Patents by Inventor Chen-Hsiang KUO

Chen-Hsiang KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11953740
    Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 11947173
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 11929016
    Abstract: A scan-type display apparatus includes an LED array and a scan driver. The LED array has a common anode configuration, and includes multiple scan lines, multiple data lines and multiple LEDs. The scan driver includes multiple scan driving circuits. Each scan driving circuit includes a voltage generator and a detector. The voltage generator has an output terminal that is connected to the scan line corresponding to the scan driving circuit, and is configured to output one of an input voltage and a clamp voltage at the output terminal of the voltage generator. The detector is connected to the output terminal of the voltage generator, and generates a detection signal that indicates whether any one of the LEDs connected to the scan line corresponding to the scan driving circuit is short circuited based on a voltage at the output terminal of the voltage generator and a detection timing signal.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: March 12, 2024
    Assignee: MACROBLOCK, INC.
    Inventors: Chi-Min Hsieh, Che-Wei Chang, Chen-Yuan Kuo, Wei-Hsiang Cheng
  • Patent number: 11923207
    Abstract: A method for forming a redistribution structure in a semiconductor package and a semiconductor package including the redistribution structure are disclosed. In an embodiment, the method may include encapsulating an integrated circuit die and a through via in a molding compound, the integrated circuit die having a die connector; depositing a first dielectric layer over the molding compound; patterning a first opening through the first dielectric layer exposing the die connector of the integrated circuit die; planarizing the first dielectric layer; depositing a first seed layer over the first dielectric layer and in the first opening; and plating a first conductive via extending through the first dielectric layer on the first seed layer.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu
  • Publication number: 20240069277
    Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Yi Kuo, Chen-Hua Yu, Cheng-Chieh Hsieh, Che-Hsiang Hsu, Chung-Ming Weng, Tsung-Yuan Yu
  • Patent number: 11431268
    Abstract: A motor driving system includes a controller, motors and motor drivers. In the normal supplying state of a power supply, the controller controls the motor drivers. The motor drivers output driving signals for driving the motors respectively. In an abnormal state or a power-off state of the power supply, one of the motor drivers is set to be a master driver and the others are set to be slave driver. The master driver activates a deceleration energy backup (DEB) function, powers the slave drivers through a common-DC-bus structure, controls the slave drivers, and during deceleration maintains a ratio between frequencies of the driving signals, until all of the motors are decelerated to stop at the same time.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: August 30, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Yun Lin, Chia-Wei Chou, Chen-Hsiang Kuo
  • Publication number: 20220069744
    Abstract: A motor driving system includes a controller, motors and motor drivers. In the normal supplying state of a power supply, the controller controls the motor drivers. The motor drivers output driving signals for driving the motors respectively. In an abnormal state or a power-off state of the power supply, one of the motor drivers is set to be a master driver and the others are set to be slave driver. The master driver activates a deceleration energy backup (DEB) function, powers the slave drivers through a common-DC-bus structure, controls the slave drivers, and during deceleration maintains a ratio between frequencies of the driving signals, until all of the motors are decelerated to stop at the same time.
    Type: Application
    Filed: May 11, 2021
    Publication date: March 3, 2022
    Inventors: Cheng-Yun LIN, Chia-Wei CHOU, Chen-Hsiang KUO
  • Publication number: 20140035507
    Abstract: The present invention discloses a motor deceleration method which is applied to a motor driving apparatus. The motor driving apparatus includes an energy-storing unit and a controlling unit, and outputs a driving signal to control the motor. The controlling unit controls a driving frequency of the driving signal. The driving deceleration method includes following steps of controlling the driving frequency to zero; increasing the driving frequency in a linear way by using the controlling unit; detecting whether a terminal voltage difference of the energy-storing unit is increased to a preset voltage value, and if yes, adjusting the driving signal to keep the terminal voltage difference at the preset voltage value; and reducing the driving frequency continuously to decelerate the motor.
    Type: Application
    Filed: January 25, 2013
    Publication date: February 6, 2014
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Chien-Yu CHI, Chen-Hsiang KUO, Sheng-Chieh CHANG, Ting-Chung HSIEH, Shih-Chieh LIAO