Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.

Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

Abstract: A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.

Abstract: The present disclosure relates to the technical field of fiber-optic gas sensing and laser photoacoustic spectroscopy, and reliability of a gas detection system is improved by actively selecting a working frequency of low noise interference combined with an optical fiber photoacoustic sensing probe capable of isolating high-frequency noise. A gas enters a photoacoustic microcavity through gaps on a sound-sensitive diaphragm after diffusing into a miniature air chamber through a plurality of micropores. Photoacoustic excitation light is incident into the photoacoustic microcavity through a fiber-optic collimator and then excited to generate a photoacoustic pressure wave to cause the sound-sensitive diaphragm to vibrate periodically. An end face of a single-mode optical fiber and the sound-sensitive diaphragm constitutes a fiber-optic Fabry-Perot interferometer. The interferometer measures a deflection of the diaphragm and inverts a concentration of the to-be-measured gas.

Abstract: Embodiments generally relate to real-time profile search interfaces and web services with the ability to real-time search for and view details on entities and visualizations of the network. The computer service enables real-time profile search of entities and performs a sequence of data aggregation heuristics to present a consolidated view of an individual.

Abstract: A casting method includes constructing a 3D model to add an inner wall compensation quantity, making a thin shell mold by a 3D printing machine, individually treating the thin shell mold by smooth processing, processing the thin shell mold by multi-layer impregnation slurry or gunite to make an outer shell mold, and to form a double-layer shell mold which includes the thin shell mold and the outer shell mold, processing the double-layer shell mold by sand filling and compressing, clearing the thin shell mold by a physical or chemical process, casting the outer shell mold to form a shaped article, and post processing the shaped article by shaking and sand clearing to form a product.

Abstract: A casting method includes constructing a 3D model to add an inner wall compensation quantity, making a thin shell mold by a 3D printing machine, individually treating the thin shell mold by smooth processing, processing the thin shell mold by multi-layer impregnation slurry or gunite to make an outer shell mold, and to form a double-layer shell mold which includes the thin shell mold and the outer shell mold, processing the double-layer shell mold by sand filling and compressing, clearing the thin shell mold by a physical or chemical process, casting the outer shell mold to form a shaped article, and post processing the shaped article by shaking and sand clearing to form a product.