Abstract: Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.

Abstract: Embodiments of the present disclosure relate to a power supply device, an electronic system and a method. The electronic system comprises an electronic device and the power supply device transmitting synchronization information from a satellite to the electronic system. The power supply device comprises a first modulator configured to receive a signal from a satellite and to generate a first modulated supply voltage, a level pattern of the first modulated supply voltage indicating synchronization information included in the satellite signal; and a first transformer configured to provide the first modulated supply voltage to an electronic device to enable a synchronization between the satellite and the electronic device based on the synchronization information. The electronic device demodulates the first modulated supply voltage to determine the synchronization information for synchronizing with the satellite.

Abstract: A neutral-point voltage balance control method and system for a three-level converter in a full power factor range. The method includes: using a large, medium, and zero vector modulation method to synthesize a reference voltage vector, and duty cycles of a large vector, a medium vector, and a zero vector; obtaining a voltage difference between two dc-link capacitors of signal acquisition, and the voltage difference as a neutral-point potential of the three-level converter; according to a value relationship between the neutral-point potential of the three-level converter and a specified threshold, selecting a small vector and calculating a duty cycle of the small vector; and updating a duty cycle of each basic vector, and obtaining a switching sequence for controlling a power switch of a three-phase bridge arm. An amplitude of a common-mode voltage of an NPC three-level converter is equal to one sixth of a dc-link voltage.

Abstract: A bacterium that degrades LAS and/or removes N is provided. The bacterium is taxonomically classified as Pseudomonas sp., and was deposited in China General Microbiological Culture Collection Center on Sep. 18, 2018, with the accession number of CGMCC 16502. The bacterium can be applied in the rural domestic sewage treatment, and has the effect of removing LAS and/or N pollution.

Abstract: The present invention relates to a device (10) for supplying a mist of liquid (F). The device (10) is used in combination with a container (20) with an opening (200) for containing the liquid (F).

Abstract: Disclosed are a micro light emitting diode substrate, a manufacturing method thereof, and a display device. At first step, providing a first growth substrate having a first growth surface which is provided with a first color micro light emitting diode unit; at second step, providing a receiving substrate having a receiving surface on which a plurality of receiving pads are arranged at intervals; at third step, fitting the first growth substrate to the receiving substrate such that each first color micro light emitting diode unit at a transfer position is fitted to one receiving pad; at fourth step, fixing the first color micro light emitting diode unit to the receiving surface through the receiving pad; at fifth step, peeling off the first color micro light emitting diode unit from the first growth substrate, to obtain the receiving substrate on which the first color micro light emitting diode unit is fixed.

Abstract: Systems and methods for detecting a motor developmental delay and/or neurodevelopmental disorder of an infant are described herein. An example method can include receiving motion data associated with the infant's gross motor activity; analyzing, using a machine learning algorithm, the motion data to detect a kinematic feature; comparing the kinematic feature to an expected relationship between the kinematic feature and infant age; and detecting the neurodevelopmental disorder based on the comparison. An infant sensor suit is also described herein. An example infant sensor suit can include an article of clothing; a plurality of sensors; a power source operably coupled to the sensors; and a wireless transmitter operably coupled to the sensors. The sensors, power source, and wireless transmitter can be incorporated into the article of clothing.

Abstract: Disclosed is a method of removing volatile organic compounds from sponges by using supercritical/subcritical fluid, The method includes the following steps: placing the sponge block to be treated in the extraction kettle; feeding the critical flow medium into the extraction kettle; performing extraction under the supercritical or subcritical conditions of the critical flow medium; releasing pressure to normal pressure after extraction; and separating to obtain devolatilized sponge. The volatile removal device used in the disclosure is a supercritical extraction equipment, which can adopt static extraction or dynamic extraction or a combination of the two. CO2 releases pressure in the separating kettle after contacting the sponge to be treated in the device for mass transfer for a certain period, when the static extraction devolatilization is carried out.

Abstract: The present application discloses a decorative sheet including a supporting layer and a solid film layer. The solid film layer is disposed on the supporting layer and presents a color. The solid film layer includes a single layer or a composite layer. A thickness and/or material of at least one layer in the solid film layer is set to be varied. In this application, through the change of the thickness and/or material of the solid film layer, the color of the solid film layer can be changed, including shade changes, color changes and other variety changes, so that the decorative sheet has rich color, rich vision, better decoration effect and higher recognition. Furthermore, the present application further discloses a cover plate for a consumer electronic product with the above-mentioned decorative sheet.

