Patents by Inventor Chen-Hsien CHU

Chen-Hsien CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127988
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.
    Type: Application
    Filed: March 2, 2023
    Publication date: April 18, 2024
    Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
  • Publication number: 20240127989
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.
    Type: Application
    Filed: January 25, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
  • Publication number: 20210125971
    Abstract: A structure of a semiconductor array comprises multiple a backplane driver, wherein the backplane driver having a first surface and a second surface; a plurality of compound semiconductor light emitting unit disposed in an array on the first surface of the backplane driver having a gap between any two adjacent ones, wherein the each compound semiconductor light emitting unit having a first surface and a second surface, wherein the second surface of the each compound semiconductor light emitting unit having a cathode and an anode, wherein the cathode and the anode of the each compound semiconductor light emitting unit electrically connected to the first surface of the backplane driver, and wherein the cathode and the anode of the each compound semiconductor light emitting unit are separated from each other from the adjacent electrodes of the adjacent compound semiconductor light emitting units; and a polymer layer disposed above the first surface of the each compound semiconductor light emitting unit.
    Type: Application
    Filed: January 2, 2021
    Publication date: April 29, 2021
    Inventors: Chen-Fu CHU, Chen-Hsien CHU
  • Patent number: 10910350
    Abstract: A structure of a semiconductor array comprises multiple semiconductor units, an isolation layer and a decomposed or buffer unit. Multiple semiconductor units combined the semiconductor array. The isolation layer coated each semiconductor unit. The decomposed or buffer unit coated the isolation layer and filled between each semiconductor unit to enhance structure of the semiconductor units. Wherein, the isolation layer protected by edge of the semiconductor units and the decomposed or buffer unit.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: February 2, 2021
    Inventors: Chen-Fu Chu, Chen-Hsien Chu
  • Patent number: 10205055
    Abstract: The invention discloses a light engine array having at least an anode and a cathode comprising: a first type semiconductor layer; an active layer; and a second type semiconductor layer; a cathode electrode has a conductive metal layer in electrical contact with a portion of the first type semiconductor layer, and the second type semiconductor layer to form a short circuit structure in a common cathode region; and an anode electrode has the conductive metal layer and coupled to a portion of the first type semiconductor layer; wherein, the anode electrode is electrically isolated with the active layer and the second type semiconductor layer in a sub-pixel region.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: February 12, 2019
    Assignee: HIPHOTON CO., LTD.
    Inventors: Chen-Fu Chu, Chen-Hsien Chu
  • Publication number: 20180047876
    Abstract: The invention discloses a light engine array having at least an anode and a cathode comprising: a first type semiconductor layer; an active layer; and a second type semiconductor layer; a cathode electrode has a conductive metal layer in electrical contact with a portion of the first type semiconductor layer, and the second type semiconductor layer to form a short circuit structure in a common cathode region; and an anode electrode has the conductive metal layer and coupled to a portion of the first type semiconductor layer; wherein, the anode electrode is electrically isolated with the active layer and the second type semiconductor layer in a sub-pixel region.
    Type: Application
    Filed: October 25, 2017
    Publication date: February 15, 2018
    Inventors: CHEN-FU CHU, CHEN-HSIEN CHU
  • Patent number: 9831387
    Abstract: The invention discloses a light engine array comprises a multiple light engines arranged into an array, multiple dams located on a first surface of the light engines; and the dams combined a dam array.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: November 28, 2017
    Assignee: Hiphoton Co., Ltd.
    Inventors: Chen-Fu Chu, Chen-Hsien Chu
  • Publication number: 20150362165
    Abstract: The invention discloses a light engine array comprises a multiple light engines arranged into an array, multiple dams located on a first surface of the light engines; and the dams combined a dam array.
    Type: Application
    Filed: June 12, 2015
    Publication date: December 17, 2015
    Inventors: Chen-Fu CHU, Chen-Hsien CHU