Patents by Inventor Chen Hing

Chen Hing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRESS-FREE LEAD FRAME
    Publication number: 20080023806
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Application
    Filed: October 5, 2007
    Publication date: January 31, 2008
    Applicant: Carsem (M) Sdn. Bhd.
    Inventors: Lee Huat, Chan Meng, Cheong Tuck, Lee Sin, Phuah Keung, Araventhan Eturajulu, Liow Keng, Thum Kong, Chen Hing
  • Stress-free lead frame
    Publication number: 20050104169
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Application
    Filed: December 23, 2004
    Publication date: May 19, 2005
    Applicant: Carsem Semiconductor Sdn. Bhd.
    Inventors: Lee Huat, Chan Meng, Cheong Tuck, Lee Sin, Phuah Keung, Araventhan Eturajulu, Liow Keng, Thum Kong, Chen Hing