Abstract: A high sensitivity flexible three-dimensional force tactile sensor includes a hemispherical contact, wherein the hemispherical contact includes a tray with a groove on the surface and a hemispherical protrusion arranged in the groove. A flexible inverted cone component connected to the lower surface of the hemispherical contact, wherein a plurality of flexible triangular excitation electrode is arranged on the side surface of the flexible inverted cone component. A flexible common electrode surrounding part of the flexible triangular excitation electrode, wherein a first cavity with an opening is opened inside the flexible common electrode, parts of the flexible triangular excitation electrode and the flexible inverted cone component are arranged in the first cavity of the flexible common electrode. The flexible triangular excitation electrode and the flexible inverted cone component have no contact with the inner wall of the first cavity of the flexible common electrode to form an air cavity.

Abstract: A process for making anti-reflective optical glass comprises the steps of: A. implementing an abrading tool including a carrier having a plurality of diamond cutting wires formed on the carrier; and B. centrifugally and resiliently abrading a substrate of optical glass by the abrading tool to form a plurality of microscopic protuberances or moth-eye like structures on the substrate to thereby reduce the light reflection from the substrate and increase the light transmission in the substrate.

Abstract: A semiconductor device is provided. The semiconductor device includes a first deep trench isolation (DTI) structure within a substrate. The first DTI structure includes a barrier structure, a dielectric structure, and a copper structure. The dielectric structure is between the barrier structure and the copper structure. The barrier structure is between the substrate and the dielectric structure.

Abstract: The present invention discloses a clustering routing optimization method based on adaptive evolutionary algorithm for a wireless sensor network, comprising following steps: performing population initialization by initial position and energy information of sensor nodes; calculating fitness values, and implementing iterative operation of elite preservation, adaptive crossover and mutation; after the iteration, selecting a cluster head; routing data packet of the cluster head to a base station. Convergence process of the evolutionary algorithm is improved by nonlinearly adjusting the probability of crossover and mutation; upper and lower bound of crossover and mutation operators are dynamically adjusted by fitness value; adding an incentive factor, adjusting the crossover and mutation probability when the fitness value tends to converge, and running the algorithm again to confirm that a new optimal value is generated.

Abstract: Systems and methods are provided for implementing inter-coded resolution-adaptive video coding supported by resizing motion information of a current frame during motion prediction, reducing extensive computational costs and computing time that would be incurred as a result of extensive application of interpolation filters to generate picture information of a reference frame to sub-pixel granularity, and thus reducing computational cost and computing time of decoding as a whole.

Abstract: A backlight keyboard includes a first keyswitch, a first backlight source, a light guide plate and a first board having first and second holes. The light guide plate is applied to the backlight keyboard and a second backlight keyboard including a second keyswitch, a second backlight source and a second board having third and fourth holes. The second keyswitch on the second backlight keyboard is shifted transversely relative to the first keyswitch on the backlight keyboard to make the first and fourth holes have a first overlapping area. The light guide plate has a first dot structure corresponding to the first and third holes and a second dot structure corresponding to the second and fourth holes except the first overlapping area for guiding light to symbols on the first and second keyswitches. The first dot structure is less than the second dot structure in dot intensity.

Abstract: A mobile cooling box has a box main body and at least one lid for opening the mobile cooling box and providing access to the inside of the mobile cooling box. The mobile cooling box further has at least one handle module located at an outer side surface of the box main body. The handle module comprises a handlebar intended to be grasped by the user, the handle module having a longitudinal axis and two ends, hangers to which the handlebar is attached at its two ends, and brackets at which the hangers are rotatably mounted. The hangers are fixed to the outer side surface of the box main body. The handlebar of the handle module can be swung out and upwards from an unactuated state to an actuated state for carrying the mobile cooling box by the handlebar Each of the brackets comprises a mounting area and a shielding area. The mounting area faces the outer side surface of the box main body to which the bracket is fixed.

Abstract: A chassis assembly includes: a chassis; a lifting connecting rod assembly arranged on the chassis; and a lifting power assembly, including a lifting bracket pivotally connected to one end of the lifting connecting rod assembly and a lifting drive mechanism arranged on the chassis and connected to the lifting bracket, wherein the lifting bracket includes a sleeve portion having a cylindrical hollow cavity; the lifting drive mechanism includes: a lead screw penetrating through the sleeve portion, a screw nut fixed to the sleeve portion and in thread fit with the lead screw, and a power output unit drivingly connected to the lead screw; and the power output unit is configured to cause the lead screw to rotate to drive the screw nut and the lifting bracket to rise or fall synchronously relative to the chassis. An automatic guided vehicle having the chassis assembly is included.

Abstract: A method for manufacturing a plurality of semiconductor structures is provided. The method includes the operations as follows. A first hybrid bonding layer is formed over a first wafer including a plurality of first memory structures. A second hybrid bonding layer is formed over a second wafer including a plurality of control circuit structures. The memory structures and the control circuit structures are in contact with the first and the second hybrid bonding layers, respectively. The first wafer and the second wafer are bonded through a first hybrid bonding operation to connect the first and the second hybrid bonding layers, thereby obtaining a first bonded wafer. At least the first wafer, the second wafer, the first hybrid bonding structure, and the second hybrid bonding structure are singulated to obtain the plurality of semiconductor structures. A method for manufacturing a system in package (SiP) is also provided.

