Patents by Inventor Chen-Chun LIEN

Chen-Chun LIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8764251
    Abstract: A heat dissipation structure for a light bulb assembly includes a holder, a heat dissipating cover, and a light seat. The holder includes a socket and a receiving space defined in the socket to receive a circuit board, the socket includes a first abutting portion formed on a peripheral side thereof and at least one first coupling portion arranged on a lateral side thereof. The heat dissipating cover includes a through hole for inserting the socket, and at least one cooling fin arranged around an outer peripheral side thereof. The light seat is used for installing a LED light, which includes a second coupling portion connected with the at least one first coupling portion, and a second abutting portion retaining the heat dissipating cover with the first abutting portion.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: July 1, 2014
    Assignee: Everspring Industry Co., Ltd.
    Inventor: Chen-Chun Lien
  • Publication number: 20130292106
    Abstract: A heat dissipation structure for a light bulb assembly includes a holder, a heat dissipating cover, and a light seat. The holder includes a socket and a receiving space defined in the socket to receive a circuit board, the socket includes a first abutting portion formed on a peripheral side thereof and at least one first coupling portion arranged on a lateral side thereof. The heat dissipating cover includes a through hole for inserting the socket, and at least one cooling fin arranged around an outer peripheral side thereof. The light seat is used for installing a LED light, which includes a second coupling portion connected with the at least one first coupling portion, and a second abutting portion retaining the heat dissipating cover with the first abutting portion.
    Type: Application
    Filed: May 2, 2012
    Publication date: November 7, 2013
    Inventor: Chen-Chun LIEN