Patents by Inventor Chen-Hsiang Liao

Chen-Hsiang Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple nozzle slurry dispense scheme
    Patent number: 11318579
    Abstract: An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: May 3, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Hsieh, Tseng-Hsuan Huang, Chen-Hsiang Liao
  • Multiple Nozzle Slurry Dispense Scheme
    Publication number: 20190321941
    Abstract: An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
    Type: Application
    Filed: July 1, 2019
    Publication date: October 24, 2019
    Inventors: Chih-Hsuan Hsieh, Tseng-Hsuan Huang, Chen-Hsiang Liao
  • Multiple nozzle slurry dispense scheme
    Patent number: 10335920
    Abstract: An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: July 2, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chih-Hsuan Hsieh, Tseng-Hsuan Huang, Chen-Hsiang Liao
  • Multiple Nozzle Slurry Dispense Scheme
    Publication number: 20150224626
    Abstract: An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 13, 2015
    Inventors: Chih-Hsuan Hsieh, Tseng-Hsuan Huang, Chen-Hsiang Liao
  • Method and apparatus for chemical mechanical polishing including first and second polishing
    Patent number: 7799689
    Abstract: A method and apparatus for performing first and second polishings on a workpiece wherein the first and second polishings are performed using different operating parameters.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: September 21, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: Chih-Min Wen, Chen-Hsiang Liao
  • Method and apparatus for chemical mechanical polishing
    Publication number: 20080119116
    Abstract: A method and apparatus for performing first and second polishings on a workpiece wherein the first and second polishings are performed using different operating parameters.
    Type: Application
    Filed: November 17, 2006
    Publication date: May 22, 2008
    Inventors: Chih-Min Wen, Chen-Hsiang Liao