Abstract: The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization and heating, the composition comprising a first component comprising: one or more acrylate-blocked isocyanates, one or more acrylate monomers and at least one photoinitiator. The composition further comprising a second component comprising one or more amine curatives. The invention also provides a method of forming a chemical-mechanical polishing pad comprising preparing a composition comprising: a first component comprising one or more acrylate-blocked isocyanates, one or more acrylate monomers and at least one photoinitiator. The composition further comprising a second component comprising one or more amine curatives. The method further comprising exposing at least a layer of the composition to ultraviolet light, thereby initiating a polymerization reaction and thus forming at least a layer of solidified pad material; and heating the layer.

Abstract: A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.

Abstract: A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.

Abstract: The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator. The invention also provides a method of forming a chemical-mechanical polishing pad using the UV-curable resin.

Abstract: A subpad for a chemical-mechanical polishing pad, the subpad having porogens with polymeric shells. Methods of fabricating the subpad and polishing pads with a polishing surface layer bonded to the subpad layer are also described.

Abstract: The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator. The invention also provides a method of forming a chemical-mechanical polishing pad using the UV-curable resin.

Abstract: A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.

Abstract: A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.

Abstract: A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.

Abstract: A method for preparing low endotoxin collagen is disclosed. The method includes the following steps: providing an animal skin, removing residual adipose tissues and muscle tissues, swelling the animal skin by alkaline solution, peeling the upper and lower surfaces of the animal skin, hydrolyzing the animal skin by a solution including hydrolase, salting out the low endotoxin collagen by salt solutions, and washing the low endotoxin collagen by alcohols.

Abstract: A method for preparing low endotoxin collagen is disclosed. The method includes the following steps: providing an animal skin, removing residual adipose tissues and muscle tissues, swelling the animal skin by alkaline solution, peeling the upper and lower surfaces of the animal skin, hydrolyzing the animal skin by a solution including hydrolase, salting out the low endotoxin collagen by salt solutions, and washing the low endotoxin collagen by alcohols.

Abstract: A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.

Abstract: A fluidic probe comprising a plurality of oriented fibers with individual fibers having nano-pores in the fiber bodies, the oriented fibers being twisted together, wherein the twisted oriented fibers form micro-pores between the individual fibers, is disclosed. The fluidic probe exhibits excellent flexibility, deployability and absorptive capacity. The enhanced absorptive capacity is due to the fluid absorption via capillary action of the nano-pores and fluid transport via the micro-pores. The probes can also be formed so as to be remotely controlled by electromagnetic fields and thus be used in a hands-free fashion. With these probes, the paradigm of a stationary microfluidic platform can be shifted to include flexible structures that can include multiple microfluidic sensors in a single fibrous probe.

Abstract: A conveyance arm device for conveying wafers. The conveyance arm device comprises a conducting seat, at least a tweezer, and at least a conducting path. The conducting seat controls and drives the conveying operation of the tweezer. The tweezer comprises a first end and a second end, and a first surface and a second surface between the first and the second ends. The first end of the tweezer is connected to the conducting seat. The conducting film is adhered to the second surface of the tweezer.

Abstract: A method for processing a poly defect is described. A substrate is provided, and a first oxide layer is formed on the substrate. A polysilicon layer is formed on the first oxide layer, and a poly defect is formed on the polysilicon layer surface simultaneous with polysilicon layer formation. A second oxide layer is formed conformal to the substrate, a portion of the second oxide layer and the poly defect are removed by polishing until a thin second oxide layer and a thin poly defect layer are formed. Finally, the thin second oxide layer is removed.

Abstract: A method of forming a contact via includes forming a wiring, a first insulator layer, and a spin-on glass layer, respectively, over a semiconductor substrate. Fluorine ions are implanted into the spin-on glass layer. A second insulator layer is formed over the spin-on glass layer. The wiring is exposed by patterning the second insulator layer, the spin-on glass layer, and the first insulator layer, respectively.