Patents by Inventor Chen Chin Yu

Chen Chin Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12009575
    Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.
    Type: Grant
    Filed: April 18, 2023
    Date of Patent: June 11, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
  • Patent number: 12002797
    Abstract: A LED device includes multiple LED chips each including opposite first and second surfaces, a side surface, and an electrode assembly disposed on the second surface and including first and second electrodes. The first surface of each of the LED chips is a light exit surface. The LED device further includes an electric circuit layer assembly disposed on the second surfaces of the LED chips and having opposite first and second surfaces and a side surface. The first surface is electrically connected to the first and second electrodes. The LED device further includes an encapsulating layer enclosing the LED chips and the electric circuit layer assembly to expose the second surface of the electric circuit layer assembly.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: June 4, 2024
    Assignee: QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Junpeng Shi, Chen-Ke Hsu, Chang-Chin Yu, Yanqiu Liao, Zhenduan Lin, Zhaowu Huang, Senpeng Huang
  • Patent number: 8337215
    Abstract: The invention relates to a card-edge connector for securing and electrically connecting an electronic card to a circuit board. The card-edge connector includes an insulative, a set of first conductive terminals, a spacer, and a pair of card latching members. The insulative housing includes a plurality of first terminal receiving passageways positioned on an upper surface thereof and a plurality of second terminal receiving passageways positioned on the lower surface of the insulative housing. The set of first conductive terminals are alternately positioned in the plurality of first terminal receiving passageways and include a plurality of exposed end portions. The set of second conductive terminals are positioned in the plurality of second terminal receiving passageways and include a plurality of exposed end portions of the set of second conductive terminals.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: December 25, 2012
    Assignee: Tyco Electronics Holdings (Bermuda) No. 7 Limited
    Inventor: Chen Chin Yu
  • Publication number: 20120028482
    Abstract: The invention relates to a card-edge connector for securing and electrically connecting an electronic card to a circuit board. The card-edge connector includes an insulative, a set of first conductive terminals, a spacer, and a pair of card latching members. The insulative housing includes a plurality of first terminal receiving passageways positioned on an upper surface thereof and a plurality of second terminal receiving passageways positioned on the lower surface of the insulative housing. The set of first conductive terminals are alternately positioned in the plurality of first terminal receiving passageways and include a plurality of exposed end portions. The set of second conductive terminals are positioned in the plurality of second terminal receiving passageways and include a plurality of exposed end portions of the set of second conductive terminals.
    Type: Application
    Filed: July 26, 2011
    Publication date: February 2, 2012
    Inventor: Chen Chin Yu