Abstract: A semiconductor structure has a MOSFET and a substrate to accommodate the MOSFET. The MOSFET has a gate, a source, and a drain in the substrate. A first substrate region surrounding the MOSFET is doped with a stress enhancer, wherein the stress enhancer is configured to generate a tensile stress in the MOSFET's channel and the tensile stress is along the channel's widthwise direction.

Abstract: An illumination system is provided, including a light emitting device and a control device, wherein the control device is coupled to the light emitting device so as to capture a situation data in a remote end and generate a situation signal correspondingly. The light emitting device receives the situation signal and generates a simulating situation.

Abstract: An LED assembly that includes optics and optical arrangements for light emitting diodes (LEDs). In some embodiments, a reflector is provided within a void between the lens and the LED. This reflector can reflect light emitted by the LED in a non-preferred direction back toward the preferred direction. In other embodiments, an optical element is formed or otherwise provided in the lens cavity and shaped so that, when the lens is positioned above the LED, the refractor bends the emitted light in a preferred direction. In some embodiments, both a reflector and optical element are provided in the LED assembly to control the directionality of the emitted light. Such embodiments of the invention can be used to increase the efficiency of an LED by ensuring that generated light is being directed to the target area of choice.

Abstract: A system includes a controller configured to control an operational behavior of a turbine system. The controller includes a droop response system configured to detect one or more operational characteristics of the turbine system as an indication of a frequency variation of an electric power system associated with the turbine system. The droop response system is further configured to generate a response to vary an output of the turbine system in response to the indication of the frequency variation. The controller includes a multivariable droop response correction system configured to determine one or more possible errors associated with the one or more operational characteristics of the turbine system, and to generate a plurality of correction factors to apply to the response generated by the droop response system. The plurality of correction factors is configured to correct the response generated by the droop response system.

Abstract: A light-emitting diode (LED) module lamp with adjustable chromaticity is provided. The LED module lamp is formed by at least one set of second module including a plurality of LED modules, namely a first LED module to an nth LED module. Each of the LED modules includes a plurality of LEDs having visible spectrum chromaticities. That is, a first chromaticity LED C1 to an nth chromaticity LED Cn form a structure in a cyclic arrangement. The second module array is: ? [ C 1 C 2 C 3 … C n - 1 C n C 2 C 3 C 4 … … C n C 1 C 3 C 4 … … C n C 1 C 2 … … … … … … … C n C 1 … … … C n - 2 C n - 1 ] , where the first to nth columns are independently connected in series.

Abstract: A varactor includes at least one semiconductor fin, a first gate, and a second gate physically disconnected from the first gate. The first gate and the second gate form a first FinFET and a second FinFET, respectively, with the at least one semiconductor fin. The source and drain regions of the first FinFET and the second FinFET are interconnected to form the varactor.

Abstract: In some examples, the disclosure relates to a medical device comprising a lead including an electrically conductive lead wire; and an electrode electrically coupled to the lead wire, the electrode including a first portion and a second portion, wherein the first portion defines an exposed outer surface of the electrode and is electrically coupled to the second portion along a first interface, wherein the second portion is electrically coupled to the lead wire along a second interface different from the first interface via welding to couple the lead wire to the electrode, wherein an electrical signal may be transferred between the lead wire and exposed outer surface of the first portion via the second portion, and wherein the first portion is formed from a first material having a first composition, and the second portion is formed from a second material having a second composition different from the first composition.

Abstract: Methods, systems, and apparatuses are described for performing speaker-identification-assisted speech processing in an uplink path of a communication device. In accordance with certain embodiments, a communication device includes speaker identification (SID) logic that is configured to identify the identity of a near-end speaker. Knowledge of the identity of the near-end speaker is then used to improve the performance of one or more uplink speech processing algorithms implemented on the communication device.

Abstract: A communication device including a ground element and an antenna element is provided. The antenna element includes a first portion and a second portion. The first portion has a first end and a second end. The first end is used as a first feeding point of the antenna element. The second portion has a third end and a fourth end. The third end is used as a second feeding point of the antenna element, and the fourth end is open. A first switch is coupled between the second end of the first portion and the third end of the second portion. The first switch is further coupled through the first portion and a first reactive circuit to a communication module. A second switch is coupled to the third end of the second portion. The second switch is further coupled through a second reactive circuit to the communication module.

Abstract: A user interface is displayed in a handheld device, and is used to control an electronic device electrically connected to the handheld device. The user interface includes at least one function selection region, an execution region, and a display region. The execution region is surrounded by the function selection region, and is electrically connected to the function selection region. The execution region is used to execute a function of the function selection region, and is used to send a comment corresponding to the execution region to the electronic device. When the function selection region is selected, the display region displays first information corresponding to the function selection region. When the execution region is pressed, the display region displays second information fed back from the electronic device to the handheld device in accordance with the comment.

