Patents by Inventor Chen-Feng CHU

Chen-Feng CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10784189
    Abstract: A mounting rack with circuit includes a leadframe, a molding seat and a circuit layer. The leadframe comprises a plurality of electrodes. The molding seat is arranged on the leadframe and has a cup body to expose backsides of the electrodes and a cup opening to expose front sides of the electrodes. The circuit layer is arranged on the cup body and at least comprises two conductive parts, two electrical-connection parts and two soldering pads, wherein the two electrical-connection parts are arranged on the cup opening, one end of each of the two electrical-connection parts is electrically connected to one end of a respective one of the two conductive parts, the two soldering pads are arranged on bottom of the cup body, each of the two soldering pads is electrically connected to the other end of a respective one of the two conductive parts.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: September 22, 2020
    Assignee: FUSHENG ELECTRONICS CORPORATION
    Inventors: Chen-Feng Chu, Yuan-Fu Chen
  • Publication number: 20190341340
    Abstract: A mounting rack with circuit includes a leadframe, a molding seat and a circuit layer. The leadframe comprises a plurality of electrodes. The molding seat is arranged on the leadframe and has a cup body to expose backsides of the electrodes and a cup opening to expose front sides of the electrodes. The circuit layer is arranged on the cup body and at least comprises two conductive parts, two electrical-connection parts and two soldering pads, wherein the two electrical-connection parts are arranged on the cup opening, one end of each of the two electrical-connection parts is electrically connected to one end of a respective one of the two conductive parts, the two soldering pads are arranged on bottom of the cup body, each of the two soldering pads is electrically connected to the other end of a respective one of the two conductive parts.
    Type: Application
    Filed: April 25, 2019
    Publication date: November 7, 2019
    Inventors: Chen-Feng CHU, Yuan-Fu CHEN