Patents by Inventor Chen-Chun Liu

Chen-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10103104
    Abstract: A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: October 16, 2018
    Assignee: Unimicron Technology Corp.
    Inventors: Yung-Ching Lin, Chen-Chun Liu
  • Publication number: 20180005949
    Abstract: A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.
    Type: Application
    Filed: September 7, 2016
    Publication date: January 4, 2018
    Applicant: Unimicron Technology Corp.
    Inventors: Yung-Ching Lin, Chen-Chun Liu
  • Publication number: 20050230803
    Abstract: A leadframe packaging structure mainly includes a carrier consisting of more than one chip and a leadframe and provided with more than one connecting section; more than one terminal electrically connected to the chips;, and a packaging material applied to a top of the leadframe and the connecting sections to firmly connect to the leadframe via the connecting sections without the risk of separating therefrom.
    Type: Application
    Filed: June 10, 2004
    Publication date: October 20, 2005
    Inventor: Chen-Chun Liu