Abstract: A connecting structure for a liquid container includes a receiving groove. The liquid container having a suction tube is disposed in the receiving groove. A top end of the receiving groove is engaged with a connecting base. A front side of the connecting base is pivotally connected to a locking assembly protruding frontwards. A liftable base being movable along a top-bottom direction and a front-rear direction is disposed in an inner side of the connecting base, and has a bottom frame engaging with a sleeve that is for being connected to and communicating with a liquid pipeline and fits around the suction tube. Two extending arms extending frontwards out of the bottom frame are pivotally connected to the locking assembly. A left side and a right side of the bottom frame are pivotally connected to two swinging arms that extend backwards and are pivotally connected to the connecting base.

Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.

Abstract: The aid design system for analog ICs includes an analog IC database, a peripheral component database, an input module, a computing simulation module, a selection module and an output module. The analog IC database includes parameters of a plurality of analog ICs. The peripheral component database includes parameters of the peripheral components cooperating with the analog ICs. The input module is for use in inputting a desirable parameter specification or specific IC according to the user's discretion. The computing simulation module includes transfer functions of the analog ICs. The selection module is for use in picking out suggested peripheral components based on the computing result of the computing simulation module. The output module is for use in displaying the suggested peripheral components or analog ICs.