Patents by Inventor Chen Chun HUANG

Chen Chun HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240156092
    Abstract: The invention relates to a composition for promoting the growth of legumes. The composition includes auxin, choline chloride and ?-aminobutyric acid (GABA). The invention also relates to a method for promoting the growth of legumes.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 16, 2024
    Inventors: Ting-Wen CHENG, Cho-Chun HUANG, Gui-Jun Li, Kai XIA, Chen-Pang WU
  • Publication number: 20240133421
    Abstract: An electronic device includes a monitor stand, a hinge mechanism, and an operation element. The hinge mechanism includes a back plate, a speed reduction assembly, and a friction assembly. The back plate is fixed to the monitor stand. The speed reduction assembly includes an input plate and a speed reduction member. The speed reduction member is arranged on the input plate. The friction assembly is arranged between the back plate and the input plate. The operation element is connected to the speed reduction member. A rotation center of the operation element coincides with an axis of the back plate and the speed reduction member are coaxially arranged.
    Type: Application
    Filed: January 17, 2023
    Publication date: April 25, 2024
    Inventors: Chih-Wei KUO, Yu-Chun HUNG, Che-Yen CHOU, Chen-Wei TSAI, Hsiang-Wen HUANG
  • Publication number: 20240128216
    Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 18, 2024
    Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Ching-Chun Wang, Hsiao-Hui Tseng, Chen-Jong Wang, Dun-Nian Yaung
  • Patent number: 11935981
    Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
  • Publication number: 20240079434
    Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.
    Type: Application
    Filed: January 5, 2023
    Publication date: March 7, 2024
    Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Chen-Jong Wang, Dun-Nian Yaung, Yu-Chun Chen
  • Patent number: 11917923
    Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
  • Publication number: 20200127650
    Abstract: A power-on reset circuit arranged to generate a reset signal according to a power supply voltage includes: a power supply voltage detector, a holding circuit, a reference voltage generator and a reset determination circuit. The power supply voltage detector is controllable by the reset signal, and arranged to detect a level of the power supply voltage to generate a detection signal. The holding circuit is arranged to output an enablement signal according to the detection signal, wherein the holding circuit selectively maintains a level of the enablement signal according to a level of the detection signal. The reference voltage generator is controllable by the enablement signal to selectively output a reference voltage. The reset determination circuit is arranged to output the reset signal according to the power supply voltage and the reference voltage.
    Type: Application
    Filed: March 25, 2019
    Publication date: April 23, 2020
    Inventors: ZHENGXIANG WANG, Chen-Chun Huang, Hung-Yu Lin
  • Patent number: 10608619
    Abstract: A power-on reset circuit arranged to generate a reset signal according to a power supply voltage includes: a power supply voltage detector, a holding circuit, a reference voltage generator and a reset determination circuit. The power supply voltage detector is controllable by the reset signal, and arranged to detect a level of the power supply voltage to generate a detection signal. The holding circuit is arranged to output an enablement signal according to the detection signal, wherein the holding circuit selectively maintains a level of the enablement signal according to a level of the detection signal. The reference voltage generator is controllable by the enablement signal to selectively output a reference voltage. The reset determination circuit is arranged to output the reset signal according to the power supply voltage and the reference voltage.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: March 31, 2020
    Assignee: Artery Technology Co., Ltd.
    Inventors: Zhengxiang Wang, Chen-Chun Huang, Hung-Yu Lin
  • Patent number: 10565381
    Abstract: A method and apparatus for performing firmware programming on a microcontroller chip and the associated microcontroller chip are provided.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: February 18, 2020
    Assignee: Faraday Technology Corp.
    Inventors: Chun-Yuan Lai, Chen-Chun Huang
  • Publication number: 20190278912
    Abstract: A method and apparatus for performing firmware programming on a microcontroller chip and the associated microcontroller chip are provided.
    Type: Application
    Filed: June 19, 2018
    Publication date: September 12, 2019
    Inventors: Chun-Yuan Lai, Chen-Chun Huang
  • Patent number: 9542113
    Abstract: An embodiment of an apparatus for securing program code stored in a non-volatile memory is introduced. A non-volatile memory contains a first region and a second region. Two NVMMCS (non-volatile memory management controllers) are respectively coupled to the two regions. A programming command-and-address decoder is coupled to the NVMMCS. The programming command-and-address decoder instructs the first NVMMC to erase data from the first region when receiving a command to erase the first region via a programming interface, and instructs the second NVMMC to erase data from the second region when receiving a command to erase the second region via the programming interface.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: January 10, 2017
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventors: Chen Chun Huang, Kuo En Hsu
  • Publication number: 20160274811
    Abstract: An embodiment of an apparatus for securing program code stored in a non-volatile memory is introduced. A non-volatile memory contains a first region and a second region. Two NVMMCS (non-volatile memory management controllers) are respectively coupled to the two regions. A programming command-and-address decoder is coupled to the NVMMCS. The programming command-and-address decoder instructs the first NVMMC to erase data from the first region when receiving a command to erase the first region via a programming interface, and instructs the second NVMMC to erase data from the second region when receiving a command to erase the second region via the programming interface.
    Type: Application
    Filed: May 31, 2016
    Publication date: September 22, 2016
    Inventors: Chen Chun HUANG, Kuo En HSU
  • Patent number: 9430408
    Abstract: An embodiment of an apparatus for securing program code stored in a non-volatile memory is introduced. A non-volatile memory contains a first region and a second region. Two NVMMCS (non-volatile memory management controllers respectively coupled to the two regions. A programming command-and-address decoder is coupled to the NVMMCS. The programming command-and-address decoder instructs the first NVMMC to erase data from the first region when receiving a command to erase the first region via a programming interface, and instructs the second NVMMC to erase data from the second region when receiving a command to erase the second region via the programming interface.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: August 30, 2016
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventors: Chen Chun Huang, Kuo En Hsu
  • Publication number: 20150149703
    Abstract: An embodiment of an apparatus for securing program code stored in a non-volatile memory is introduced. A non-volatile memory contains a first region and a second region. Two NVMMCS (non-volatile memory management controllers respectively coupled to the two regions. A programming command-and-address decoder is coupled to the NVMMCS. The programming command-and-address decoder instructs the first NVMMC to erase data from the first region when receiving a command to erase the first region via a programming interface, and instructs the second NVMMC to erase data from the second region when receiving a command to erase the second region via the programming interface.
    Type: Application
    Filed: March 27, 2014
    Publication date: May 28, 2015
    Inventors: Chen Chun HUANG, Kuo En HSU