Patents by Inventor Chen-Chiu Tseng

Chen-Chiu Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7358199
    Abstract: A method of fabricating semiconductor integrated circuits includes (1) providing a spin-on tool comprising a rotatable platen for holding and spinning a wafer disposed thereon, a fluid supply system for providing spin-on solution onto the wafer, and a detector fixed in a position above the wafer, wherein the wafer has a radius R; (2) spin-on coating the wafer by depositing the spin-on solution onto surface of the wafer from its center and spinning-off to leave a spin coat material layer; and (3) spinning the wafer and scanning the spin coat material layer by impinging an incident light beam emanated from the fixed detector and detecting a reflected light beam.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: April 15, 2008
    Assignee: United Microelectronics Corp.
    Inventors: I-Wen Wu, Chen-Chiu Tseng
  • Publication number: 20060281335
    Abstract: A method of fabricating semiconductor integrated circuits includes (1) providing a spin-on tool comprising a rotatable platen for holding and spinning a wafer disposed thereon, a fluid supply system for providing spin-on solution onto the wafer, and a detector fixed in a position above the wafer, wherein the wafer has a radius R; (2) spin-on coating the wafer by depositing the spin-on solution onto surface of the wafer from its center and spinning-off to leave a spin coat material layer; and (3) spinning the wafer and scanning the spin coat material layer by impinging an incident light beam emanated from the fixed detector and detecting a reflected light beam.
    Type: Application
    Filed: June 9, 2005
    Publication date: December 14, 2006
    Inventors: I-Wen Wu, Chen-Chiu Tseng
  • Patent number: 6097992
    Abstract: A method for avoiding scratching of wafer backs being held by a vacuum to a fetch arm of a stepper machine for insertion into a cassette holder includes releasing the vacuum in the suction head of the fetch are before the wafer enters the cassette holder. The release of vacuum reduces frictional force between the wafer back and the suction head when the wafer accidentally hits the side of the cassette holder. Therefore, the vacuum release method avoids scratching of wafer backs by the suction head of the fetch arm. The invention requires a separate vacuum release controller to release the vacuum in the suction head for a prescribed delaying period after the fetch arm starts moving toward the cassette holder.
    Type: Grant
    Filed: December 16, 1997
    Date of Patent: August 1, 2000
    Assignee: United Semiconductor Corp.
    Inventors: Tien-Ya Chen, Chen-Chiu Tseng