Abstract: The invention relates to fabricating a single-trench alternating phase shift mask (PSM). A chromium layer over a mask layer, which is itself over a quartz layer, of the PSM is patterned according to a semiconductor design. The mask layer and the quartz layer are dry etched through a photoresist layer that has been applied over the chromium layer and patterned according to an alternating PSM design. The dry etching initially forms single trenches of the PSM. The quartz layer is next wet etched through the mask layer to completely form the single trenches of the PSM, where the photoresist layer has first been removed. The mask layer is dry etched again, where the single trenches of the PSM are initially filled with filler material to protect the single trenches from the dry etching.

Abstract: A method for forming a photomask and pellicle suitable for use in photolithography with incident electromagnetic radiation in a wavelength range from above 250 nm to below 150 nm. The opaque regions of the photomask are formed directly within a transparent F-doped quartz layer by either gallium ion staining using a focused ion beam (FIB) or by deposition of carbon atoms within trenches formed in the transparent layer, said carbon atom deposition being a result of the interaction of a FIB with styrene molecules. An alignment boundary formed on the resulting mask allows a hard pellicle to be fit directly over it so as to avoid warping.

Abstract: The invention relates to fabricating a single-trench alternating phase shift mask (PSM). A chromium layer over a mask layer, which is itself over a quartz layer, of the PSM is patterned according to a semiconductor design. The mask layer and the quartz layer are dry etched through a photoresist layer that has been applied over the chromium layer and patterned according to an alternating PSM design. The dry etching initially forms single trenches of the PSM. The quartz layer is next wet etched through the mask layer to completely form the single trenches of the PSM, where the photoresist layer has first been removed. The mask layer is dry etched again, where the single trenches of the PSM are initially filled with filler material to protect the single trenches from the dry etching.