Patents by Inventor Chen Cheng

Chen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11976061
    Abstract: Invented are compounds of Formula I and the pharmaceutically acceptable salts, esters, and prodrugs thereof, which are DGAT2 inhibitors. Also provided are methods of making compounds of Formula I, pharmaceutical compositions comprising compounds of Formula I, and methods of using these compounds to treat hepatic steatosis, nonalcoholic steatohepatitis (NASH), fibrosis, type-2 diabetes mellitus, obesity, hyperlipidemia, hypercholesterolemia, atherosclerosis, cognitive decline, dementia, cardiorenal diseases such as chronic kidney diseases and heart failure and related diseases and conditions, comprising administering a compound of Formula I to a patient in need thereof.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: May 7, 2024
    Assignee: Merck Sharp & Dohme, LLC
    Inventors: Yeon-Hee Lim, Eric R. Ashley, Jianming Bao, Chen Cheng, James P. Roane, Emma Helen Southgate
  • Patent number: 11979916
    Abstract: Disclosed are a method and apparatus for determining an RA-RNTI. In the present application, a base station receives a random access preamble sent by a terminal; the base station determines an RA-RNTI according to a time-frequency resource occupied by the random access preamble, and the time-frequency resource is a time-frequency resource of an orthogonal frequency division multiplexing (OFDM) symbol level; and the base station sends a random access response message, and the random access response message includes downlink control information allocated, by the base station, for the terminal, and the downlink control information is scrambled using the RA-RNTI. By means of the present application, an RA-RNTI can be determined during a random access process of an NR system.
    Type: Grant
    Filed: June 14, 2023
    Date of Patent: May 7, 2024
    Assignee: DATANG MOBILE COMMUNICATIONS EQUIPMENT CO., LTD.
    Inventors: Bin Ren, Zheng Zhao, Ren Da, Tie Li, Fang-Chen Cheng
  • Publication number: 20240140938
    Abstract: Invented are compounds of formula I and the pharmaceutically acceptable salts, esters, and prodrugs thereof, which are DGAT2 inhibitors. Also provided are methods of making compounds of Formula I, pharmaceutical compositions comprising compounds of Formula I, and methods of using these compounds to treat hepatic steatosis, nonalcoholic steatohepatitis (NASH), fibrosis, type-2 diabetes mellitus, obesity, hyperlipidemia, hypercholesterolemia, atherosclerosis, cognitive decline, dementia, cardiorenal diseases such as chronic kidney diseases and heart failure and related diseases and conditions, comprising administering a compound of Formula I to a patient in need thereof.
    Type: Application
    Filed: December 17, 2021
    Publication date: May 2, 2024
    Applicant: Merck Sharp & Dohme LLC
    Inventors: Jianming Bao, Chen Cheng, Faben A. Cruz, Yeon-Hee Lim, Cedric L. Hugelshofer, Jinlong Jiang, Victor W. Mak, Emma Helen Southgate
  • Patent number: 11966546
    Abstract: A display device includes a base layer, a touch sensing layer, a light guide module and a display panel. The touch sensing layer is disposed on the base layer. The light guide module is disposed on the touch sensing layer. The touch sensing layer is located between the light guide module and the display panel, and the touch sensing layer and one of the light guide module and the display panel have no adhesive material therebetween.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: April 23, 2024
    Assignee: E Ink Holdings Inc.
