Abstract: An integrated circuit layout includes an upper active region comprising a first edge and a second edge extending along a first direction and respectively adjacent to an upper cell boundary by a distance D3 and a distance D4. A first gate line is disposed on the upper active region, extends along a second direction, and protrudes from the first edge by a length L3. A second gate line is disposed on the upper active region, extends along the second direction, and protrudes from the second edge by a length L4. Two dummy gate lines respectively extend along the second direction and are disposed at two sides of the upper active region and away from the upper cell boundary by a distance S. The first direction and the second direction are perpendicular. The distances D3, D4, S and the lengths L3 and L4 have the relationships: L3?D3?S, L4?D4?S, and D3?D4.

Abstract: A layout includes a first and a second standard cells abutting along a boundary line. The first cell includes first fins. An edge of the first fins closest to and away from the boundary line by a distance D1. A first gate line over-crossing the first fins protrudes from the edge by a length L1. The second cell includes second fins. An edge of the second fins closest to and away from the boundary line by a distance D2. A second gate line over-crossing the second fins protrudes from the edge by a length L2. Two first dummy gate lines at two sides of the first fins and two second dummy lines at two sides of the second fins are respectively away from the boundary line by a distance S. The lengths L1 and L2, the distances S, D1 and D2 have the relationships: L1?D1?S, L2?D2?S, and D1?D2.

Abstract: An integrated circuit layout includes a first standard cell and a second standard cell. The first standard cell includes first gate lines arranged along a first direction and extending along a second direction. The second standard cell abuts to one side of the first standard cell along the second direction and includes second gate lines arranged along the first direction and extending along the second direction. A first gate line width of the first gate lines and a second gate line width of the second gate lines are different. A first cell width of the first standard cell and a second cell width of the second standard cell are integral multiples of a default gate line pitch of the first gate lines and the second gate lines. At least some of the second gate lines and at least some of the first gate lines are aligned along the second direction.

Abstract: A layout includes a first and a second standard cells abutting along a boundary line. The first cell includes first fins. An edge of the first fins closest to and away from the boundary line by a distance D1. A first gate line over-crossing the first fins protrudes from the edge by a length L1. The second cell includes second fins. An edge of the second fins closest to and away from the boundary line by a distance D2. A second gate line over-crossing the second fins protrudes from the edge by a length L2. Two first dummy gate lines at two sides of the first fins and two second dummy lines at two sides of the second fins are respectively away from the boundary line by a distance S. The lengths L1 and L2, the distances S, D1 and D2 have the relationships: L1?D1?S, L2?D2?S, and D1?D2.

Abstract: A method for forming an integrated circuit layout including at least two standard cells having different cell heights is disclosed. The standard cells respectively have a well boundary to divide a PMOS region and an NMOS region. The standard cells are abutted side by side along their side edges in a way that the well boundaries of the cells are aligned along the row direction. The power rail and the ground rail of one of the standard cells are shifted to align and connect to the power rail and the ground rail of the other one of the standard cells.

Abstract: A method for forming an integrated circuit layout including at least two standard cells having different cell heights is disclosed. The standard cells respectively have a well boundary to divide a PMOS region and an NMOS region. The standard cells are abutted side by side along their side edges in a way that the well boundaries of the cells are aligned along the row direction. The power rail and the ground rail of one of the standard cells are extended in width or length to connect to the power rail and the ground rail of the other one of the standard cells.

Abstract: An integrated circuit layout includes a first and a second standard cells abutting along a boundary line. The boundary line and a first active region of the first standard cell include a distance D1. A first gate line on the first active region protrudes from the first active region by a length L1. The boundary line and a second active region of the second standard cell include a distance D2. A second gate line on the second active region protrudes from the second active region by a length L2. Two first dummy gate lines and two second dummy gate lines are disposed at two sides of the first active region and the second active region and are away from the boundary line by a distance S. The lengths L1 and L2, the distances S, D1 and D2 have the relationships: L1?D1?S, L2?D2?S, and D1?D2.

Abstract: An integrated circuit layout includes a first standard cell and a second standard cell. The first standard cell includes first gate lines arranged along a first direction and extending along a second direction. The second standard cell abuts to one side of the first standard cell along the second direction and includes second gate lines arranged along the first direction and extending along the second direction. A first gate line width of the first gate lines and a second gate line width of the second gate lines are different. A first cell width of the first standard cell and a second cell width of the second standard cell are integral multiples of a default gate line pitch of the first gate lines and the second gate lines. At least some of the second gate lines and at least some of the first gate lines are aligned along the second direction.

Abstract: A delay cell includes a cascode transistor and an inverter. The cascode transistor is used to receive a control voltage to generate a bias current, and includes a source terminal, a drain terminal, and a gate terminal receiving the control voltage. The inverter is coupled to the cascode transistor and used to generate an output signal according to the bias current in response to an input signal.

Abstract: The invention provides a testkey detection circuit, including a plurality of oscillators and a driving circuit. Each of the oscillators has an enable terminal, a voltage terminal and an output terminal, wherein the enable terminals are connected to a common enable terminal. The driving circuit receives the output terminals of the oscillators and increases a driving level of a selected one of the output terminals as a frequency output.