Abstract: An automatic leveling device of a 3D printer, and a 3D printer is provided. The automatic leveling device includes a photoelectric switch, an electromagnetic assembly and a probe assembly. The photoelectric switch is arranged in a housing and defines a photosensitive groove. The electromagnetic assembly is arranged in the housing and defines a sliding hole. The probe assembly is slidably engaged in the sliding hole, and an end of the probe assembly is engaged in the photosensitive groove. The electromagnetic assembly is capable of driving the probe assembly to make the end of the probe assembly move out of the photosensitive groove. The automatic leveling device has the advantages of simple structure, low manufacturing difficulty, low production cost, simple and stable leveling mode, high detection repetition accuracy and no complex circuit and software cooperation.

Abstract: A chip package is provided. The chip package includes a substrate structure. The substrate structure includes a redistribution structure having a conductive pad. The substrate structure includes a first insulating layer under the redistribution structure. The substrate structure includes a conductive via structure passing through the first insulating layer. The conductive via structure is under and electrically connected with the conductive pad. The substrate structure includes a second insulating layer disposed between the redistribution structure and the first insulating layer. The chip package includes a first chip over the redistribution structure and electrically connected to the conductive via structure through the redistribution structure. The chip package includes a second chip under the substrate structure.

Abstract: A curved full-array LED light panel, a curved backlight module including the curved full-array LED light panel, and a curved LCD including the backlight module are disclosed. The curved full-array LED light panel includes a flexible reflective sheet and a plurality of LED light bars wherein a plurality of LEDs are disposed. The plurality of LED light bars are attached to a sheet-rear side of the flexible reflective sheet alone a direction parallel to the height direction of the full-array LED light panel, and the plurality of LEDs disposed on the LED light bars are exposed from a plurality of openings of the flexible reflective sheet toward an LCD panel. Along a direction parallel to the width direction of the full-array LED light panel, the flexible reflective sheet is deformed to form a curved reflective surface. Each of the LED light bars further comprises a bar-shaped PCB, and a plurality of LED dimming-zone circuits are disposed on the bar-shaped PCB.

Abstract: Examples of a multiple-mask multiple-exposure lithographic technique and suitable masks are provided herein. In some examples, a photomask includes a die area and a stitching region disposed adjacent to the die area and along a boundary of the photomask. The stitching region includes a mask feature for forming an integrated circuit feature and an alignment mark for in-chip overlay measurement.

Abstract: A system for display and interaction includes an interface and a processor. The interface is configured to receive data from one or more sensors. The processor is configured to convert the data to a common synthetic data space; provide the common synthetic data space for display; receive a command associated with an object represented in the common synthetic data space; and cause display of an icon indicating a command has been issued.

Abstract: An electronic apparatus and a load adjusting method thereof are provided. The method includes the following steps. Powering of an external power supply is detected. A self-power consumption time of the battery from a full capacity to a preset capacity is calculated and recorded when the powering of the external power supply is detected. A first average value of multiple self-power consumption times recorded within a preset period from a current time is calculated, and the first average value is compared with a second average value of the self-power consumption times of a previous preset period of the preset period. A value of a power limit for controlling the electronic apparatus to enter a load adjusting state is adjusted according to a comparison result.

Abstract: A computer device obtains a to-be-annotated image having a first magnification. The device obtains an annotated image from an annotated image set, the annotated image distinct from the to-be-annotated image and having a second magnification that is distinct from with the first magnification. The annotated image set includes at least one annotated image. The device matches the to-be-annotated image with the annotated image to obtain an affine transformation matrix, and generates annotation information of the to-be-annotated image according to the affine transformation matrix and the annotated image. In this way, annotations corresponding to images at different magnifications may be migrated. For example, the annotations may be migrated from the low-magnification images to the high-magnification images, thereby reducing the manual annotation amount and avoiding repeated annotations, and further improving annotation efficiency and reducing labor costs.

Abstract: The present embodiments relate to data center outage detection and alert generation. An outage detection service as described herein can process near real-time data from various sources in a datacenter and process the data using a model to determine one or more projected sources of a detected outage. The model as described herein can include one or more machine learning models incorporating a series of rules to process near-real time data and offline data and determine one or more projected sources of an outage. An alert message can be generated to provide the projected sources of the outage and other data relevant to the outage.

Abstract: A packaged ultraviolet light-emitting device includes a support member, at least one ultraviolet light-emitting chip, and an encapsulating cover. The support member has opposite top and bottom surfaces, a side surface interconnecting the top and bottom surfaces, and at least one indentation. The ultraviolet light-emitting chip is disposed on the top surface of the support member. The encapsulating cover is made from a fluorine-containing resin, and is disposed over and in contact with the ultraviolet light-emitting chip and the top surface and the indentation of the support member. The encapsulating cover extends into the indentation. A production method of the packaged ultraviolet light-emitting device is also disclosed.