Patents by Inventor Chen-Chi M. Ma
Chen-Chi M. Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8808583Abstract: A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.Type: GrantFiled: June 30, 2010Date of Patent: August 19, 2014Assignee: Chung Shan Institute of Science and Technology Armaments Bureau, M.N.D.Inventors: Yi-Hsiuan Yu, Bao-Yann Lin, Ming-Hsiung Wei, Lea-Hwung Leu, Gou-Hong Yiin, Chen-Chi M Ma
-
Publication number: 20130295384Abstract: A transparent electrode and method for manufacturing the same are disclosed. The major integrants of the transparent electrode comprise a graphene and a nanofiber. The nanofiber exhibits a light-permeable network structure to increase the light transmittance of the transparent electrode. The graphene is absorbed on the surface of the nanofiber to form a conductive light-permeable network structure. And the unique properties of the graphene lead an improvement of the mechanical strength property of the transparent electrode.Type: ApplicationFiled: November 5, 2012Publication date: November 7, 2013Applicant: TAIWAN TEXTILE RESEARCH INSTITUTEInventors: Chen-Chi M. Ma, Yuan-Li Huang, Shin-Yi Yang, Hsi-Wen Tien
-
Publication number: 20120001130Abstract: A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.Type: ApplicationFiled: June 30, 2010Publication date: January 5, 2012Applicant: CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.Inventors: Yi-Hsiuan Yu, Bao-Yann Lin, Ming-Hsiung Wei, Lea-Hwung Leu, Gou-Hong Yiin, Chen-Chi M. Ma
-
Publication number: 20110315934Abstract: A graphite-vinyl ester resin composite conducting plate is prepared in the present invention. The conducting plate can be used as a bipolar plate for a fuel cell, counter electrode for dye-sensitized solar cell and electrode of vanadium redox battery. The conducting plate is prepared as follows: a) compounding vinyl ester resin and graphite powder to form a bulk molding compound (BMC) material, the graphite powder content ranging from 70 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.01-15 wt % functionalized graphene, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a conducting plate having a desired shaped at 80-250° C. and 500-4000 psi.Type: ApplicationFiled: September 28, 2010Publication date: December 29, 2011Applicant: National Tsing Hua UniversityInventors: Chen-Chi M. Ma, Min-Chien Hsiao, Shu-Hang Liao, Ming-Yu Yen, Ming-Der Ger, Chung-An Wang, Nen-Wen Pu, Yuh Sung, Chih-Chun Teng, Shie-Heng Lee, Min-Hsuan Hsiao
-
Patent number: 8044152Abstract: An epoxy resin containing side-chain-tethered caged POSS and a preparation method thereof as well as epoxy resin material containing POSS-epoxy and a preparation method thereof are disclosed. The epoxy resin containing side-chain-tethered caged POSS (POSS epoxy) is formed by tethering of POSS group to the side chain of the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The preparation method of the POSS epoxy includes a step of reacting epoxy resin with caged POSS to form epoxy resin containing side-chain-tethered caged POSS (POSS-epoxy). The preparation method of epoxy resin material containing POSS-epoxy includes a step of reacting DGEBA epoxy resin with POSS-epoxy to get epoxy resin material containing POSS-epoxy. The POSS-epoxy is distributed evenly in the epoxy resin material with POSS-epoxy.Type: GrantFiled: October 8, 2008Date of Patent: October 25, 2011Assignee: Chung Shan Institute of Science and Technology, Armaments Bureau, M.N.DInventors: Cheng-Chien Yang, Chen-Chi M. Ma, Wang-Tsae Gu, Chin-Yih Chen
-
Publication number: 20100269270Abstract: A process for preparing a photoanode of dye-sensitized solar cells (DSSCs) is disclosed, which contains nano TiO2 and functionalized carbon nanomateiral. The process includes reacting a dispersion of functionalized carbon nanomateiral and a TiO2 precursor in a liquid organic medium under sol-gel conditions to form a carbon nanomaterial/nano TiO2 composite colloidal solution; mixing with an aqueous polymer solution, and forming a paste suitable for coating by concentrating the resulting mixture; coating the paste on a conductive glass substrate and calcining the coated layer at 300-520° C. in air for 10-60 minutes to obtain a conductive glass plate having a coating of nanocomposite, which can be used to prepare a photoanode of DSSCs by immersing in a dye solution to adsorb a dye thereon.Type: ApplicationFiled: July 23, 2009Publication date: October 28, 2010Applicant: National Tsing Hua UniversityInventors: Chen-Chi M. Ma, Chuan-Yu Yen, Yu-Feng Lin, Shu-Hang Liao
