N is greater than one. For each set of N parallel polygons in the layout closer to each other than a minimum separation for patterning with a single photomask, at least N?1 stitches are inserted in each polygon within that set to divide each polygon into at least N parts, such that adjacent parts of different polygons are assigned to different photomasks from each other. Data representing assignment of each of the parts in each set to respective photomasks are stored in a non-transitory, computer readable storage medium that is accessible for use in a process to fabricate the N photomasks.

Abstract: Aspects of the present disclosure relate to methods for allowing a relay base station to more efficiently decode relay control information transmitted from a donor base station. A relay base station may determine a configuration of resource elements used for transmission of reference signals and decode sets of resource elements based on the configuration of reference signals. According to aspects, a donor base station may transmit relay control information in a data portion of a subframe based on the configuration of reference signals transmitted by the donor base station.

Abstract: An electrostrictive composite includes a flexible polymer matrix and a carbon nanotube film structure. The carbon nanotube film structure is at least partially embedded into the flexible polymer matrix through a first surface. The carbon nanotube film structure includes a plurality of carbon nanotubes combined by van der Waals attractive force therebetween.

Abstract: A reticle and a method of fabricating the reticle are provided. In various embodiments, the reticle includes a substrate, a patterned first attenuating layer, a patterned second attenuating layer, and a patterned third attenuating layer. The patterned first attenuating layer is disposed on the substrate. The patterned second attenuating layer is disposed on the patterned first attenuating layer. The patterned third attenuating layer is disposed on the patterned second attenuating layer. A first part of the patterned first attenuating layer, a first part of patterned second attenuating layer, and the patterned third attenuating layer are stacked on the substrate as a binary intensity mask portion.

Abstract: Techniques are described for wireless communications utilizing multiple clear channel assessment (CCA) procedures for access to a radio frequency spectrum band. A first CCA procedure is performed to determine availability of the radio frequency spectrum band and to contend for use of the radio frequency spectrum band among a number of coordinated operators transmitting on the radio frequency spectrum band. A successful first CCA procedure results in winning the contention for the radio frequency spectrum band for a transmission period that is coordinated among the number of coordinated operators. Upon the successful first CCA procedure, a second CCA procedure is performed during a discontinuous transmission (DTX) period in the transmission period to determine continued availability of the radio frequency spectrum band. The timing of the DTX periods is determined based on timing of radio transmissions having priority use of the radio frequency spectrum band.

Abstract: A heat-dissipation unit with heat-dissipation microstructure and method of manufacturing the same is disclosed. The heat-dissipation unit with heat-dissipation microstructure includes a main body internally defining a chamber; a wick structure formed on an inner surface of the chamber; and at least a SiO2 nano thin film coated on the wick structure. The SiO2 nano thin film is formed of a plurality of SiO2 nanograins, and is coated on the wick structure of the heat-dissipation unit through the sol-gel process. With the at least one layer of SiO2 nano thin film coated on the wick structure, it is able to upgrade the heat dissipation performance of the heat-dissipation unit.

Abstract: Disclosed is a miniature moving-coil speaker comprising a magnetic circuit system, a vibration system, and an auxiliary system for fixing the magnetic circuit system and the vibration system. The vibration system comprises a diaphragm and a voice coil integrated with the diaphragm. The auxiliary system comprises a plastic enclosure. The diaphragm is installed correspondingly at one end face of the enclosure, while the magnetic circuit system is installed at the other end face of the enclosure opposite the diaphragm; also: a flexible circuit board is arranged on the end face of the enclosure where the magnetic circuit system is installed, and the voice coil is electrically connected to the flexible circuit board. The design reduces product installation height, while at the same time facilitates wire-leading and wire-combing for the miniature moving-coil speaker, and simplifies product design.

Abstract: An electronic device may have a display such as a liquid crystal display. A color filter layer may be formed on a display layer such as a transparent substrate layer of the display. The color filter layer may include an array of color filter elements on an inner surface of the transparent substrate layer. The color filter layer may include opaque masking material. In an inactive portion of the display, the opaque masking material may be formed over the color filter elements and interposed between the color filter elements. In the inactive portion of the display, the opaque masking material and the color filter elements may form a ring that serves as a border region surrounding an active portion of the display. In the active portion of the display, the opaque masking layer may be patterned to from an opaque matrix that separates the color filter elements.