    Inventors: Chen-Cheng Lin, Chia-I Liu, Kun-Hsien Lee, Hung-Wei Tseng
  • Patent number: 11961791
    Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo
  • Patent number: 11961226
    Abstract: In a medical image recognition method, applied to a computer device, a to-be-recognized medical image set is obtained, where the to-be-recognized medical image set includes at least one to-be-recognized medical image. A to-be-recognized area corresponding to each to-be-recognized medical image in the to-be-recognized medical image set is extracted. The to-be-recognized area is a part of the to-be-recognized medical image. A recognition result of each to-be-recognized area through a medical image recognition model is determined. The medical image recognition model is obtained through training according to a medical image sample set. The medical image sample set includes at least one medical image sample, and each medical image sample carries corresponding annotation information. The annotation information is used for representing a type of the medical image sample, and the recognition result is used for representing the a of the to-be-recognized medical image.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: April 16, 2024
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Kaiwen Xiao, Zhongqian Sun, Chen Cheng, Wei Yang
  • Publication number: 20240114614
    Abstract: Disclosed is a thermal conduction-electrical conduction isolated circuit board with a ceramic substrate and a power transistor embedded, mainly comprising: a dielectric material layer, a heat-dissipating ceramic block, a securing portion, a stepped metal electrode layer, a power transistor, and a dielectric material packaging, wherein a via hole is formed in the dielectric material layer, the heat-dissipating ceramic block is correspondingly embedded in the via hole, the heat-dissipating ceramic block has a thermal conductivity higher than that of the dielectric material layer and a thickness less than that of the dielectric material layer, the stepped metal electrode layer conducts electricity and heat for the power transistor, the dielectric material packaging is configured to partially expose the source connecting pin, drain connecting pin, and gate connecting pin of the encapsulated stepped metal electrode layer.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: HO-CHIEH YU, CHEN-CHENG-LUNG LIAO, CHUN-YU LIN, JASON AN CHENG HUANG, CHIH-CHUAN LIANG, KUN-TZU CHEN, NAI-HIS HU, LIANG-YO CHEN
  • Publication number: 20240105654
    Abstract: A method of making a semiconductor device includes patterning a conductive layer over a substrate to define a conductive pad having a first width. The method includes depositing a passivation layer, wherein the passivation layer directly contacts the conductive pad. The method includes depositing a protective layer over the passivation layer, wherein the protective layer directly contacts the conductive pad. The method includes depositing an under-bump metallization (UBM) layer directly contacting the conductive pad, wherein the UBM layer has a second width greater than the first width. The method includes depositing a mask layer over the UBM layer; and forming an opening in the mask layer wherein the opening has the second width. The method includes forming a conductive pillar in the opening on the UBM layer; and etching the UBM layer using the conductive pillar as a mask, wherein the etched UBM layer has the second width.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Inventors: Chita CHUANG, Yao-Chun CHUANG, Tsung-Shu LIN, Chen-Cheng KUO, Chen-Shien CHEN
  • Patent number: 11942699
    Abstract: An antenna device includes a first insulation layer, a defected metal layer, a second insulation layer, and a plurality of radiators. The defected metal layer is disposed on the first insulation layer, and the defected metal layer has a plurality of recess features which are arranged with uniform pitches. The second insulation layer is disposed on the first insulation layer and the defected metal layer. The radiators are disposed on the second insulation layer, and each radiator has a feeding portion and a grounding portion.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: March 26, 2024
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Hsin-Hung Lin, Wei Chen Cheng
  • Publication number: 20240096757
    Abstract: An integrated circuit (IC) die includes first through third adjacent rows of through-silicon vias (TSVs), and first and second adjacent rows of memory macros. TSVs of the first row of TSVs extend through and are electrically isolated from memory macros of the first row of memory macros. TSVs of the third row of TSVs extend through and are electrically isolated from memory macros of the second row of memory macros.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Inventors: Hidehiro FUJIWARA, Tze-Chiang HUANG, Hong-Chen CHENG, Yen-Huei CHEN, Hung-Jen LIAO, Jonathan Tsung-Yung CHANG, Yun-Han LEE, Lee-Chung LU
  • Publication number: 20240097351
    Abstract: The present disclosure provides an antenna system, which includes a defected ground structure board and an antenna structure board. The defected ground structure board includes a first insulating plate and a defected ground structure layer, and the defected ground structure layer is disposed on the first insulating plate. The antenna structure board is disposed on the defected ground structure board. The antenna structure board includes at least one antenna body and a second insulating plate, the at least one antenna body is disposed on the second insulating plate, and the second insulating plate is disposed on the defected ground structure layer.
    Type: Application
    Filed: December 19, 2022
    Publication date: March 21, 2024
    Inventors: Hsin Hung LIN, Yu Shu TAI, Wei Chen CHENG
  • Patent number: 11933945
    Abstract: An optical lens includes a first lens group and a second lens group. The first lens group has at least two lenses that include at least one aspheric lens, the second lens group has at least four lenses that includes at least one aspheric lens, and a total number of lenses with refractive powers in the optical lens is smaller than nine. The first and the second lens groups include a first lens, a second lens, a third lens, a fourth lens, a fifth lens and a sixth lens in order from the magnified side to the minified side. The first lens to the sixth lens have respective refractive powers of negative, negative, positive, positive, negative and positive.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: March 19, 2024
    Assignee: RAYS OPTICS INC.
