Abstract: A method of making an image sensor includes depositing a shield layer over a substrate, wherein the substrate comprises a first photodiode (PD) and a second PD. The method further includes etching the shield layer to define a first recess aligned with the first PD and a second recess aligned with the second PD. The method further includes depositing a flicker reduction layer in the first recess and in the second recess. The method further includes etching the flicker reduction layer to remove the flicker reduction layer from the first recess.

Abstract: An image sensor includes a substrate and a first photodiode (PD) having a first size in the substrate. The image sensor further includes a second PD having a second size in the substrate, wherein the first size is different from the second size. The image sensor further includes a first buffer layer over the substrate. The image sensor further includes a shield layer over the first buffer, wherein the first buffer layer and the shield layer define a first recess aligned with the first PD and a second recess aligned with the second PD. The image sensor further includes a flicker reduction layer in the first recess, wherein the second recess is free of the flicker reduction layer.

Abstract: An image sensor includes a substrate and a first photodiode (PD) having a first size in the substrate. The image sensor further includes a second PD having a second size in the substrate, wherein the first size is different from the second size. The image sensor further includes a first buffer layer over the substrate. The image sensor further includes a shield layer over the first buffer, wherein the first buffer layer and the shield layer define a first recess aligned with the first PD and a second recess aligned with the second PD. The image sensor further includes a flicker reduction layer in the first recess, wherein the second recess is free of the flicker reduction layer.

Abstract: A server and a cloud computing resource optimization method thereof for big data cloud computing architecture are provided. The server runs a dynamic scaling system to perform the following operations: receiving a task message; executing a profiling procedure to generate a profile based on an to-be-executed task recorded in the task message; executing a classifying procedure to determine a task classification of the to-be-executed task; executing a prediction procedure to obtain a plurality of predicted execution times corresponding to a plurality of computing node numbers, a computing node type and a system parameter of the to-be-executed task; executing an optimization procedure to determine a practical computing node number of the to-be-executed task; and transmitting an optimization output message to a management server to make the management server allocate at least one data computing system to execute a program file of the to-be-executed task.

Abstract: A server and a cloud computing resource optimization method thereof for cloud big data computing architecture are provided. The server runs a dynamic scaling system to perform the following operations: receiving a task message; executing a profiling procedure to generate a profile based on an to-be-executed task recorded in the task message; executing a classifying procedure to determine a task classification of the to-be-executed task; executing a prediction procedure to obtain a plurality of predicted execution times corresponding to a plurality of computing node numbers, a computing node type and a system parameter of the to-be-executed task; executing an optimization procedure to determine a practical computing node number of the to-be-executed task; and transmitting an optimization output message to a management server to make the management server allocate at least one data computing system to execute a program file of the to-be-executed task.

Abstract: The present disclosure provides a charging system comprising a first charging module and a second charging module. The first charging module comprises a first charging electrode, a second charging electrode, a charge controller and at least one rechargeable battery. The first charging electrode and the second charging electrode are coupled to the charge controller. The charge controller is coupled to the rechargeable battery. The second charging electrode is substantially annular, and the first charging electrode is surrounded by the second charging electrode. The second charging module comprises a first dock electrode, a second dock electrode and a battery charger. When the first charging module and the second charging module are electrically coupled, the first charging electrode is electrically coupled to the first dock electrode, and the second charging electrode is electrically coupled to the second dock electrode.

Abstract: A wireless earphone able to accept local user input for controlling of an independent audio-transmitting and communications device includes at least an input unit and a microcontroller. Various input modes and corresponding function-executing instructions are stored in the microcontroller. A user may apply different types of input to the input unit. Upon recognizing one input mode based on the user's input, the microcontroller executes one corresponding instruction to switches between operating modes of the wireless earphone.

Abstract: The present disclosure generally relates to a radiofrequency communication device. The radiofrequency communication device has a rechargeable battery for mobile use and the charging contacts needs specific requirement for volume minimization and user convenience. Additional electrical circuit or integrated chip are also applied for radiofrequency communication and charging control.

Abstract: A method of manufacturing a semiconductor structure includes providing a first wafer including a surface, removing some portions of the first wafer over the surface to form a plurality of recesses extended over at least a portion of the surface of the first wafer, providing a second wafer, and disposing the second wafer over the surface of the first wafer.

Abstract: Provision of fabrication, construction, and/or assembly of a memory device including a two-terminal memory portion is described herein. The two-terminal memory device fabrication can provide enhanced capabilities in connection with precisely tuning on-state current over a greater possible range.

Abstract: A method of manufacturing a semiconductor structure includes providing a first wafer including a surface, removing some portions of the first wafer over the surface to form a plurality of recesses extended over at least a portion of the surface of the first wafer, providing a second wafer, and disposing the second wafer over the surface of the first wafer.

Abstract: A semiconductor structure includes a wafer including a first surface and a periphery, a plurality of protrusions protruded from the first surface and a plurality of recesses spaced from each other by the plurality of protrusions, and each of the plurality of recesses is extended from the periphery of the wafer and is elongated across the first surface of the wafer.

Abstract: A backside illuminated (BSI) image sensor device includes a substrate including a front side and a back side; a radiation-sensing region in the substrate; a metal post with a longitudinal height and disposed over the back side; and a color filter adjacent to the metal post and substantially over the radiation-sensing region. The radiation-sensing region is configured to detect a radiation wave entering from the back side.

Abstract: A semiconductor structure includes a wafer including a first surface and a periphery, a plurality of protrusions protruded from the first surface and a plurality of recesses spaced from each other by the plurality of protrusions, and each of the plurality of recesses is extended from the periphery of the wafer and is elongated across the first surface of the wafer.

Abstract: Provision of fabrication, construction, and/or assembly of a memory device including a two-terminal memory portion is described herein. The two-terminal memory device fabrication can provide enhanced capabilities in connection with precisely tuning on-state current over a greater possible range.

Abstract: Provision of fabrication, construction, and/or assembly of a memory device including a two-terminal memory portion is described herein. The two-terminal memory device fabrication can provide enhanced capabilities in connection with precisely tuning on-state current over a greater possible range.

Abstract: An interlocking method and its structure for wheel-rim cover is provided and includes a plurality of engaging seats integrally formed along the peripheral edge of the rear side of a wheel-rim cover body. Each engaging seat has an interlocking block pivotally coupled thereto. An inner edge of the interlocking block forms the pivotal axis thereof and is displaceably disposed on an inclined surface of an engaging slot formed in the engaging seat. The outer edge of the interlocking block is displaceably disposed in an engaging groove of the wheel-rim body. By that arrangement, displacement of the wheel-rim cover body toward the hub of the wheel-rim body results in a displacement of the interlocking block to provide respective frictional engagement of the inner and outer ends of the interlocking block with the inclined surface of the engaging slot and the surface of the engaging groove.

Abstract: This invention relates to an wheel cover arresting device in which a plurality of retaining sockets are integrally formed at the rear side of the wheel cover body. Each retaining socket is pivotedly connected with a catch member at one end, and the other end of the catch member abuts against a groove provided on the wheel cover body. Furthermore, a wave-shape elastic portion with definite elastic force is formed on each catch member. Two ends of each catch member abut against the wheel disk body and the wheel cover body respectively after the completion of assembly process. An appropriate force has to be applied so as to detach the wheel cover body from the front side of the wheel disk body. This can also ensure that the wheel cover body will not easily be stripped from the wheel disk body.