Patents by Inventor Chen-Bin Chiang

Chen-Bin Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming seed layer structure
    Patent number: 8778801
    Abstract: A seed layer comprises a bottom seed layer portion formed on the bottom of a via opening, a sidewall seed layer portion formed on an upper portion of the sidewall of the via opening and a corner seed layer portion formed between the bottom seed layer portion and the sidewall seed layer portion. The sidewall seed layer portion is of a first thickness. The corner seed layer portion is of a second thickness and the second thickness is greater than the first thickness.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: July 15, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Bin Chiang, Hung-Chih Wang, Kuei-Pin Lee, Chi-Yu Chou, Yao Hsiang Liang