Patents by Inventor Chen-Chieh LIEN

Chen-Chieh LIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and pressure sensing module thereof
    Patent number: 10111323
    Abstract: A pressure sensing module for sensing a pressure applied to a circuit board is disclosed. The pressure sensing module includes a conductive pad, an elastic cover, a pushing part and a conductive unit. The conductive pad is connected to the circuit board. The elastic cover is connected to the circuit board and located on the conductive pad. The elastic cover includes a top end. The pushing part is connected to the top end. The conductive unit is located above the conductive pad. When the pushing part is not under pressure, the conductive unit does not move to touch the conductive pad. When the pushing part is under pressure, the pushing part causes the conductive unit to move toward the conductive pad such that the conductive unit touches the conductive pad.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: October 23, 2018
    Assignee: WISTRON CORPORATION
    Inventors: Tien-Chung Tseng, Chen-Chieh Lien
  • Electronic Device and Pressure Sensing Module Thereof
    Publication number: 20180063947
    Abstract: A pressure sensing module for sensing a pressure applied to a circuit board is disclosed, The pressure sensing module includes a conductive pad, an elastic cover, a pushing part and a conductive unit. The conductive pad is connected to the circuit board. The elastic cover is connected to the circuit board and located on the conductive pad. The elastic cover includes a top end. The pushing part is connected to the top end. The conductive unit is located above the conductive pad. When the pushing part is not under pressure, the conductive unit does not move to touch the conductive pad. When the pushing part is under pressure, the pushing part causes the conductive unit to move toward the conductive pad such that the conductive unit touches the conductive pad.
    Type: Application
    Filed: March 27, 2017
    Publication date: March 1, 2018
    Inventors: Tien-Chung TSENG, Chen-Chieh LIEN