Patents by Inventor Chen Fang Chung
Chen Fang Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11557470Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.Type: GrantFiled: July 12, 2022Date of Patent: January 17, 2023Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chen-Fang Chung, Wen-Cheng Cheng, Po Wen Yang, Ming-Jie He, Yan-Zi Lu, Cheng-Yi Teng
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Publication number: 20220351953Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.Type: ApplicationFiled: July 12, 2022Publication date: November 3, 2022Inventors: Chen-Fang CHUNG, Wen-Cheng CHENG, Po Wen YANG, Ming-Jie HE, Yan-Zi LU, Cheng-Yi TENG
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Patent number: 11424111Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.Type: GrantFiled: June 25, 2020Date of Patent: August 23, 2022Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chen-Fang Chung, Wen-Cheng Cheng, Po Wen Yang, Ming-Jie He, Yan-Zi Lu, Cheng-Yi Teng
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Patent number: 11390520Abstract: In an embodiment, a system includes: a chamber; and a magnetic assembly contained within the chamber. The magnetic assembly comprises: an inner magnetic portion comprising first magnets; and an outer magnetic portion comprising second magnets. At least two adjacent magnets, of either the first magnets or the second magnets, have different vertical displacements, and the magnetic assembly is configured to rotate around an axis to generate an electromagnetic field that moves ions toward a target region within the chamber.Type: GrantFiled: May 25, 2018Date of Patent: July 19, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Tsez-Chong Tsai, Shuen-Liang Tseng, Szu-Hsien Lo, Po-Wen Yang, Ming-Jie He
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Publication number: 20220223391Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the operations of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.Type: ApplicationFiled: March 31, 2022Publication date: July 14, 2022Inventors: Ming-Jie HE, Shawn YANG, Szu-Hsien LO, Shuen-Liang TSENG, Wen-Cheng CHENG, Chen-Fang CHUNG, Chia-Lin HSUEH, Kuo-Pin CHUANG
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Patent number: 11322338Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the steps of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.Type: GrantFiled: March 29, 2018Date of Patent: May 3, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Jie He, Shawn Yang, Szu-Hsien Lo, Shuen-Liang Tseng, Wen-Cheng Cheng, Chen-Fang Chung, Chia-Lin Hsueh, Kuo-Pin Chuang
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Publication number: 20210407777Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.Type: ApplicationFiled: June 25, 2020Publication date: December 30, 2021Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Po Wen Yang, Ming-Jie He, Yan-Zi Lu, Cheng-Yi Teng
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Publication number: 20190066988Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the steps of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.Type: ApplicationFiled: March 29, 2018Publication date: February 28, 2019Inventors: Ming-Jie HE, Shawn YANG, Szu-Hsien LO, Shuen-Liang TSENG, Wen-Cheng CHENG, Chen-Fang CHUNG, Chia-Lin HSUEH, Kuo-Pin CHUANG
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Publication number: 20190035611Abstract: In an embodiment, a system includes: a chamber; and a magnetic assembly contained within the chamber. The magnetic assembly comprises: an inner magnetic portion comprising first magnets; and an outer magnetic portion comprising second magnets. At least two adjacent magnets, of either the first magnets or the second magnets, have different vertical displacements, and the magnetic assembly is configured to rotate around an axis to generate an electromagnetic field that moves ions toward a target region within the chamber.Type: ApplicationFiled: May 25, 2018Publication date: January 31, 2019Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Tsez-Chong Tsai, Shuen-Liang Tseng, Szu-Hsien Lo, Shawn Yang, Ming-Jie He
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Patent number: 9799497Abstract: Systems and methods are provided for material processing. An example apparatus includes a process-kit component containing a first groove and a second groove. The first groove and the second groove are disposed to form a pattern on a surface of the process-kit component. The process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing.Type: GrantFiled: August 16, 2013Date of Patent: October 24, 2017Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chen-Fang Chung, Chih-Tsang Tseng, Hsiao-Chuan Lee, Kuo-Pin Chuang, Shuen-Liang Tseng
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Publication number: 20150047563Abstract: Systems and methods are provided for material processing. An example apparatus includes a process-kit component containing a first groove and a second groove. The first groove and the second groove are disposed to form a pattern on a surface of the process-kit component. The process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing.Type: ApplicationFiled: August 16, 2013Publication date: February 19, 2015Applicant: Taiwan Semiconductor Manufacturing Company LimitedInventors: CHEN-FANG CHUNG, Chih-Tsang Tseng, Hsiao-Chuan Lee, KUO-PIN CHUANG, Shuen-Liang Tseng
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Patent number: 8802662Abstract: The invention provides an anti-hepatitis C composition including: an effective amount of limonoid compound, wherein the structure of the limonoid compound is shown as Structure (I): where R1 comprises H or OAc and R2 comprises H or COCH(CH3)2; and a pharmaceutically acceptable carrier or salt, and the anti-hepatitis C composition is used for inhibiting hepatitis C virus or treating hepatitis C. The invention also provides a method for treating hepatitis C and a method for preparing a drug for inhibiting hepatitis C viruses or treating hepatitis C.Type: GrantFiled: October 4, 2009Date of Patent: August 12, 2014Assignee: Industrial Technology Research InstituteInventors: Lain-Tze Lee, Shau-Feng Chang, Hui-Ping Tsai, Zong-Keng Kuo, Chen-Fang Chung
