Patents by Inventor Chen Fung Leng

Chen Fung Leng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die pad for integrated circuits
    Publication number: 20020070436
    Abstract: Die pads are provided which reduce moisture retention and thermal mismatch by employing a number of die pad sections or a die pad support portion with a number of relief regions. In each case, the die pad area to die area ratio is reduced to improve the thermal mismatch between the die and the die pad. Also, the die pad sections or relief regions are arranged in a spaced apart fashion to provide moisture escape paths between the die and the die pad.
    Type: Application
    Filed: October 18, 2001
    Publication date: June 13, 2002
    Inventors: Chong Chin Hui, Lee Teck Yeow, Chen Fung Leng, Rahul Kapoor