Abstract: A delay cell includes a cascode transistor and an inverter. The cascode transistor is used to receive a control voltage to generate a bias current, and includes a source terminal, a drain terminal, and a gate terminal receiving the control voltage. The inverter is coupled to the cascode transistor and used to generate an output signal according to the bias current in response to an input signal.

Abstract: The present invention provides a layout of a semiconductor transistor device including a first and a second active area, a first and a second gate, and a metal line. The first active and the second active area are extended along a first direction. The first gate and the second gate are extended along a second direction and crossed the first active area, to define two transistors. The two transistors are electrically connected with each other through a conductive layer. The metal line is disposed on the conductive layer and is electrically connected the two transistors respectively.

Abstract: The invention provides a testkey detection circuit, including a plurality of oscillators and a driving circuit. Each of the oscillators has an enable terminal, a voltage terminal and an output terminal, wherein the enable terminals are connected to a common enable terminal. The driving circuit receives the output terminals of the oscillators and increases a driving level of a selected one of the output terminals as a frequency output.

Abstract: The present invention provides an integrated circuit with a standard cell of an inverter standard cell. The integrated circuit includes: a first metal line and a second metal line stretching along a first direction; a first dummy gate and a second dummy gate stretching along a second direction; Plural fin structures stretching along the first direction; A gate structure disposed on the fin structures and stretching along the second direction; Two long contact plugs disposed at one side of the gate structure; two short contact plugs disposed at the other side of the gate structure; a gate contact plug disposed on the gate structure; Plural via plugs disposed on the long contact plugs, the short contact plugs and the gate contact plugs; A metal layer includes the first metal line, the second metal line, a third metal line and a fourth metal line.

Abstract: The present invention provides an integrated circuit with a standard cell of an inverter. The integrated circuit includes: a first metal line and a second metal line stretching along a first direction; a first dummy gate and a second dummy gate stretching along a second direction; Plural fin structures stretching along the first direction; A gate structure disposed on the fin structures and stretching along the second direction; Two long contact plugs disposed at one side of the gate structure; two short contact plugs disposed at the other side of the gate structure; a gate contact plug disposed on the gate structure; Plural via plugs disposed on the long contact plugs, the short contact plugs and the gate contact plugs; A metal layer includes the first metal line, the second metal line, a third metal line and a fourth metal line.

Abstract: The present invention provides an integrated circuit with a standard cell of an inverter standard cell. The integrated circuit includes: a first metal line and a second metal line stretching along a first direction; a first dummy gate and a second dummy gate stretching along a second direction; Plural fin structures stretching along the first direction; A gate structure disposed on the fin structures and stretching along the second direction; Two long contact plugs disposed at one side of the gate structure; two short contact plugs disposed at the other side of the gate structure; a gate contact plug disposed on the gate structure; Plural via plugs disposed on the long contact plugs, the short contact plugs and the gate contact plugs; A metal layer includes the first metal line, the second metal line, a third metal line and a fourth metal line.

Abstract: The present invention provides an integrated circuit with a standard cell of an inverter. The integrated circuit includes: a first metal line and a second metal line stretching along a first direction; a first dummy gate and a second dummy gate stretching along a second direction; Plural fin structures stretching along the first direction; A gate structure disposed on the fin structures and stretching along the second direction; Two long contact plugs disposed at one side of the gate structure; two short contact plugs disposed at the other side of the gate structure; a gate contact plug disposed on the gate structure; Plural via plugs disposed on the long contact plugs, the short contact plugs and the gate contact plugs; A metal layer includes the first metal line, the second metal line, a third metal line and a fourth metal line.

Abstract: The present invention provides an integrated circuit with a dummy standard cell. The integrated circuit includes: a first metal line and a second metal line stretching along a first direction; a first dummy gate and a second dummy gate stretching along a second direction; Plural fin structures stretching along the first direction; A gate structure disposed on the fin structures and stretching along the second direction; Plural sets of short contact plug and long contact plug disposed between the first dummy gate, the second dummy gate and the gate structures; a doping region overlaps with the long contact plugs; a gate contact plug disposed on the gate structures; plural contact plugs disposed on and electrical contact the long contact plugs; A metal layer includes the first metal line, the second metal line.

Abstract: The present invention provides a layout of a semiconductor transistor device including a first and a second active area, a first and a second gate, and a metal line. The first active and the second active area are extended along a first direction. The first gate and the second gate are extended along a second direction and crossed the first active area, to define two transistors. The two transistors are electrically connected with each other through a conductive layer. The metal line is disposed on the conductive layer and is electrically connected the two transistors respectively.

Abstract: A semiconductor IC layout structure includes a plurality of first active regions arranged along a second direction, a plurality of second active regions arranged along the second direction, a plurality of gate structures extending along a first direction and respectively straddling the first active regions and the second active regions, a plurality of first conductive structures extending along the first direction, and a plurality of second conductive structures formed on the gate structures. The second active regions are isolated from the first active regions. The first direction is perpendicular to the second direction. The first conductive structures are formed on the first active regions and the second active regions. The second conductive structures include a plurality of slot-type second conductive structures extended along the second direction and a plurality of island-type second conductive structures formed on the gate structures.