    Inventors: Ching-Lung Lai, Ying-Hsiu Lin, Chen-Cheng Lee
  • Patent number: 11924995
    Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 5, 2024
    Inventors: Chi-Chuan Wang, Cheng-Chen Cheng, Chuan-Chan Huang, Jen-Chieh Huang
  • Publication number: 20240071814
    Abstract: A method of fabricating a semiconductor package includes providing a substrate having at least one contact and forming a redistribution layer on the substrate. The formation of the redistribution layer includes forming a dielectric material layer over the substrate and performing a double exposure process to the dielectric material layer. A development process is then performed and a dual damascene opening is formed in the dielectric material layer. A seed metallic layer is formed over the dual damascene opening and over the dielectric material layer. A metal layer is formed over the seed metallic layer. A redistribution pattern is formed in the first dual damascene opening and is electrically connected with the at least one contact.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zi-Jheng Liu, Chen-Cheng Kuo, Hung-Jui Kuo
  • Patent number: 11917571
    Abstract: Disclosed in the present application are a locating method for an uplink time difference of arrival, and an apparatus thereof.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: February 27, 2024
    Assignee: Datang Mobile Communications Equipment Co., Ltd.
    Inventors: Ren Da, Fang-Chen Cheng, Hui Li, Haiyang Quan, Bin Ren, Xueyuan Gao, Qiubin Gao
  • Patent number: 11900113
    Abstract: The present disclosure relates to data flow processing methods and devices. One example method includes obtaining a dependency relationship and an execution sequence of operating a data flow by a plurality of processing units, generating synchronization logic based on the dependency relationship and the execution sequence, and inserting the synchronization logic into an operation pipeline of each of the plurality of processing unit to generate executable code.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 13, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Lijuan Hai, Chen Cheng, Christopher Rodrigues, Peng Wu
  • Publication number: 20240049426
    Abstract: A system may include an information handling resource, a liquid cooling system for providing cooling of the information handling resource, a management controller for providing out-of-band management of the system, and a strain gauge sensor within a fluidic pathway of the liquid cooling system and communicatively coupled to the management controller and configured to measure a mechanical strain upon the strain gauge sensor in response to flow of fluid through a fluidic channel of the liquid cooling system and communicate one or more signals to the management controller indicative of the mechanical strain.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Applicant: Dell Products L.P.
    Inventor: Yen-Chen CHENG
  • Patent number: 11880972
    Abstract: This application relates to a tissue nodule detection and tissue nodule detection model training method, apparatus, device, storage medium and system.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: January 23, 2024
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Chen Cheng, Zhongqian Sun, Zhao Chen, Wei Yang
  • Publication number: 20240012227
    Abstract: This document describes systems and techniques directed at an external wide-angle lens for imagers in electronic devices. An imager is disclosed that includes an image sensor and a lens stack, the lens stack including an external wide-angle lens, an internal lens, and four or more intermediate lenses. The imager has a first ratio of a projection at a vertex of the external wide-angle lens divided by a maximum focused dimension of the focal area being less than or equal to 0.15, a second ratio of a total length of the lens stack divided by the maximum focused dimension being less than or equal to 7.0, or a third ratio of a total transmission length of the imager divided by an entrance pupil diameter of the external wide-angle lens being between 1.2 and 2.6.
    Type: Application
    Filed: September 25, 2023
    Publication date: January 11, 2024
    Applicant: Google LLC
    Inventors: Shan Fu Huang, Chen Cheng Lee, Tsung-Dar Cheng, Calvin Kyaw Wong
  • Patent number: D1015323
    Type: Grant
    Filed: July 12, 2023
    Date of Patent: February 20, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Po-Yang Chien, Hao-Jen Fang, Wei-Yi Chang, Chun-Chieh Chen, Chen-Cheng Wang, Chih-Wen Chiang, Sheng-Hung Lee