Abstract: A laser processing device has a laser source and a high speed vibration unit. The laser source has a laser-emitting end being capable of emitting a laser beam adapted to process a workpiece. The high speed vibration unit is located on a moving path of the laser beam and is capable of vibrating periodically along a direction parallel to the moving path of the laser beam such that the focusing point of the laser beam moves periodically on the workpiece at high speed. The laser processing device with the fast moving focusing point is able to efficiently process parts of the workpiece at specific depths. Therefore, product quality and production rate are increased.

Abstract: A laser processing device has a laser source and a high speed vibration unit. The laser source has a laser-emitting end being capable of emitting a laser beam adapted to process a workpiece. The high speed vibration unit is located on a moving path of the laser beam and is capable of vibrating periodically along a direction parallel to the moving path of the laser beam such that the focusing point of the laser beam moves periodically on the workpiece at high speed. The laser processing device with the fast moving focusing point is able to efficiently process parts of the workpiece at specific depths. Therefore, product quality and production rate are increased.