Patents by Inventor Chen-Han Yang

Chen-Han Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Core-shell particle, method of manufacturing the same and applications thereof
    Patent number: 10287386
    Abstract: The present invention is related to a core-shell particle and preparation and use thereof. The core of the core-shell particle includes a vinyl polymer. The shell of the core-shell particle includes a hydrophobic silane bonded to a surface of the core via a silane coupling agent. The core-shell particles are applied in a matting material as a matting agent.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: May 14, 2019
    Assignee: Eternal Materials Co., Ltd.
    Inventors: Yu-Huei Su, Yu-Lin Hsiao, Wen-Yen Chiu, Chi-An Dai, Chen-Han Yang, Bo-Ting Chou
  • Expansion card
    Patent number: 9104385
    Abstract: The invention provides an expansion card adapted for a motherboard, in which the motherboard includes a first slot, and the first slot is located at a surface of the motherboard. The expansion card includes a circuit board, a heat-dissipating module and a supporter. The circuit board includes a connecting interface configured for being inserted into the first slot of the motherboard. The heat-dissipating module is disposed at a side of the circuit board and has a bottom surface. When the expansion card is inserted into the first slot, the supporter is disposed at the bottom surface of the heat-dissipating module so that the bottom surface of the heat-dissipating module is substantially parallel to the surface of the motherboard.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: August 11, 2015
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chen-Han Yang, Chih-Kuan Liu
  • EXPANSION CARD
    Publication number: 20120300386
    Abstract: The invention provides an expansion card adapted for a motherboard, in which the motherboard includes a first slot, and the first slot is located at a surface of the motherboard. The expansion card includes a circuit board, a heat-dissipating module and a supporter. The circuit board includes a connecting interface configured for being inserted into the first slot of the motherboard. The heat-dissipating module is disposed at a side of the circuit board and has a bottom surface. When the expansion card is inserted into the first slot, the supporter is disposed at the bottom surface of the heat-dissipating module so that the bottom surface of the heat-dissipating module is substantially parallel to the surface of the motherboard.
    Type: Application
    Filed: May 23, 2012
    Publication date: November 29, 2012
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chen-Han Yang, Chih-Kuan Liu