Abstract: This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.

Abstract: A method of operating a memory device storing ECCs for corresponding data is provided. The method includes writing an extended ECC during a first program operation, the extended ECC including an ECC and an extended bit derived from the ECC. The method includes overwriting the extended ECC with a pre-determined state during a second program operation to indicate the second program operation. The method includes, setting the ECC to an initial ECC state before the first program operation; during the first program operation, computing the ECC, changing the ECC to the initial ECC state if the computed ECC equals the pre-determined state; and changing the extended bit to an initial value if the ECC equals the initial ECC state. The method includes reading an extended ECC including an extended bit and an ECC for corresponding data, and determining whether to enable ECC logic using the extended ECC.

Abstract: A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal cattier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer.

Abstract: A roof bow for a vehicle is provided that has a “bow-tie” shape including a central portion flanked by two triangular portions. The triangular portions are joined to right and left roof brackets that are, in turn, joined to right and left roof rails. The bow-tie roof bow may be assembled from extruded tubular parts. The bow-tie roof bow may be assembled in a clamshell structure including an upper shell and a lower shell that are joined together by welding. The roof bow may be formed in one piece as a sheet metal stamping having side portions that are wider than the central portion.

Abstract: A non-volatile memory apparatus and a data verification method thereof are provided. The non-volatile memory apparatus includes a plurality of memory cells, a page buffer, a write circuit, a sense amplifier, and a sense and compare circuit. The page buffer stores a plurality of buffered data and programs the plurality of memory cells according to the plurality of buffered data. The write circuit receives a program data or a rewrite-in data and writes the program data or the rewrite-in data to the page buffer. The sense amplifier senses data read from the memory cells for generating a read-out data. The sense and compare circuit reads the buffered data, and compares the read-out data and a compared buffered data to generate a rewrite-in data. The sense and compare circuit determines the rewrite-in data to be the buffered data or an inhibiting data according to the compared result.

Abstract: A method for forming a through wafer via hole in a semiconductor device, wherein the semiconductor device comprises a wafer having a SiC substrate with a front side and a backside, a GaN-based layer formed on the front side of the SiC substrate, and a mask structure formed on the backside of the SiC substrate defining an etching area. The etching area is first descummed A through substrate via hole is formed by etching the etching area through the SiC substrate. The mask structure is removed and the inner surface of the through substrate via hole is cleaned. The inner surface of the through substrate via hole is then descummed A through wafer via hole is formed by etching through the GaN layer in the through substrate via hole. And lastly the inner surface of the through wafer via hole is cleaned.

Abstract: Embodiments of an apparatus comprising a pixel array including a plurality of pixels formed in a substrate having a front surface and a back surface, each pixel including a photosensitive region formed at or near the front surface and extending into the substrate a selected depth from the front surface. A filter array is coupled to the pixel array, the filter array including a plurality of individual filters each optically coupled to a corresponding photosensitive region, and a vertical overflow drain (VOD) is positioned in the substrate between the back surface and the photosensitive region of at least one pixel in the array.

Abstract: An LED light source module includes a base, an LED light source positioned on the base, an optical lens located on the light path of the LED light source and a diffusion plate positioned above the optical lens. An upper surface of the base is a light reflective surface. The optical lens defines a through hole aligned with the LED light source. A reflecting body is protruded from the diffusion plate toward the through hole of the optical lens. When the light emitted from the LED light source is projected to the reflecting surface of the light reflecting body through the through hole, the light is reflected by the reflecting surface to reach the upper surface of the base, and then is reflected by the upper surface of the base to reach the diffusion plate.

Abstract: A method and system for designing a manufacturing facility for solid state thin film battery devices. The method can include providing a plurality of processing tools for arrangement within a predetermined spatial region of one or more manufacturing facilities. A plurality of variables can be assigned for the plurality of processing tools. A target financial variable can be defined to evaluate different manufacturing processing tool configurations. The plurality of variables in the tensor relationship can be processed to reduce a magnitude of the target variable. An optimized set of the plurality of processing tools and respective configuration with the plurality of tools associated with the reduced magnitude of the target variable can be determined through processing. The optimized set of the plurality of processing tools in the respective configuration can be used in the one or more manufacturing facilities for the manufacture of a solid state thin film battery device.

Abstract: A method for determining a chroma gain for a modulated chroma signal, comprises the steps: receiving the modulated chroma signal; generating a first chroma gain as a function of a color burst of the received modulated chroma signal; generating a second chroma gain as a function of a peak amplitude of the modulated chroma signal; and determining a final chroma gain for the received modulated chroma signal as a function of the first generated chroma gain and the second generated chroma gain, wherein the determined chroma gain is applied on the modulated chroma signal.

Abstract: A system and a method of multi-user coaching are introduced herein. Motion-sensing cameras are applied to capture images, and a depth image stitching module is applied to perform a depth image stitching process on the captured images to expand the motion-sensing range, so as to establish a virtual environment for multi-user coaching. Each user can be coached individually by a one-to-multiple approach to improve his or her motions. By using the system and the method of multi-user coaching, that is, the system can only calculates on motion similarities of the users, and instructions are fed back to each user. Therefore, the system and the method described herein can be extensively applied to various products, such as a virtual gymnasium, a virtual aerobics classroom, a virtual Budokan, and so on.

