Patents by Inventor Chen Chieh WANG
Chen Chieh WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230289063Abstract: An electronic system is provided. A memory device includes a plurality of bank groups. A controller is coupled to the memory device and includes a request queue. The request queue is configured to store a plurality of requests. When the requests correspond to the different bank groups, the controller is configured to access data of the memory device according to a plurality of long burst commands corresponding to the requests. When the requests correspond to the same bank group, the controller is configured to access the data of the memory device according to a plurality of short burst commands corresponding to the requests. The short burst commands correspond to a short burst length, and the long burst commands correspond to a long burst length. The long burst length is twice the short burst length. The memory device is a low-power double data rate synchronous dynamic random access memory.Type: ApplicationFiled: February 16, 2023Publication date: September 14, 2023Inventors: Bo-Wei HSIEH, Chen-Chieh WANG, Szu-Ying CHENG, Jou-Ling CHEN
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Patent number: 11376776Abstract: The present disclosure provides a method of measuring a true shear viscosity profile of a molding material in a capillary and a molding system performing the same. The method includes the operations of: determining a setpoint temperature of the molding material before injecting into the capillary; obtaining an initial shear viscosity profile at the setpoint temperature with respect to a shear rate of the molding material; fitting an initial temperature profile with respect to the shear rate according to the initial shear viscosity based on Cross William-Landel-Ferry model; fitting a first shear viscosity profile and a first temperature profile with respect to the shear rate according to the initial temperature profile based on the Cross-WLF model; and setting the first shear viscosity profile as the true shear viscosity profile when a difference between the first temperature profile and the initial temperature profile is not greater than a threshold.Type: GrantFiled: July 21, 2021Date of Patent: July 5, 2022Assignee: CORETECH SYSTEM CO., LTD.Inventors: Chen-Chieh Wang, Yu-Ho Wen, Guo-Sian Cyue, Chih-Chung Hsu, Chia-Hsiang Hsu, Rong-Yeu Chang
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Publication number: 20220063166Abstract: The present disclosure provides a method of measuring a true shear viscosity profile of a molding material in a capillary and a molding system performing the same. The method includes the operations of: determining a setpoint temperature of the molding material before injecting into the capillary; obtaining an initial shear viscosity profile at the setpoint temperature with respect to a shear rate of the molding material; fitting an initial temperature profile with respect to the shear rate according to the initial shear viscosity based on Cross William-Landel-Ferry model; fitting a first shear viscosity profile and a first temperature profile with respect to the shear rate according to the initial temperature profile based on the Cross-WLF model; and setting the first shear viscosity profile as the true shear viscosity profile when a difference between the first temperature profile and the initial temperature profile is not greater than a threshold.Type: ApplicationFiled: July 21, 2021Publication date: March 3, 2022Inventors: CHEN-CHIEH WANG, YU-HO WEN, GUO-SIAN CYUE, CHIH-CHUNG HSU, CHIA-HSIANG HSU, RONG-YEU CHANG
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Publication number: 20210362388Abstract: A measuring apparatus of bulk viscosity includes a temperature-controlling cylinder having a test chamber for holding a molding material and at least one piston configured to seal an opening of the temperature-controlling cylinder. The temperature-controlling cylinder and the at least one piston are configured for measuring pressures, specific volumes and temperatures (PVT) of the molding material by applying a plurality of cooling rates to the molding material inside the testing chamber under an isobaric environment, or applying a plurality of mechanical pressures to the molding material inside the testing chamber under an isothermal environment.Type: ApplicationFiled: August 6, 2021Publication date: November 25, 2021Inventors: YUAN-JUNG CHANG, RONG-YEU CHANG, CHEN-CHIEH WANG, CHIA-HSIANG HSU
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Publication number: 20210213663Abstract: The present disclosure provides a method for deriving a bulk viscosity of a molding material. The method includes a step of deriving a plurality of parameters in relation to pressures, specific volumes and temperatures (PVT) of the molding material under a plurality of cooling rates and a plurality of mechanical pressures; deriving an equilibrium pressure based on the plurality of parameters obtained from a first slowest cooling rate among the plurality of cooling rates; deriving a rate of volume change of the molding material; and obtaining the bulk viscosity of the molding material based on the rate of volume change.Type: ApplicationFiled: September 14, 2020Publication date: July 15, 2021Inventors: YUAN-JUNG CHANG, RONG-YEU CHANG, CHEN-CHIEH WANG, CHIA-HSIANG HSU
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Patent number: 10940623Abstract: The present disclosure provides a molding system for preparing molding articles. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate a mechanical pressure distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the mechanical pressure distribution of the molding resin is generated based in part on a bulk viscosity effect of the molding resin; and a controller operably communicating with the processing module and configured to operate the molding machine for transferring the fluid molding material into the mold cavity with the molding condition using the generated pressure distribution of the molding resin to perform an actual molding process for preparing the molding article.Type: GrantFiled: September 25, 2020Date of Patent: March 9, 2021Assignee: Coretech System Co., Ltd.Inventors: Yuan-Jung Chang, Rong-Yeu Chang, Chen-Chieh Wang, Chia-Hsiang Hsu
