Abstract: Disclosed is a thermal conduction-electrical conduction isolated circuit board with a ceramic substrate and a power transistor embedded, mainly comprising: a dielectric material layer, a heat-dissipating ceramic block, a securing portion, a stepped metal electrode layer, a power transistor, and a dielectric material packaging, wherein a via hole is formed in the dielectric material layer, the heat-dissipating ceramic block is correspondingly embedded in the via hole, the heat-dissipating ceramic block has a thermal conductivity higher than that of the dielectric material layer and a thickness less than that of the dielectric material layer, the stepped metal electrode layer conducts electricity and heat for the power transistor, the dielectric material packaging is configured to partially expose the source connecting pin, drain connecting pin, and gate connecting pin of the encapsulated stepped metal electrode layer.

Abstract: A flow guider has a guiding body, a blade edge and two tips. The guiding body has two guiding surfaces configured symmetrically with each other. Each guiding surface is convex. The blade edge is curved, is formed between and connects the guiding surfaces and has two opposite ends. The tips are formed respectively at the ends of the blade edge and each tip merges the guiding surfaces and one end of the blade edge. The flow guider divides and guides oncoming airflow or waterflow to smoothly pass across the flow guider with reduced turbulence so that vehicles or bridge piers mounted with the flow guiders suffer less vibration, shaking and damage when encountering airflow or waterflow.