Patents by Inventor Chen-Heng Liu

Chen-Heng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Environment change management and risk analysis
    Patent number: 12242995
    Abstract: The exemplary embodiments disclose a method, a computer program product, and a computer system for managing environment change. The exemplary embodiments may include determining a plurality of change and risk models for a plurality of computing environments, generating a plurality of association rules based on the plurality of change and risk models, and generating a joint association rule by combining at least two of the plurality of association rules, wherein the joint association rule indicates, from the three dimensions, an association relationship between changes and risk events over at least a part of the time series.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: March 4, 2025
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Chen Luo, Fu F W Wang, Shi Jie Zhang, Lei Gao, Sun Bing, Meng Ru Hou, Yu Heng Liu
  • Package structure
    Patent number: 10366941
    Abstract: Provided is a package structure including a substrate, a metal pad, a first polymer layer, a second polymer layer, a redistribution layer (RDL), and a third polymer layer. The metal pad is located on the substrate. The first polymer layer is located on the substrate. The first polymer layer has a first opening which exposes a portion of a top surface of the metal pad. The second polymer layer is located on the first polymer layer. The second polymer layer has a second opening which exposes the portion of the top surface of the metal pad and a first top surface of the first polymer layer. The RDL covers the portion of the top surface of the metal pad and extends onto a portion of the first top surface of the first polymer layer and the second polymer layer. The third polymer layer is located on the RDL.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: July 30, 2019
    Assignee: Winbond Electronics Corp.
    Inventors: Chen-Heng Liu, Yung-Fu Chang
  • PACKAGE STRUCTURE
    Publication number: 20180240736
    Abstract: Provided is a package structure including a substrate, a metal pad, a first polymer layer, a second polymer layer, a redistribution layer (RDL), and a third polymer layer. The metal pad is located on the substrate. The first polymer layer is located on the substrate. The first polymer layer has a first opening which exposes a portion of a top surface of the metal pad. The second polymer layer is located on the first polymer layer. The second polymer layer has a second opening which exposes the portion of the top surface of the metal pad and a first top surface of the first polymer layer. The RDL covers the portion of the top surface of the metal pad and extends onto a portion of the first top surface of the first polymer layer and the second polymer layer. The third polymer layer is located on the RDL.
    Type: Application
    Filed: December 26, 2017
    Publication date: August 23, 2018
    Applicant: Winbond Electronics Corp.
    Inventors: Chen-Heng Liu, Yung-Fu Chang