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Patent number: 10422784Abstract: A measuring apparatus includes a base and a testing module. The testing module is received in the base and includes a temperature-controlling bucket, a testing cylinder, and upper and lower pistons. The temperature-controlling bucket extends in a vertical direction and has a bucket wall having a bucket inner surface and a bucket outer surface opposite to the bucket inner surface. The testing cylinder extends in the vertical direction, is received in the temperature-controlling bucket, and has a cylinder wall having a cylinder inner surface and a cylinder outer surface opposite to the cylinder inner surface. The upper and lower pistons plug top and bottom ends of the testing cylinder, respectively. The upper piston has a receiving room located inside the upper piston, and has a piston temperature sensor and a piston heating wire received in the receiving room.Type: GrantFiled: August 24, 2018Date of Patent: September 24, 2019Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong-Yeu Chang, Chen-Chieh Wang, Chia-Hsiang Hsu
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Publication number: 20190120815Abstract: A measuring apparatus includes a base and a testing module. The testing module is received in the base and includes a temperature-controlling bucket, a testing cylinder, and upper and lower pistons. The temperature-controlling bucket extends in a vertical direction and has a bucket wall having a bucket inner surface and a bucket outer surface opposite to the bucket inner surface. The testing cylinder extends in the vertical direction, is received in the temperature-controlling bucket, and has a cylinder wall having a cylinder inner surface and a cylinder outer surface opposite to the cylinder inner surface. The upper and lower pistons plug top and bottom ends of the testing cylinder, respectively. The upper piston has a receiving room located inside the upper piston, and has a piston temperature sensor and a piston heating wire received in the receiving room.Type: ApplicationFiled: August 24, 2018Publication date: April 25, 2019Inventors: YUING CHANG, RONG-YEU CHANG, CHEN-CHIEH WANG, CHIA-HSIANG HSU
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Patent number: 10268519Abstract: A scheduling method is provided. The method includes: recording a next instruction and a ready state of each thread group in a scoreboard; determining whether there is any ready thread group whose ready state is affirmative; determining whether a load/store unit is available, wherein the load/store unit is configured to access a data memory unit; when the load/store unit is available, determining whether the ready thread groups include a data access thread group, wherein the next instruction of the data access thread group is related to accessing the data memory unit; selecting a target thread group from the data access thread groups; and dispatching the target thread group to the load/store unit for execution.Type: GrantFiled: December 29, 2015Date of Patent: April 23, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Heng-Yi Chen, Chung-Ho Chen, Chen-Chieh Wang, Juin-Ming Lu, Chun-Hung Lai, Hsun-Lun Huang
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Publication number: 20170139751Abstract: A scheduling method is provided. The method includes: recording a next instruction and a ready state of each thread group in a scoreboard; determining whether there is any ready thread group whose ready state is affirmative; determining whether a load/store unit is available, wherein the load/store unit is configured to access a data memory unit; when the load/store unit is available, determining whether the ready thread groups include a data access thread group, wherein the next instruction of the data access thread group is related to accessing the data memory unit; selecting a target thread group from the data access thread groups; and dispatching the target thread group to the load/store unit for execution.Type: ApplicationFiled: December 29, 2015Publication date: May 18, 2017Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Heng-Yi CHEN, Chung-Ho CHEN, Chen-Chieh WANG, Juin-Ming LU, Chun-Hung LAI, Hsun-Lun HUANG
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Patent number: 8768662Abstract: A computer-implemented method and non-transitory computer medium for calculating a shrinkage of a molding product comprises a step of using a computer processor to calculate a molding pressure of a molding fluid in a molding cavity by taking into consideration an increase of a shear viscosity of the molding fluid by a decrease of a shear rate, and a step of calculating the shrinkage of the molding products by taking into consideration a variation of a specific volume of the molding fluid as the molding pressure and a molding temperature decrease.Type: GrantFiled: November 27, 2013Date of Patent: July 1, 2014Assignee: Coretech System Co., Ltd.Inventors: Rong Yeu Chang, Chia Hsiang Hsu, Hsien Sen Chiu, Shih Po Sun, Chen Chieh Wang, Huan Chang Tseng
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Publication number: 20140156237Abstract: A computer-implemented method and non-transitory computer medium for calculating a shrinkage of a molding product comprises a step of using a computer processor to calculate a molding pressure of a molding fluid in a molding cavity by taking into consideration an increase of a shear viscosity of the molding fluid by a decrease of a shear rate, and a step of calculating the shrinkage of the molding products by taking into consideration a variation of a specific volume of the molding fluid as the molding pressure and a molding temperature decrease.Type: ApplicationFiled: November 27, 2013Publication date: June 5, 2014Applicant: CORETECH SYSTEM CO., LTD.Inventors: Rong Yeu CHANG, Chia Hsiang HSU, Hsien Sen CHIU, Shih Po SUN, Chen Chieh WANG, Huan Chang TSENG
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Patent number: D1003928Type: GrantFiled: April 29, 2021Date of Patent: November 7, 2023Assignee: CORETECH SYSTEM CO., LTD.Inventors: Cheng-Kuang Lee, Chen-Chieh Wang, Chia-Hsiang Hsu, Rong-Yeu Chang