Abstract: Error concealment for motion picture expert group (MPEG) decoding with personal video recording functionality. Error concealment of MPEG data may take place within various components within playback, recording, reading and writing data systems. The error concealment may be provided within existing systems whose components may not be capable of accommodating errors within MPEG data. In certain embodiments, the available data that contain no errors is maximized to conceal those portions of the data that do include errors.

Abstract: The present invention relates to solvent/cleaner and heat transfer fluid compositions comprising at least one hydrochlorofluoroolefin (HCFO), 1-chloro-3,3,3-trifluoropropene (HCFO-1233zd), particularly the trans-isomer. The HCFO of the present invention can be used in combination with co-agents including, hydrofluorocarbons (HFCs), hydrofluoroolefins (HFOs), hydrocarbons, ethers including hydrofluoroethers (HFEs), esters, ketones, alcohols, 1,2-transdichloroethylene and mixtures thereof.

Abstract: A rear-retaining structure for dynamic hip screw (DHS) includes a retaining block and a positioning element. The dynamic hip screw comprises a lag screw, a sideplate, a sleeve with a higher orifice and a lower orifice, and a compression screw. The retaining block of the rear-retaining structure is attached to the sideplate of the dynamic hip screw by the positioning element. A stopper portion of the retaining block is located opposite to the lower orifice of the sleeve. The height of the highest point of the stopper portion in the lower orifice is in inverse proportion to the distance that the lag screw and the compression screw are allowed to slip back in the sleeve from an implant position to the lower orifice; namely, the higher the height of the highest point of the stopper portion is in the lower orifice, the smaller the distance for the slip back.

Abstract: A system and method for a distributed multi-processing security gateway establishes a host side session, selects a proxy network address for a server, uses the proxy network address to establish a server side session, receives a data packet, assigns a central processing unit core from a plurality of central processing unit cores in a multi-core processor of the security gateway to process the data packet, processes the data packet according to security policies, and sends the processed data packet. The proxy network address is selected such that a same central processing unit core is assigned to process data packets from the server side session and the host side session. By assigning central processing unit cores in this manner, higher capable security gateways are provided.

Abstract: A package includes a device die, a first plurality of redistribution lines underlying the device die, a second plurality of redistribution lines overlying the device die, and a metal pad in a same metal layer as the second plurality of redistribution lines. A laser mark is in a dielectric layer that is overlying the metal pad. The laser mark overlaps the metal pad.

Abstract: An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process.

Abstract: A method for fabricating integrated structure is disclosed. The method includes the steps of: providing a substrate; forming a through-silicon hole in the substrate; forming a patterned resist on the substrate, wherein the patterned resist comprises at least one opening corresponding to a redistribution layer (RDL) pattern and exposing the through-silicon hole and at least another opening corresponding to another redistribution layer (RDL) pattern and connecting to the at least one opening; and forming a conductive layer to fill the through-silicon hole, the at least one opening and the at least another opening in the patterned resist so as to form a through-silicon via, a through-silicon via RDL pattern and another RDL pattern in one structure.

Abstract: Meta-diarylaniline or meta-diarylpyridinamine compounds, methods for preparing the same and uses thereof in manufacture of a medicament. The compounds according to the present application have strong inhibitory activity (at nM level) against wild-type and various drug-resistant HIV viral strains, exhibit good druggability, and can be easily synthesized.

Abstract: Methods and systems are disclosed for extended erase protection for non-volatile memory (NVM) cells during embedded erase operations for NVM systems. The embodiments described herein utilize an additional threshold voltage (Vt) check after soft programming operation within an embedded erase operation completes to provide extended erase protection of NVM cells. In particular, the threshold voltages for NVM cells are compared against a threshold voltage (Vt) check voltage (VCHK) level and an additional embedded erase cycle is performed if any NVM cells are found to exceed the threshold voltage (Vt) check voltage (VCHK) level. The threshold voltage (Vt) check voltage (VCHK) level can be, for example, a voltage level that is slightly higher than an erase verify voltage (VEV) level and lower than read voltage level (VR).