Abstract: A testing method of a touch device and a system thereof are provided. The testing method includes following steps. A test sensing information generated by the touch device is received, and the test sensing information is physical characteristic information provided by sensors of the touch device. A test gesture signal and a test keypad signal generated by the touch device are received, the test gesture signal includes gesture coordinates provided by touch device, and the test keypad signal includes a keypad key triggering signal generated by the touch device. According to a preset table, in order to generate a test result, whether the test sensing information, the test gesture signal, and the test keypad signal match data of the preset table or not is determined, and whether the touch device works properly is determined according to the test result.

Abstract: A switching converter having a high-side switching transistor and a low-side switching transistor and an inductor, having a circuit for generating a simulated waveform representing a sawtooth inductor current waveform. A circuit for monitoring and voltage at a switch node between the high-side and low-side transistors to determine a time during which the inductor current is increasing and a time during which the inductor current is decreasing wherein voltage across the low-side transistor when it is conducting represents a first portion of the simulated sawtooth inductor current waveform. A circuit for utilizing the time when the inductor current is increasing, the time when the inductor current is decreasing and the voltage across the low-side transistor when it is conducting to generate a portion of the simulated inductor current waveform when the high-side transistor is conducting. A method and a power supply utilizing this circuit are also disclosed.

Abstract: Various examples are provided for corrosion detection in structural tendons. In one example, among others, a method includes injecting current through a portion of a tendon assembly including a tendon at least partially encased in grout, where the current is injected through the portion of the tendon assembly via contact points on a surface of the grout. A potential across the portion of the grout surface is measured and a condition of the tendon can be based at least in part upon the current and the potential. In another example, a system includes supply electrodes to inject current into grout surrounding a tendon via contact with a surface of the grout, sensor electrodes to measure a potential difference between the supply electrodes, and an impedance detection device to determine an impedance of the tendon based at least in part upon the injected current and the potential difference.

Abstract: The invention discloses a communication method, apparatus and system for mobile devices, which pertains to the field of communication. The method comprises: obtaining additional instruction information that corresponds to a first user operation during communication by sensing the first user operation; the first user operation comprises at least one of a voice-activated operation or a one-step operation on a first mobile device; and transmitting the additional instruction information to a second mobile device, so that the second mobile device recognizes the additional instruction information to further notify a second user of the second mobile device of the first user operation. The apparatus comprises an acquisition module and a transmitting module. The system includes a first mobile device and a second mobile device.

Abstract: A FinFET comprises a substrate comprising a major surface; a fin structure protruding from the major surface comprising a lower fin portion comprising a first semiconductor material having a first lattice constant; an upper fin portion comprising a second semiconductor material having a second lattice constant greater than the first lattice constant; a middle fin portion comprising a third semiconductor material having a third lattice constant between the first lattice constant and the second lattice constant; and a passivation structure surrounding the fin structure comprising a lower passivation portion surrounding the lower fin portion comprising a first oxynitride of the first semiconductor material; an upper passivation portion surrounding the upper fin portion comprising a second oxynitride of the second semiconductor material; and a middle passivation portion surrounding the middle fin portion comprising a third oxynitride of the third semiconductor material.

Abstract: A MEMS apparatus has a substrate, a cap forming first and second chambers with the base, and movable microstructure within the first and second chambers. To control pressures, the MEMS apparatus also has a first outgas structure within the first chamber. The first outgas structure produces a first pressure within the first chamber, which is isolated from the second chamber, which, like the first chamber, has a second pressure. The first pressure is different from that in the second pressure (e.g., a higher pressure or lower pressure).

Abstract: An image processing method includes, calculating a partial distance between a pixel of interest in an image and each of reference pixels, sequentially calculating a total distance between the pixel of interest and each of the plurality of the reference pixels based on the partial distance, determining a shortest total distance among the total distances that have been already calculated, in the sequential calculation of the total distance, and categorizing the pixel of interest based on the reference pixel corresponding to the shortest total distance, wherein, if the partial distance between the pixel of interest and a specific one of the reference pixels to be calculated is equal to or greater than the shortest total distance in the sequential calculation of the total distance, the calculation of the total distance between the pixel of interest and the specific one of the reference pixels to be calculated is omitted.

Abstract: A temperature adjusting apparatus for a server and a temperature adjusting method thereof are provided. Rotation speeds and rotation directions of fans are controlled according to sensing results of temperature sensors, so as to adjust temperatures of server units by heat generated from the server units during operation.

Abstract: Systems, methods, and computer-readable media for analyzing health information to generate medical assessments are described. Health information may include any type of information associated with the health or physical characteristics of a patient. Non-limiting examples of medical assessments include medical diagnoses, medical orders, and risk assessments. A health information analysis system may access health information associated with a patient and provide a medical assessment based on various analyses of the health information. The health information analysis system may receive feedback associated with the medical assessments, such as historical information and/or user input regarding the accuracy or completeness of the medical assessment. The feedback may be used by the health information analysis system to update the analyses of the health information.