-
Publication number: 20100127428Abstract: A composite bipolar plate for a polymer electrolyte membrane membrane fuel cell (PEMFC) is prepared as follows: a) melt compounding a polypropylene resin and graphite powder at 100-250° C. and 30-150 rpm to form a melt compounding material, the graphite powder content ranging from 50 wt % to 95 wt % based on the total weight of the graphite powder and the polypropylene resin, and the polypropylene resin being a homopolymer of propylene or a copolymer of propylene and ethylene, wherein 0.05-20 wt % carbon nanotubes, based on the weight of the polypropylene resin, are added during the melt compounding; and b) molding the melt compounding material from step a) to form a bipolar plate having a desired shaped at 100-250° C. and 500-4000 psi.Type: ApplicationFiled: July 20, 2009Publication date: May 27, 2010Applicant: YUAN ZE UNIVERSITYInventors: Chen-Chi M. Ma, Shu-Hang Liao, Chuan-Yu Yen, Cheng-Chih Weng, Ching-Hung Yang, Ming-Yu Yen, Min-Chien Hsiao, Shuo-Jen Lee, Yi-Hsiu Hsiao
-
Publication number: 20100087616Abstract: An epoxy resin containing side-chain-tethered caged POSS and a preparation method thereof as well as epoxy resin material containing POSS-epoxy and a preparation method thereof are disclosed. The epoxy resin containing side-chain-tethered caged POSS (POSS epoxy) is formed by tethering of POSS group to the side chain of the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The preparation method of the POSS epoxy includes a step of reacting epoxy resin with caged POSS to form epoxy resin containing side-chain-tethered caged POSS (POSS-epoxy). The preparation method of epoxy resin material containing POSS-epoxy includes a step of reacting DGEBA epoxy resin with POSS-epoxy to get epoxy resin material containing POSS-epoxy. The POSS-epoxy is distributed evenly in the epoxy resin material with POSS-epoxy.Type: ApplicationFiled: October 8, 2008Publication date: April 8, 2010Inventors: Cheng-Chien YANG, Chen-Chi M. Ma, Wang-Tsae Gu, Chin-Yih Chen
-
Patent number: 5587034Abstract: The present invention relates to a pultrusion process for preparing fiber reinforced furan resin composites by drawing a plurality of continuous filaments through an impregnating bath of liquid furan to wet-out the filaments with the resin and a squeeze orifice for removal of excess resin and air, and continuously pulling the resin-impregnated filament through a pultrusion die to heat and cure the resin. The liquid furan resin contains a furfuryl alcohol prepolymer and a minor portion of an acid catalyst, and is maintained at a temperature of 15.degree.-35.degree. C. and has a viscosity of 500-3000 cps during the impregnating step. A postcuring treatment may be optionally employed to the pultruded fiber reinforced furan resin composites for improving their mechanical properties, which includes heating the pultruded composites at a temperature of 100.degree.-220.degree. C. for a period of 1-18 hours. Adding 1-15 wt % of mineral fillers may also improve the mechanical properties of the pultruded composites.Type: GrantFiled: October 23, 1992Date of Patent: December 24, 1996Assignee: National Science CouncilInventor: Chen-Chi M. Ma
-
Patent number: 5559197Abstract: A modified phenolic resin which is toughened by phenoxy resin is disclosed. The modified phenolic resin is prepared by the following steps: mixing a phenoxy resin having a weight average molecular weight of 10,000-1,000,000 and phenol in a weight ratio of phenoxy resin:phenol=1.5:1-1:1 at an elevated temperature to form a glutinous mixture; mixing the glutinous mixture and an acid catalyst to obtain a viscous mixture having a relatively low viscosity compared to the glutinous mixture; mixing the viscose mixture and a resole type phenolic resin to form a modified phenolic resin, wherein the resole type phenolic resin has a solid content of 60--75 wt. % and a free aldehyde content of 5-10 wt. %, the amount of the acid catalyst mixed is 2-10 wt. %, and the amount of the phenoxy resin mixed is 3-25 wt. % based on the resole type phenolic resin.Type: GrantFiled: August 15, 1995Date of Patent: September 24, 1996Assignee: National Science CouncilInventors: Chen-Chi M. Ma, Hew-Der Wu
