Patents by Inventor Chen-Chi Ma

Chen-Chi Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150166881
    Abstract: A packaging material is provided including a transparent insulating material, a wavelength-converting material and a hydrophobic light-scattering material. The wavelength-converting material and the hydrophobic light-scattering material are mixed in the transparent insulating material. An LED packaging structure containing the packaging material is also provided herein.
    Type: Application
    Filed: July 21, 2014
    Publication date: June 18, 2015
    Inventors: Min-Ya CHAN, Chen-Chi MA, Sheng-Tsung HSIAO, Wei-Hao LIAO
  • Publication number: 20130052276
    Abstract: Disclosed is a method for making an antimicrobial material from 1D nanometer silver that does not accumulate in a human body. At first, 1D nanometer silver is mixed in hydrophilic solution to produce 1D nanometer silver solution. Then, adhesive is blended in the 1D nanometer silver solution to produce the antimicrobial material. The antimicrobial material may be used in antimicrobial liquid, antimicrobial dressing or antimicrobial composite. Human skin can easily block the 1D nanometer silver. Therefore, the 1D nanometer silver does not enter or accumulate in the human body. Yet, the antimicrobial material exhibits a high bactericidal rate.
    Type: Application
    Filed: August 31, 2011
    Publication date: February 28, 2013
    Applicant: Chung-Shan Institute of Science and Technology Armaments, Bureau, ministry of National Defence
    Inventors: Yi-Hsiuan Yu, Ming-Hsiung Wei, Lea-Hwung Leu, Kai-Yai Chang, Shen-fey Yeh, Fen-Yu Chung, Chen-Chi Ma
  • Publication number: 20120280168
    Abstract: A thermo-interface material composite uses a thermo-interface material containing silver nanowires. The silver nanowires have high aspect ratios, high thermo-conductivity coefficients and good anti-oxidation capabilities. Hence, an amount of silver nanowires can be added fewer than that of a traditional metal or ceramic powder. In this way, defects on device surface can be speckled during a dispersal process for improving adhesion between devices. Thus, a thermo-interface material is fabricated to obtain a high thermo-conductivity coefficient for further forming a thermo-channel.
    Type: Application
    Filed: May 3, 2011
    Publication date: November 8, 2012
    Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Chen-Chi Ma, Ming-Hsiung Wei, Yi-Hsiuan Yu, Chih-Chun Teng
  • Publication number: 20070241475
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.5-10 wt % modified organo clay by intercalating with a polyether amine, based on the weight of the vinyl ester resin, is added during the compounding; b) molding the BMC material from step a) to form a bipolar plates having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: May 23, 2006
    Publication date: October 18, 2007
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Ma, Shu-Hang Liao, Chiaun-Iou Yen, Yu-Feng Lin, Chih-Hung Hung
  • Publication number: 20060267235
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein carbon fiber 1-20 wt %, modified organo clay or noble metal plated modified organo clay 0.5-10 wt %, and one or more conductive fillers selected form: carbon nanotube (CNT) 0.1-5 wt %, nickel plated carbon fiber 0.5-10 wt %, nickel plated graphite 2.5-40 wt %, and carbon black 2-30 wt %, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a bipolar plate having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: July 7, 2005
    Publication date: November 30, 2006
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Ma, Hsu-Chiang Kuan, Han-Lang Wu, Hsun-Yu Su, Shu-Hang Liao, Chuan-Yu Yen, Yu-Feng Lin, Ying-Ying Cheng
  • Publication number: 20060223971
    Abstract: A phenolic resin that increases its toughness by polydimethylsiloxane and a process of preparing the same is provided. Polydimethylsiloxane is added as a coupling agent in a ?-glycidoxypropyltrimethoxysilane-modified phenolic resin to improve the compatibility between polydimethylsiloxane and the phenolic resin. Then, tetraethoxysilane is added to conduct hydrolysis condensation and obtain tougher and thermally stable phenolic resin.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 5, 2006
    Inventors: Jeng-Chang Yang, Chen-Chi Ma, Hon-Bin Chen, Chin-Yih Chen
  • Publication number: 20050284087
    Abstract: The method of the present invention includes grafting a glycidyl alkylene trialkoxy silane to a novolac phenolic resin in an organic solvent to form a modified novolac phenolic resin; mixing a tetralkoxy silane, an acid and water with the resulting organic solution containing the modified novolac phenolic resin, wherein hydrolysis and condensation reactions are carried out to form a —Si—O—Si— bonding; adding a curing agent for novolac phenolic resin to the resulting reaction mixture; evaporating the organic solvent and acid from the resulting mixture and heating the resulting mixture to form a novolac phenolic resin/silica hybrid organic-inorganic nanocomposite.
    Type: Application
    Filed: June 14, 2004
    Publication date: December 29, 2005
    Applicant: Chung-Shan Institute of Science & Technology
    Inventors: Jeng-Cheng Yang, Chen-Chi Ma, Hon-Bin Chen, Chin-Yih Chen