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Publication number: 20100317637Abstract: The invention provides an anti-hepatitis C composition including: an effective amount of limonoid compound, wherein the structure of the limonoid compound is shown as Structure (I): where R1 comprises H or OAc and R2 comprises H or COCH(CH3)2; and a pharmaceutically acceptable carrier or salt, and the anti-hepatitis C composition is used for inhibiting hepatitis C virus or treating hepatitis C. The invention also provides a method for treating hepatitis C and a method for preparing a drug for inhibiting hepatitis C viruses or treating hepatitis C.Type: ApplicationFiled: October 4, 2009Publication date: December 16, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Lain-Tze LEE, Shau-Feng CHANG, Hui-Ping TSAI, Zong-Keng KUO, Chen-Fang CHUNG
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Patent number: 6676812Abstract: An alignment mark shielding ring for use in a physical vapor deposition chamber and a method for using the ring to avoid arcing problems on the wafer. The alignment mark shielding ring can be constructed of a ring that has a generally L-shaped cross-section, at least one hood portion to function as the shield for the alignment mark, at least one alignment pin for engaging at least one alignment sleeve mounted in a lower chamber shield for holding the alignment mark shielding ring in place. The alignment sleeve is constructed in two halves, each having an aperture therethrough. The aperture in the top half is larger than the aperture in the bottom half such that even when the apertures are coated with a metal layer deposited in the PVD process, the alignment pin does not electrically short to the lower chamber shield and thus, any possibility of arcing is avoided.Type: GrantFiled: May 9, 2002Date of Patent: January 13, 2004Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventor: Chen-Fang Chung
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Publication number: 20030211758Abstract: An alignment mark shielding ring for use in a physical vapor deposition chamber and a method for using the ring to avoid arcing problems on the wafer. The alignment mark shielding ring can be constructed of a ring that has a generally L-shaped cross-section, at least one hood portion to function as the shield for the alignment mark, at least one alignment pin for engaging at least one alignment sleeve mounted in a lower chamber shield for holding the alignment mark shielding ring in place. The alignment sleeve is constructed in two halves, each having an aperture therethrough. The aperture in the top half is larger than the aperture in the bottom half such that even when the apertures are coated with a metal layer deposited in the PVD process, the alignment pin does not electrically short to the lower chamber shield and thus, any possibility of arcing is avoided.Type: ApplicationFiled: May 9, 2002Publication date: November 13, 2003Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventor: Chen-Fang Chung
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Publication number: 20020084032Abstract: A new configuration of a basic concatenatable integrated modular multiple chamber vacuum processing system for wafer manufacturing vacuum processes is disclosed. The basic system includes at least one multiple ported transfer vacuum chamber, an R-&thgr; transfer means contained within each chamber, a multiplicity of ports adaptable for appending a variety of vacuum process chambers as well as forming entrance/exit ports with at least one dual port pass through chamber attached to one entrance/exit port. Each pass through chamber contains a wafer alignment and/or orientation means for aligning or orienting the wafer as necessary in any of the appended process chambers. The configuration minimizes alignment or orientation errors due to inherent instability of the concatenated transfer means operations.Type: ApplicationFiled: February 26, 2002Publication date: July 4, 2002Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANYInventors: Shwangming Jeng, Chen-Fang Chung
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Patent number: 6328815Abstract: A new configuration of a basic concatenatable integrated modular multiple chamber vacuum processing system for wafer manufacturing vacuum processes is disclosed. The basic system includes at least one multiple ported transfer vacuum chamber, an R-&thgr; transfer means contained within each chamber, a multiplicity of ports adaptable for appending a variety of vacuum process chambers as well as forming entrance/exit ports with at least one dual port pass through chamber attached to one entrance/exit port. Each pass through chamber contains a wafer alignment and/or orientation means for aligning or orienting the wafer as necessary in any of the appended process chambers. The configuration minimizes alignment or orientation errors due to inherent instability of the concatenated transfer means operations.Type: GrantFiled: February 19, 1999Date of Patent: December 11, 2001Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Shwangming Jeng, Chen-Fang Chung
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Patent number: 6171453Abstract: A mark shielding ring for use in a physical vapor deposition chamber and a method for using such ring are disclosed. The mark shielding ring may be suitably used for shielding alignment marks or any other marks provided on the top surface of a wafer along a peripheral region. The novel mark shielding ring includes an alignment means for mechanically joining a shielding ring to a wafer pedestal on which the ring is positioned. Any up-and-down motion of the wafer pedestal therefore does not change the alignment between the shielding ring and the pedestal and therefore the function of the shielding ring for protecting an alignment mark can be insured.Type: GrantFiled: December 2, 1998Date of Patent: January 9, 2001Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Chen Fang Chung, Shuang Ming Jeng