Patents by Inventor Chen Chiang

Chen Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12000407
    Abstract: A ceiling fan blade assembly structure includes a blade holder, multiple fan blades, and multiple locking assemblies. Multiple fan blade assembly portions are disposed at an outer side of the blade holder. Each fan blade assembly portion includes two first side plates parallel to each other, a first radial positioning portion, and two first vertical positioning portions disposed on the two first side plates. Each fan blade has a fan blade connection portion that includes two second side plates, a second radial positioning portion, and two second vertical positioning portions. The second and the first radial positioning portions are engaged with each other, and the two second and first vertical positioning portions are engaged with each other. Accordingly, the fan blade connection portion is preliminarily positioned on the fan blade assembly portion. Through the locking assembly, the first and the second radial positioning portions are locked together.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: June 4, 2024
    Assignee: HOTECK INC.
    Inventors: Lung-Fa Hsieh, Yu-Chen Hsieh, Min-Yuan Hsiao, Wen-Ting Tang, Hsin-Chu Chang, Ying-Pin Chiang
  • Patent number: 11999135
    Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a cationic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (?600° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: June 4, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Kaveh Adib, Indrani Bhattacharyya, Pei-Chen Chiang, Hong-goo Choi, Dae youn Kim, Jen-Chieh Lin, Prantik Mazumder, Pei-Lien Tseng
  • Publication number: 20240174894
    Abstract: A composite film includes a first thermoplastic elastomer film layer and a second thermoplastic elastomer film layer, wherein the first thermoplastic elastomer film layer includes a first styrenic block copolymer. The second thermoplastic elastomer film layer is disposed on the first thermoplastic elastomer film layer, wherein the second thermoplastic elastomer film layer includes a second styrenic block copolymer, diffusion particles dispersed in the second thermoplastic elastomer film layer, and a surface microstructure disposed on the surface of the second thermoplastic elastomer film layer.
    Type: Application
    Filed: April 27, 2023
    Publication date: May 30, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Hsuan Lin, Yu-Ling Hsu, Chun-Chen Chiang, Yi-Ping Chen
  • Patent number: 11996072
    Abstract: A novel wind chime, whereby deficiencies in the prior art, for example, it is necessary to drill holes in the wind chime tubes and grind the holes, which consumes time and manpower, affects beauty of the wind chime, deteriorates tone quality thereof and is liable to cause safety hazards, are addressed, and the wind chime, including a connection ring, a plurality of suspension cords passing the connection ring, a hanger connected at upper ends of the plurality of suspension cords, a striker connected at lower ends of the plurality of suspension cord and a plurality of wind chime tubes, jump rings are connected respectively at the lower ends of the plurality of suspension cords, limiting and connection structures are respectively provided between central positions of the jump rings and the plurality of suspension cords, and the jump rings are connected at inner sides of the plurality of wind chime tubes.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: May 28, 2024
    Assignee: LIVE OAK (YIWU) CO., LTD.
    Inventor: Chih Chen Chiang
  • Publication number: 20240170898
    Abstract: A bus bar assembly is provided and includes a first linking bus bar, a second linking bus bar and plural power connectors. The first linking bus bar includes a first main bar, a first bending part and a first conducting part. The first bending part connects between the first main bar and the first conducting part. The second linking bus bar is disposed corresponding to and isolated from the first linking bus bar, and includes a second main bar, a second bending part and a third conducting part. The second bending part connects between the second main bar and the third conducting part. The power connectors are electrically coupled with the first main bar and the second main bar, respectively.
    Type: Application
    Filed: February 1, 2024
    Publication date: May 23, 2024
    Inventors: Chen-Chiang Su, Ching-Tang Chang, Chi-Shou Ho, Guan-Chen Yin
  • Publication number: 20240162359
    Abstract: A backsheet of a solar cell module including a substrate, a first protection layer, and a second protection layer is provided. The substrate includes a first surface and a second surface opposite to each other. The first protection layer is disposed on the first surface of the substrate. The second protection layer is disposed on the second surface of the substrate, wherein the first protection layer and the second protection layer include a silicone layer. At least one of the first protection layer and the second protection layer includes diffusion particles, wherein the diffusion particles include zinc oxide, titanium dioxide modified with silicon dioxide, or a combination thereof. A thickness of the first protection layer and a thickness of the second protection layer are respectively 10 ?m to 30 ?m. A solar cell module including the backsheet is also provided.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 16, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Kang Peng, Cheng-Hsuan Lin, Yu-Ling Hsu, Chun-Chen Chiang
  • Publication number: 20240150803
    Abstract: A non-human organism for upgrading intermediate oxidation products formed by catalytic degradation of alkanes or polystyrenes is provided. The non-human organism is genetically modified to convert the intermediate oxidation products to secondary metabolites, and in particular to include a positive feedback loop construction in the promotor system. A method includes steps of catalytically degrading alkanes or polystyrene in an oxidizing environment to form intermediate products with one or more catalysts and contacting the intermediate products with the non-human organism such that intermediate oxidation products are converted to secondary metabolites.
    Type: Application
    Filed: October 16, 2023
    Publication date: May 9, 2024
    Applicants: UNIVERSITY OF SOUTHERN CALIFORNIA, UNIVERSITY OF KANSAS
    Inventors: Berl OAKLEY, Travis J. WILLIAMS, Yi-Ming CHIANG, Clay C. WANG, Yuhao CHEN, Swati BIJLANI, C. Elizabeth OAKLEY, Christian Anthony RABOT
  • Publication number: 20240151346
    Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment is configured to be disposed on the lid or the body portion and includes a magnetic attraction member and a connecting structure. The magnetic attraction member is adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. The connecting structure includes a fastening member, and the fastening member is adapted to be detachably fastened to the body portion or the lid.
