Abstract: A keyboard device includes plural keycaps, a base plate, plural connecting elements and a circuit board. The plural connecting elements are connected with the respective keycaps and the base plate. The circuit board is located over the base plate. The circuit board includes plural membrane switches and plural first capacitance sensing units. When one of the first capacitance sensing units detects an approaching conductor or detects a motion of the conductor, a driving signal is generated or a control signal is outputted.

Abstract: The present disclosure provides semiconductor structure having an electrical contact. The semiconductor structure includes a semiconductor substrate and a doped polysilicon contact. The doped polysilicon contact is disposed over the semiconductor substrate. The doped polysilicon contact includes a dopant material having a dopant concentration equaling or exceeding about 1015 atom/cm3.

Abstract: An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

Abstract: Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. A first redistribution structure is formed over the silicon wafer and provides local interconnects between adjacent dies of the same type and/or of different types. A second redistribution structure may be formed over the first redistribution layer and provides semi-global and/or global interconnects between non-adjacent dies of the same type and/or of different types. An optional backside redistribution structure may be formed over a second side of the silicon wafer opposite the first redistribution layer. The optional backside redistribution structure may provide backside interconnects between functional dies of different types.

Abstract: A semiconductor package structure is provided. The structure includes a package substrate having a first surface and a second surface opposite to the first surface and including a ground layer embedded therein. A semiconductor die is formed on the first surface of the package substrate and an antenna pattern layer is formed on the second surface of the package substrate and electrically coupled to the semiconductor die. The structure also includes a first connector and a second connector formed on the second surface of the package substrate and arranged adjacent to the antenna pattern layer. The first connector is electrically coupled to the semiconductor die and electrically isolated to the ground layer, and the second connector is electrically coupled to the ground layer. A wireless communication device including the semiconductor package structure is also provided.

Abstract: The vertical vibration isolation system of the present invention includes a bearing base, a guide rail assembly and a plurality of buckling elements. The bearing base has an upper platform that can move along a vertical direction. The guide rail assembly surrounds the bearing base and has a plurality of arc-shaped sliding channels. The top portion of each buckling element can move with the upper platform, while the bottom portion of each buckling element is slidably connected to the corresponding arc-shaped sliding channel. The vertical displacement of the upper platform would cause different degrees of buckling of the buckling elements and also induces sliding motion of the bottom portion of the buckling elements along the arc-shaped sliding channels. Accordingly, the vertical vibration isolation system can provide nonlinear restoring force by buckling and sliding mechanisms so as to exhibit vertical vibration isolation effect.

Abstract: The vertical vibration isolation system of the present invention includes a bearing base, a guide rail assembly and a plurality of buckling elements. The bearing base has an upper platform that can move along a vertical direction. The guide rail assembly surrounds the bearing base and has a plurality of arc-shaped sliding channels. The top portion of each buckling element can move with the upper platform, while the bottom portion of each buckling element is slidably connected to the corresponding arc-shaped sliding channel. The vertical displacement of the upper platform would cause different degrees of buckling of the buckling elements and also induces sliding motion of the bottom portion of the buckling elements along the arc-shaped sliding channels. Accordingly, the vertical vibration isolation system can provide nonlinear restoring force by buckling and sliding mechanisms so as to exhibit vertical vibration isolation effect.