Abstract: Structures with doping free connections and methods of fabrication are provided. An exemplary structure includes a substrate; a first region of a first conductivity type formed in the substrate; an overlying layer located over the substrate; a well region of a second conductivity type formed in the overlying layer; a conductive plug laterally adjacent to the well region and extending through the overlying layer to electrically contact with the first region; and a passivation layer located between the conductive plug and the well region.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: An electronic system is provided. A memory device includes a plurality of bank groups. A controller is coupled to the memory device and includes a request queue. The request queue is configured to store a plurality of requests. When the requests correspond to the different bank groups, the controller is configured to access data of the memory device according to a plurality of long burst commands corresponding to the requests. When the requests correspond to the same bank group, the controller is configured to access the data of the memory device according to a plurality of short burst commands corresponding to the requests. The short burst commands correspond to a short burst length, and the long burst commands correspond to a long burst length. The long burst length is twice the short burst length. The memory device is a low-power double data rate synchronous dynamic random access memory.

Abstract: The present disclosure provides a method of measuring a true shear viscosity profile of a molding material in a capillary and a molding system performing the same. The method includes the operations of: determining a setpoint temperature of the molding material before injecting into the capillary; obtaining an initial shear viscosity profile at the setpoint temperature with respect to a shear rate of the molding material; fitting an initial temperature profile with respect to the shear rate according to the initial shear viscosity based on Cross William-Landel-Ferry model; fitting a first shear viscosity profile and a first temperature profile with respect to the shear rate according to the initial temperature profile based on the Cross-WLF model; and setting the first shear viscosity profile as the true shear viscosity profile when a difference between the first temperature profile and the initial temperature profile is not greater than a threshold.

Abstract: The present disclosure provides a method of measuring a true shear viscosity profile of a molding material in a capillary and a molding system performing the same. The method includes the operations of: determining a setpoint temperature of the molding material before injecting into the capillary; obtaining an initial shear viscosity profile at the setpoint temperature with respect to a shear rate of the molding material; fitting an initial temperature profile with respect to the shear rate according to the initial shear viscosity based on Cross William-Landel-Ferry model; fitting a first shear viscosity profile and a first temperature profile with respect to the shear rate according to the initial temperature profile based on the Cross-WLF model; and setting the first shear viscosity profile as the true shear viscosity profile when a difference between the first temperature profile and the initial temperature profile is not greater than a threshold.

Abstract: A measuring apparatus of bulk viscosity includes a temperature-controlling cylinder having a test chamber for holding a molding material and at least one piston configured to seal an opening of the temperature-controlling cylinder. The temperature-controlling cylinder and the at least one piston are configured for measuring pressures, specific volumes and temperatures (PVT) of the molding material by applying a plurality of cooling rates to the molding material inside the testing chamber under an isobaric environment, or applying a plurality of mechanical pressures to the molding material inside the testing chamber under an isothermal environment.

Abstract: The present disclosure provides a method for deriving a bulk viscosity of a molding material. The method includes a step of deriving a plurality of parameters in relation to pressures, specific volumes and temperatures (PVT) of the molding material under a plurality of cooling rates and a plurality of mechanical pressures; deriving an equilibrium pressure based on the plurality of parameters obtained from a first slowest cooling rate among the plurality of cooling rates; deriving a rate of volume change of the molding material; and obtaining the bulk viscosity of the molding material based on the rate of volume change.

Abstract: The present disclosure provides a molding system for preparing molding articles. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate a mechanical pressure distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the mechanical pressure distribution of the molding resin is generated based in part on a bulk viscosity effect of the molding resin; and a controller operably communicating with the processing module and configured to operate the molding machine for transferring the fluid molding material into the mold cavity with the molding condition using the generated pressure distribution of the molding resin to perform an actual molding process for preparing the molding article.

Abstract: A measuring apparatus includes a base and a testing module. The testing module is received in the base and includes a temperature-controlling bucket, a testing cylinder, and upper and lower pistons. The temperature-controlling bucket extends in a vertical direction and has a bucket wall having a bucket inner surface and a bucket outer surface opposite to the bucket inner surface. The testing cylinder extends in the vertical direction, is received in the temperature-controlling bucket, and has a cylinder wall having a cylinder inner surface and a cylinder outer surface opposite to the cylinder inner surface. The upper and lower pistons plug top and bottom ends of the testing cylinder, respectively. The upper piston has a receiving room located inside the upper piston, and has a piston temperature sensor and a piston heating wire received in the receiving room.

Abstract: A measuring apparatus includes a base and a testing module. The testing module is received in the base and includes a temperature-controlling bucket, a testing cylinder, and upper and lower pistons. The temperature-controlling bucket extends in a vertical direction and has a bucket wall having a bucket inner surface and a bucket outer surface opposite to the bucket inner surface. The testing cylinder extends in the vertical direction, is received in the temperature-controlling bucket, and has a cylinder wall having a cylinder inner surface and a cylinder outer surface opposite to the cylinder inner surface. The upper and lower pistons plug top and bottom ends of the testing cylinder, respectively. The upper piston has a receiving room located inside the upper piston, and has a piston temperature sensor and a piston heating wire received in the receiving room.

Abstract: A scheduling method is provided. The method includes: recording a next instruction and a ready state of each thread group in a scoreboard; determining whether there is any ready thread group whose ready state is affirmative; determining whether a load/store unit is available, wherein the load/store unit is configured to access a data memory unit; when the load/store unit is available, determining whether the ready thread groups include a data access thread group, wherein the next instruction of the data access thread group is related to accessing the data memory unit; selecting a target thread group from the data access thread groups; and dispatching the target thread group to the load/store unit for execution.

Abstract: A scheduling method is provided. The method includes: recording a next instruction and a ready state of each thread group in a scoreboard; determining whether there is any ready thread group whose ready state is affirmative; determining whether a load/store unit is available, wherein the load/store unit is configured to access a data memory unit; when the load/store unit is available, determining whether the ready thread groups include a data access thread group, wherein the next instruction of the data access thread group is related to accessing the data memory unit; selecting a target thread group from the data access thread groups; and dispatching the target thread group to the load/store unit for execution.

Abstract: A computer-implemented method and non-transitory computer medium for calculating a shrinkage of a molding product comprises a step of using a computer processor to calculate a molding pressure of a molding fluid in a molding cavity by taking into consideration an increase of a shear viscosity of the molding fluid by a decrease of a shear rate, and a step of calculating the shrinkage of the molding products by taking into consideration a variation of a specific volume of the molding fluid as the molding pressure and a molding temperature decrease.

Abstract: A computer-implemented method and non-transitory computer medium for calculating a shrinkage of a molding product comprises a step of using a computer processor to calculate a molding pressure of a molding fluid in a molding cavity by taking into consideration an increase of a shear viscosity of the molding fluid by a decrease of a shear rate, and a step of calculating the shrinkage of the molding products by taking into consideration a variation of a specific volume of the molding fluid as the molding pressure and a molding temperature decrease.