Patents by Inventor Chen-Ang Hsiao

Chen-Ang Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8480435
    Abstract: The present invention relates to a USB connector, comprises: a substrate on which a plurality of first contact pads and a plurality of second contact pads are installed and exposed outside the substrate; and a connector main body on which a plurality of opening slots and a plurality of terminals are installed, wherein one end of each of the terminals is respectively installed in the plural opening slots and exposed outside the opening slots, the other end thereof is respectively in contact with the second contact pads for forming a USB connector.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: July 9, 2013
    Assignee: Power Quotient International Co., Ltd.
    Inventors: Chen-Ang Hsiao, Wei-Kun Lee, Tung-Ming Chang, Chia-Hsin Tsai
  • Publication number: 20120052731
    Abstract: The present invention relates to a USB connector, comprises: a substrate on which a plurality of first contact pads and a plurality of second contact pads are installed and exposed outside the substrate; and a connector main body on which a plurality of opening slots and a plurality of terminals are installed, wherein one end of each of the terminals is respectively installed in the plural opening slots and exposed outside the opening slots, the other end thereof is respectively in contact with the second contact pads for forming a USB connector.
    Type: Application
    Filed: November 23, 2010
    Publication date: March 1, 2012
    Inventors: Chen-Ang HSIAO, Wei-Kun Lee, Tung-Ming Chang, Chia-Hsin Tsai
  • Patent number: 6148906
    Abstract: A cooling system for an electronic equipment enclosure employs a flat plate heat pipe to deliver heat from the interior of the enclosure through a connector to a removable external heat sink. The heat pipe includes a metallic bottom plate having a depression therein containing a set of rods evenly spaced from one another. A top plate covers the bottom plate with the rods compressed therebetween. Channels formed between adjacent rods are partially evacuated and injected with an evaporative fluid. The fluid and its vapor circulate in the channels to convey heat from a warm end of the heat pipe to a cool end. The heat sink is of similar construction.
    Type: Grant
    Filed: April 15, 1998
    Date of Patent: November 21, 2000
    Assignee: Scientech Corporation
    Inventors: Hsi-Shang Li, Chen-Ang Hsiao