-
Patent number: 5534302Abstract: A method for the preparation of a fiber reinforced modified phenolic resin composite, which comprises preparing a resole type phenolic resin having 60-75 wt % solid content and 5-10 wt % free aldehyde; preparing a blocked polyurethane resin having an average molecular weight of 2000-8000 and a viscosity of 500-1000 cps at 80.degree. C.; mixing the resole type phenolic resin, the blocked polyurethane resin and an acid catalyst at room temperature to form an impregnating resin, wherein the amount of the acid catalyst mixed is 2-10 wt %, based on the weight of the resole type phenolic resin, and the amount of the blocked polyurethane mixed is 5-20 wt %, based on the total weight of the mixed resins; and impregnating a plurality of filaments with the impregnating resin, and curing the impregnated filaments with a heat treatment to form a fiber reinforced modified phenolic resin composite.Type: GrantFiled: January 5, 1995Date of Patent: July 9, 1996Assignee: National Science CouncilInventors: Chen-Chi M. Ma, Hew-Der Wu, Ming-Shiu Li
-
Patent number: 5484853Abstract: A two-part adhesive composition having superior adhesive strength at cryogenic temperatures contains a urethane resin composition part and a hardener part. The urethane resin composition part comprises 50 to 99% by weight of a modified polyurethane prepolymer having an epoxy group at each of its respective ends and 1 to 50% by weight of a modified urethane compound having substantially no ether cyanate (NCO) groups and at least two epoxy groups per molecule and a molecular weight of less than 800 daltons. The hardener part is a polyamine containing primary or secondary amine groups. The equivalent ratio of the amine groups of the polyamine to the epoxy groups of the urethane resin composition part is 0.5 to 2.0.Type: GrantFiled: July 28, 1993Date of Patent: January 16, 1996Assignee: China Technical Consultants, Inc.Inventors: Der-Shyang Chen, Hung-Chung Hsia, Chen-Chi M. Ma, Wang-Nang Wang
-
Patent number: 4873128Abstract: The present invention is a process for pultruding fiber reinforced phenolic resin products, in which the phenolic resin normally has a viscosity ranging from 3,000 to 5,000 cps at 25.degree. C. and is heated to maintain a viscosity ranging from 800 to 2,000 cps during the impregnating step. A die having a temperature profile which is particularly suitable for use in the present process is also disclosed, which has substantially three different heating temperatures along the pultrusion direction. Furthermore, a postcuring treatment for improving the mechanical and physical properties of the pultruded products is also disclosed in the present invention.Type: GrantFiled: March 7, 1988Date of Patent: October 10, 1989Assignee: National Science CouncilInventors: Chen-chi M. Ma, Wen-cheng Shih
-
Patent number: 4622192Abstract: A method for preparing stampable composites of polymer of olefin and fiber mat composites which are a mixture of glass fiber and carbon fiber by surrounding a fiber mat of a mixture of glass fiber and carbon fiber with a matrix of polymer of olefin. A stampable composite of polymer of olefin and fiber mat produced by such a method.Type: GrantFiled: January 10, 1984Date of Patent: November 11, 1986Assignee: Phillips Petroleum CompanyInventor: Chen-Chi M. Ma
-
Patent number: 4347287Abstract: A system and method for forming a segmented pultruded shape is provided in which a continuous length of fiber reinforcements are impregnated with a matrix material and then formed into a continuous series of alternating rigid segments and flexible segments by curing the matrix material impregnating the rigid sections and removing the matrix material impregnating the flexible sections.Type: GrantFiled: August 14, 1980Date of Patent: August 31, 1982Assignee: Lord CorporationInventors: Armand F. Lewis, Chen-Chi M. Ma, Hoa Quach, Edward J. Krasnicki