Patents by Inventor Chen-Hsi Shih

Chen-Hsi Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6652666
    Abstract: A wet dip method for photoresist and polymer stripping from a wafer surface without the need for a buffer solvent treatment step is disclosed. In the method, the wafer is first exposed to an etchant solution that is maintained at a temperature of at least 80° C. The wafer is then cooled in a room temperature air for a sufficient length of time until the temperature of the wafer reaches substantially room temperature. The wafer is then rinsed in a rinsing step that includes a quick dump rinse and a final rinse with deionized water that is maintained at a temperature not higher than room temperature without first exposing the wafer to a buffer solvent such as that required in a conventional wet dip method.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: November 25, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd
    Inventors: Ching-Tien Ma, Chen-Hsi Shih, Dian-Hau Chen, Gau-Ming Lu, Cho-Ching Chen
  • Publication number: 20020162578
    Abstract: A wet dip method for photoresist and polymer stripping from a wafer surface without the need for a buffer solvent treatment step is disclosed. In the method, the wafer is first exposed to an etchant solution that is maintained at a temperature of at least 80° C. The wafer is then cooled in a room temperature air for a sufficient length of time until the temperature of the wafer reaches substantially room temperature. The wafer is then rinsed in a rinsing step that includes a quick dump rinse and a final rinse with deionized water that is maintained at a temperature not higher than room temperature without first exposing the wafer to a buffer solvent such as that required in a conventional wet dip method.
    Type: Application
    Filed: May 2, 2001
    Publication date: November 7, 2002
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Ching-Tien Ma, Chen-Hsi Shih, Dian-Hau Chen, Gau-Ming Lu, Cho-Ching Chen