Abstract: Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.

Abstract: A server (10), a server rack (50) and a data centre (100, 150) are provided. The server (10) includes a housing (12) defining a gaseous flow passage. A plurality of active components (14) and a plurality of passive components (16) are provided in the housing (12). A plurality of liquid cooling devices (18) is attached to respective ones of the active components (14).

Abstract: Provided are a terminal positioning method and apparatus, and a storage medium. The method includes: determining that there is no Line Of Sight (LOS) between a first communication node and a terminal, wherein there is a reflecting object between the first communication node and the terminal; determining first position information of the reflecting object according to a first beam of the first communication node, wherein the first beam is a beam, detected by the terminal to have a strongest signal, among a plurality of beams of the first communication node; and determining a position of the terminal according to the first position information.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: A cost-effective and practical antimicrobial glaze system and glazing process is disclosed herein. The antimicrobial glaze/enamel may comprise at least two layers: a base layer and a top layer. The base layer may contain a typical or normal glaze widely used in sanitary ware, having a low level of zinc oxide. The base layer glaze may be directly sprayed on the clay body surface. A thin top glaze layer is sprayed on top of the base glaze layer and the top layer may contain a high level of zinc oxide.

Abstract: A circuit includes a level shifter circuit, an output circuit, an enable circuit, a first and a second feedback circuit. The level shifter circuit is coupled to a first voltage supply, and is configured to generate at least a first and a second signal responsive to at least the first enable signal or the first input signal. The output circuit is coupled to at least the level shifter circuit and the first voltage supply, and configured to receive the first and the second signal. The enable circuit is configured to generate a second enable signal responsive to the first enable signal. The first feedback circuit is configured to receive the first enable signal, the second enable signal and the first feedback signal. The second feedback circuit is configured to receive the first enable signal, the second enable signal and the second feedback signal.

Abstract: A lighting apparatus includes a driver, a metal plate, a light source module and a conductor unit. The driver receives an alternating current power source and converts the alternating current power source to a driving current. The metal plate is electrically connected to a ground. The light source module has a substrate and multiple LED modules. The multiple LED modules are mounted on the substrate. The substrate is disposed upon the metal plate. The conductor unit has a first end connected to the substrate of the light source module and a second end connected to the metal plate for removing a parasitic capacitance between the substrate of the light source and the metal plate for preventing a noise occurred when the LED module is turned on and the metal plate is connected to the ground.

Abstract: A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.

Abstract: Expansion compensation structures for an antenna are disclosed. In one embodiment, the antenna comprises: an array of antenna elements; and a structure coupled to the array of antenna elements, the structure having a plurality of components comprising materials having different coefficients of thermal expansion (CTEs), wherein first and second components of the plurality of components are pin bonded with one or more pins, and one or more components of the plurality of components other than the first and second components are between the first and second components and have one or more slots through which the one or more pins traverse and have CTEs different than CTEs of the first and second components.

Abstract: A wristband can comfortably secure an electronic device, such as a wristwatch or fitness/health tracking device, to a wrist of a user. The wristband can include a number of magnets that allow the wristband to be magnetically coupled to itself when folded over or when separate band portions are overlapping. The magnets can include a polymer mixed with a magnetic material to provide magnetic properties and flexibility. The magnets can be joined together by a continuous support structure that extends through opposing pairs of the magnets. The support structure can provide substantial and ability as well as tensile strength. The magnets and the support structure can be surrounded by a flexible cover to protect the components within.

Abstract: A semiconductor arrangement includes a logic region and a memory region. The memory region has an active region that includes a semiconductor device. The memory region also has a capacitor within one or more dielectric layers over the active region, where the capacitor is over the semiconductor device. The semiconductor arrangement also includes a protective ring within at least one of the logic region or the memory region and that separates the logic region from the memory region. The capacitor has a first electrode, a second electrode and an insulating layer between the first electrode and the second electrode, where the first electrode is substantially larger than other portions of the capacitor.