Patents by Inventor Chen-Fa Tsai

Chen-Fa Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11114378
    Abstract: The present disclosure provides a semiconductor structure having an ultra thick metal (UTM). The semiconductor structure includes a substrate, a metal layer over the substrate, and an UTM over the metal layer. An area density of the UTM is greater than 40% and a thickness of the UTM is equal to or greater than 6 micrometer. The present disclosure provides a method for manufacturing a semiconductor structure having a UTM. The method includes patterning a dielectric layer with a plurality of trenches by a first mask, patterning a photoresist positioning on a mesa between adjacent trenches by a second mask, and selectively plating conductive materials in the plurality of trenches.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: September 7, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chen-Fa Lu, Cheng-Yuan Tsai, Ching-Chung Hsu, Chung-Long Chang
  • Patent number: 9489876
    Abstract: An inspection method including following steps is provided. A pixel array substrate including a plurality of pixel units is in contact with a photoelectric inspection device. A plurality of electrical signals is inputted to the pixel units of the pixel array substrate and the photoelectric inspection device. Based on an optical property of the photoelectric inspection device, the pixel units of the pixel array substrate are being examined on whether they are normal or not. Moreover, an inspection apparatus realizing the inspection method is also provided.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: November 8, 2016
    Assignee: E Ink Holdings Inc.
    Inventors: Chuan-Feng Liu, Jen-Shiun Huang, Pei-Lin Huang, Shi-Lin Li, Chen-Fa Tsai, Yung-Sheng Chang
  • Patent number: 8976517
    Abstract: An electronic device includes a shell, a display module and a cushion. The shell includes a bottom plate and a top plate. The top plate defines an opening. The display module is disposed in the shell and faces the opening. The display module is spaced from the bottom plate of the shell. The cushion is disposed between the display module and the bottom plate of the shell, and brought into contact with the display module for cushioning the display module when an external force is applied to the display module.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: March 10, 2015
    Assignee: E Ink Holdings Inc.
    Inventors: Wan-Tien Chen, Ming-Sheng Chiang, Wen-Chang Lu, Hung-Yi Tsai, Yuan-Chih Tsai, Chu-Kuang Tseng, Chi-Ming Wu, Jen-Shiun Huang, Tsung-Ting Lee, Chen-Fa Tsai
  • Publication number: 20140320137
    Abstract: An inspection method including following steps is provided. A pixel array substrate including a plurality of pixel units is in contact with a photoelectric inspection device. A plurality of electrical signals is inputted to the pixel units of the pixel array substrate and the photoelectric inspection device. Based on an optical property of the photoelectric inspection device, the pixel units of the pixel array substrate are being examined on whether they are normal or not. Moreover, an inspection apparatus realizing the inspection method is also provided.
    Type: Application
    Filed: February 12, 2014
    Publication date: October 30, 2014
    Applicant: E Ink Holdings Inc.
    Inventors: Chuan-Feng Liu, Jen-Shiun Huang, Pei-Lin Huang, Shi-Lin Li, Chen-Fa Tsai, Yung-Sheng Chang
  • Patent number: 8397380
    Abstract: A method of manufacturing an integrated circuit package includes providing a ball grid array (BGA) module including BGA balls on a side of the BGA module; providing a base substrate; and placing the BGA module on the base substrate. The BGA balls are placed between the BGA module and the base substrate. An adhesive is applied between and contacting the BGA module and the base substrate. The adhesive is then cured. The BGA balls are re-flowed after the step of curing the adhesive.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: March 19, 2013
    Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., Global Unichip Corp.
    Inventors: Chia-Jen Kao, Chen-Fa Tsai, Chien-Wen Chen
  • Publication number: 20130027853
    Abstract: An electronic device includes a shell, a display module and a cushion. The shell includes a bottom plate and a top plate. The top plate defines an opening The display module is disposed in the shell and faces the opening The display module is spaced from the bottom plate of the shell. The cushion is disposed between the display module and the bottom plate of the shell, and brought into contact with the display module for cushioning the display module when an external force is applied to the display module.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 31, 2013
    Applicant: E Ink Holdings Inc.
    Inventors: WAN-TIEN CHEN, MING-SHENG CHIANG, WEN-CHANG LU, HUNG-YI TSAI, YUAN-CHIH TSAI, CHU-KUANG TSENG, CHI-MING WU, JEN-SHIUN HUANG, TSUNG-TING LEE, CHEN-FA TSAI
  • Patent number: 8278145
    Abstract: The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: October 2, 2012
    Assignee: Global Unichip Corporation
    Inventors: Chien-Wen Chen, Longqiang Zu, Chen-Fa Tsai
  • Publication number: 20120021564
    Abstract: The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.
    Type: Application
    Filed: April 6, 2011
    Publication date: January 26, 2012
    Applicant: Global Unichip Corporation
    Inventors: Chien-Wen Chen, Longqiang Zu, Chen-Fa Tsai
  • Publication number: 20100302749
    Abstract: A method of manufacturing an integrated circuit package includes providing a ball grid array (BGA) module including BGA balls on a side of the BGA module; providing a base substrate; and placing the BGA module on the base substrate. The BGA balls are placed between the BGA module and the base substrate. An adhesive is applied between and contacting the BGA module and the base substrate. The adhesive is then cured. The BGA balls are re-flowed after the step of curing the adhesive.
    Type: Application
    Filed: March 24, 2010
    Publication date: December 2, 2010
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Jen Kao, Chen-Fa Tsai, Chien-Wen Chen
  • Patent number: 6600216
    Abstract: An improved structure of a pin platform of an integrated circuit having a pin platform body including a chip seat and a plurality of leading plates having their end portions being concentrated on the chip seat and the chip seat being connected to the pin platform body via the connection plate, characterized in that the surrounding of the chip seat is provided with a framing side, and the framing side is connected to a connection plate, and the surface of the chip seat is smaller than the connection surface of the IC to be installed, and the size of the framing side is larger than the size of the connection face of the IC. Therefore, a high performance greenery package is obtained and the ground wire of the IC can be soldered to the framing side, which provides a smooth connection and a communication.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: July 29, 2003
    Assignee: Orient Semiconductor Electronics Limited
    Inventors: Wen-Lo Shieh, Chia-Ming Yang, Chen-Fa Tsai, Shu-Fen Liang, Shu-Min Chou
  • Publication number: 20030132515
    Abstract: An improved structure of a pin platform of an integrated circuit having a pin platform body including a chip seat and a plurality of leading plates having their end portions being concentrated on the chip seat and the chip seat being connected to the pin platform body via the connection plate, characterized in that the surrounding of the chip seat is provided with a framing side, and the framing side is connected to a connection plate, and the surface of the chip seat is smaller than the connection surface of the IC to be installed, and the size of the framing side is larger than the size of the connection face of the IC. Therefore, a high performance greenery package is obtained and the ground wire of the IC can be soldered to the framing side, which provides a smooth connection and a communication.
    Type: Application
    Filed: May 6, 2002
    Publication date: July 17, 2003
    Inventors: Wen-Lo Shieh, Chia-Ming Yang, Chen-Fa Tsai, Shu-Fen Liang, Shu-Min Chou