    Type: Application
    Filed: June 9, 2023
    Publication date: May 9, 2024
    Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
  • Publication number: 20240154469
    Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment includes a magnetic attraction member and a connecting structure. The magnetic attraction member is independent from the lid and adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. At least a portion of the connecting structure is fixed to the container.
    Type: Application
    Filed: May 17, 2023
    Publication date: May 9, 2024
    Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
  • Publication number: 20240134135
    Abstract: This is a type of pluggable optoelectronic transceiver that operates while immersed in cooling fluid for data transmission. The pluggable optoelectronic transceiver consists of an optical module, fluid separating colloid, and colloid separating cover. The fluid separating colloid serves to keep the cooling fluid separate from the optical module, while the colloid separating cover further ensures separation between the fluid separating colloid and the optical module. This design prevents the cooling fluid and the fluid separating colloid from infiltrating the optical module and affecting its operation.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 25, 2024
    Inventors: Peter Sin-Te Liu, Joseph Chen-Kwo Liu, Hung-Fu Yeh, Chih-Chun Chiang
  • Publication number: 20240138111
    Abstract: The immersion cooling apparatus includes a cooling tank having a cooling liquid; a cable having a first end and a second end and a protection tube wrapping the cable. The first end connects a first connector, and the second end connects a second connector. At least one of the first end and the second end is located in the cooling tank. The protection tube is configured to separate the cable and the cooling liquid, and the protection tube includes at least one of a hard tube, a soft tube, or a thermal shrinking tube.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 25, 2024
    Applicant: Formerica Optoelectronics, Inc.
    Inventors: Joseph Chen-Kwo Liu, Peter Sin-Te Liu, Chih-Chun CHIANG
  • Publication number: 20240103220
    Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Inventors: Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu
  • Publication number: 20240088053
    Abstract: A semiconductor structure includes a first dielectric layer, a first die, a second die, a first molding, and a second molding. The first die is disposed under the first dielectric layer, and has a first surface facing the first dielectric layer and a second surface opposite to the first surface. The second die is disposed over the first dielectric layer, and has a third surface facing the first dielectric layer and a fourth surface opposite to the third surface. The first molding encapsulates the first die. The second molding is disposed over the first die and the first dielectric layer. The first surface of the first die and the third surface of the second die are in contact with the first dielectric layer. The fourth surface of the second die is partially exposed through the second molding and partially covered by the second molding.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Inventors: CHEN-HUA YU, KAI-CHIANG WU, CHUN-LIN LU
  • Publication number: 20240072426
    Abstract: An antenna and an electronic device including the antenna are provided. The antenna includes a pair of radiators, a pair of feeding elements, first and second feeding ports. The radiators are located beside a geometric origin and separated from each other. The geometric origin is located between the radiators. The feeding elements are located below the pair of radiators and are configured to feed signals to the radiators. The pair of feeding elements includes a first feeding element and a second feeding element that are separated from each other. The first feeding element has a first geometric configuration. The second feeding element has a second geometric configuration that is asymmetric to the first geometric configuration. The first feeding port is electrically connected to the first feeding element. The second feeding port is separated from the first feeding port and electrically connected to the second feeding element.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 29, 2024
    Inventors: Nai-Chen LIU, Chung-Hsin CHIANG, Wun-Jian LIN, Shih-Huang YEH
  • Patent number: 11915969
    Abstract: A semiconductor structure including a substrate and a deep trench isolation structure is provided. The deep trench isolation structure is disposed in the substrate and is not electrically connected to any device. The deep trench isolation structure includes a heat dissipation layer and a dielectric liner layer. The heat dissipation layer is disposed in the substrate. The dielectric liner layer is disposed between the heat dissipation layer and the substrate.
    Type: Grant
    Filed: March 6, 2022
    Date of Patent: February 27, 2024
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Chen-Chiang Liu, Hung-Kwei Liao
  • Patent number: 11912837
    Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: February 27, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, Ming-Chen Chang
  • Publication number: 20240009803
    Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least large particle count (LPC) value of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the LPC value, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.
    Type: Application
    Filed: September 25, 2023
    Publication date: January 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: I-Chen CHIANG, Hwai-Te CHIU, Yi-Tsang CHEN, Chih-Chiang TSENG, Yung-Long CHEN
  • Patent number: D1016054
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 27, 2024
    Assignee: POPSOCKETS LLC
    Inventors: Ivan Chen, James Ridzon, Nicholas Von Bargen, Lawrence Herman Fong, Michael Kory, Randy Yang Chiang
  • Patent number: D1022980
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: April 16, 2024
    Assignee: POPSOCKETS LLC
    Inventors: Vanessa Cantoli-Alves, Ivan Chen, Michael Kory, David Czarnecki, Lawrence Herman Fong, Randy Yang Chiang, David Barnett, David Willson
  • Patent number: D1027928
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: May 21, 2024
    Assignee: POPSOCKETS LLC
    Inventors: Ivan Chen, James Ridzon, Nicholas Von Bargen, Lawrence Herman Fong, Michael Kory, Randy Yang Chiang