Abstract: Among other things, one or more image sensors and techniques for forming such image sensors are provided. An image sensor comprises a photodiode array configured to detect light. A filler grid is formed over the photodiode array, such as over a dielectric grid. The filler grid comprises one or more filler structures, such as a first filler structure that provides a light propagation path to a first photodiode that is primarily through the first filler structure. In this way, signal strength decay of light along the light propagation path before detection by the first photodiode is mitigated. The image sensor comprises a reflective layer that channels light towards corresponding photodiodes. For example, a first reflective layer portion guides light towards the first photodiode and away from a second photodiode. In this way, crosstalk, otherwise resulting from detection of light by incorrect photodiodes, is mitigated.

Abstract: A method of treating a substrate with plasma is described. In particular, the method includes disposing a substrate in a plasma processing system, disposing a hollow cathode plasma source including at least one hollow cathode within the plasma processing system, and disposing a grid between the cathode outlet of the plurality of hollow cathodes and the substrate. The method further includes electrically coupling the grid to electrical ground, coupling a voltage to the at least one hollow cathode relative to electrical ground, and generating plasma in hollow cathode by ion-induced secondary electron emission of energetic electrons that move along a first trajectory, and diffusing lower energy electrons along a second trajectory across a first region of the interior space between the cathode outlet and the grid, through the grid, and into a second region of the interior space in fluid contact with the substrate.

Abstract: One embodiment comprises a hierarchical heap allocator system. The system comprises a system-level allocator for monitoring run-time resource usage information for an application having multiple application threads. The system further comprises a process-level allocator for dynamically balancing resources between the application threads based on the run-time resource usage information. The system further comprises multiple thread-level allocators. Each thread-level allocator facilitates resource allocation and resource deallocation for a corresponding application thread.

Abstract: An access point can include an array of antennas and a smart antenna selector. The smart antenna selector is configured to select a subset of antennas from the antenna array for use in multi-user multiple-input multiple-output (MU MIMO) data transmissions. Stations that are communicatively coupled to the access point can be selected for inclusion in a multi-user group based, at least in part, on performance measurements of the stations. Performance measurements are determined directly and indirectly from data transmissions sent in response to sounding packets. Antennas for use in MU MIMO data transmissions are selected for the antenna array based, at least in part, on previous antenna selections used for single user data transmissions.

Abstract: Systems, chambers, and processes are provided for controlling process defects caused by moisture contamination. The systems may provide configurations for chambers to perform multiple operations in a vacuum or controlled environment. The chambers may include configurations to provide additional processing capabilities in combination chamber designs. The methods may provide for the limiting, prevention, and correction of aging defects that may be caused as a result of etching processes performed by system tools.

Abstract: An apparatus comprising a memory and a controller. The memory may be configured to process a plurality of read/write operations. The memory comprises a plurality of memory modules each having a size less than a total size of the memory. The controller is configured to (i) determine if a read disturb has occurred, and (ii) if the read disturb has occurred, the controller (a) determines a size of the group of read/write operations, and (b) writes all of the group of read/write operations to one of the memory modules.

Abstract: A multi-layered packaging box with easy tearing structure includes a material box having: a seat; one lateral side of the seat having a breakable portion; a receiving space formed at a lower portion of the seat for receiving an object; an upper cover for covering the seat; a sealing film adhering on an upper portion of the upper cover; the sealing film having at least one tearing line; the sealing film including an easy tearing portion which can be torn away from the sealing film easily; and one end of the easy tearing portion adhering on the breakable portion. In above mentioned structure, the cover can be not used.

Abstract: Embodiments of mechanisms for testing a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate and to provide probing structures (or pads). Testing structures, including daisy-chain structures, with metal lines to connect bonding structures connected to signals, power source, and/or grounding structures are connected to probing structures on the interconnect substrate. The testing structures enable determining the quality of bonding and/or functionalities of packaged dies bonded. After electrical testing is completed, the metal lines connecting the probing structures and the bonding structures are severed to allow proper function of devices in the die package. The mechanisms for forming test structures with probing pads on interconnect substrate and severing connecting metal lines after testing could reduce manufacturing cost.

Abstract: A miniature image pickup lens includes a first lens, a second lens, an aperture, a third lens, a fourth lens, and a fifth lens in sequence along an optical axis from an object side to an image side. The first lens is a negative meniscus lens with a convex aspheric surface toward the object side and a concave aspheric surface toward the image side. The second lens has both aspheric surfaces including a convex surface toward the object side. The third lens is a positive biconvex lens. The fourth lens is a positive biconvex lens. The fifth lens is a negative lens with a concave surface toward the object side.

Abstract: A method for fabricating a through-silicon via comprises the following steps. Provide a substrate. Form a through silicon hole in the substrate having a diameter of at least 1 ?m and a depth of at least 5 ?m. Perform a first chemical vapor deposition process with a first etching/deposition ratio to form a dielectric layer lining the bottom and sidewall of the through silicon hole and the top surface of the substrate. Perform a shape redressing treatment with a second etching/deposition ratio to change the profile of the dielectric layer. Repeat the first chemical vapor deposition process and the shape redressing treatment at least once until the thickness of the dielectric layer reaches to a predetermined value.