Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A living organism image monitoring system is provided, relating to the technical field of medical equipment. The living organism image monitoring system comprises a display module, a processor and a CIGS chip, the CIGS chip, the processor and the display module being electrically connected, the CIGS chip being used for detecting a near infrared light signal of a living organism and generating a current signal after having detected the near infrared light signal, the processor being used for generating a first pulse signal according to the current signal, and the display module being used for displaying an image according to the first pulse signal. The living organism image monitoring system provided by the present disclosure has the advantages of being capable of synchronously transmitting the images of a living organism to the display module for display and enabling the images to be clearer.

Abstract: A 3D depth image acquiring method and apparatus, and an image acquisition device are provided. The method is applied to an image acquisition device comprising a VIS-NIR picture sensor and an infrared structured light projection component. The VIS-NIR picture sensor comprises a plurality of dot matrix units each having a blue light photosensitive component, a green light photosensitive component, a red light photosensitive component and an NIR photosensitive component distributed thereon. The method comprises: controlling the blue light photosensitive component, the green light photosensitive component, the red light photosensitive component, the NIR photosensitive component and the infrared structured light projection component to operate, to obtain an optimum NIR image and an optimum VIS image; and processing the optimum VIS image and a depth image which is obtained by performing calculation on the optimum NIR image using a 3D depth mode, to obtain a 3D depth image.

Abstract: A CMOS image sensor encapsulation structure and its manufacturing method, including: forming a blind hole in a combined layer formed by a first insulating layer and a wafer, a surface of the first insulating layer facing away from the wafer having a micro convex lens; forming a second insulating layer on a hole wall of the blind hole, then filling an electrically conductive material in the blind hole having the second insulating layer, and making a conductor in the combined layer in signal connection with the micro convex lens and an IC extend to a surface of the first insulating layer and electrically connecting the conductor to the electrically conductive material; fixing the transparent substrate material on a surface of the first insulating layer having the micro convex lens, forming a dummy wafer on a surface of the transparent substrate material, and then thinning the wafer by grinding.

Abstract: Disclosed are a CMOS image sensor encapsulation structure and a method for manufacturing the same, including the steps of: firstly, a transparent substrate material is fixed to a surface of a first insulating layer having a micro convex lens, a dummy wafer is fixed on a surface of the transparent substrate material, and then a wafer is thinned by grinding, and in this process, the transparent substrate material provides more mechanical support force for the wafer, therefore, the wafer can become thinner by grinding, thus the CMOS image sensor encapsulation structure is characterized by being formed in a thin shape. Besides, a second installation area has a protection glue layer which can prevent oxygen and moisture from entering internal elements and absorb scattered light.

Abstract: A 3D depth image acquiring method and apparatus, and an image acquisition device are provided. The method is applied to an image acquisition device comprising a VIS-NIR picture sensor and an infrared structured light projection component. The VIS-NIR picture sensor comprises a plurality of dot matrix units each having a blue light photosensitive component, a green light photosensitive component, a red light photosensitive component and an NIR photosensitive component distributed thereon. The method comprises: controlling the blue light photosensitive component, the green light photosensitive component, the red light photosensitive component, the NIR photosensitive component and the infrared structured light projection component to operate, to obtain an optimum NIR image and an optimum VIS image; and processing the optimum VIS image and a depth image which is obtained by performing calculation on the optimum NIR image using a 3D depth mode, to obtain a 3D depth image.

Abstract: Disclosed are a CMOS image sensor encapsulation structure and a method for manufacturing the same, including the steps of: firstly, a transparent substrate material is fixed to a surface of a first insulating layer having a micro convex lens, a dummy wafer is fixed on a surface of the transparent substrate material, and then a wafer is thinned by grinding, and in this process, the transparent substrate material provides more mechanical support force for the wafer, therefore, the wafer can become thinner by grinding, thus the CMOS image sensor encapsulation structure is characterized by being formed in a thin shape. Besides, a second installation area has a protection glue layer which can prevent oxygen and moisture from entering internal elements and absorb scattered light.

Abstract: A CMOS image sensor encapsulation structure and its manufacturing method, including : forming a blind hole in a combined layer formed by a first insulating layer and a wafer, a surface of the first insulating layer facing away from the wafer having a micro convex lens; forming a second insulating layer on a hole wall of the blind hole, then filling an electrically conductive material in the blind hole having the second insulating layer, and making a conductor in the combined layer in signal connection with the micro convex lens and an IC extend to a surface of the first insulating layer and electrically connecting the conductor to the electrically conductive material; fixing the transparent substrate material on a surface of the first insulating layer having the micro convex lens, forming a dummy wafer on a surface of the transparent substrate material, and then thinning the wafer by grinding.

Abstract: A living organism image monitoring system is provided, relating to the technical field of medical equipment. The living organism image monitoring system comprises a display module, a processor and a CIGS chip, the CIGS chip, the processor and the display module being electrically connected, the CIGS chip being used for detecting a near infrared light signal of a living organism and generating a current signal after having detected the near infrared light signal, the processor being used for generating a first pulse signal according to the current signal, and the display module being used for displaying an image according to the first pulse signal. The living organism image monitoring system provided by the present disclosure has the advantages of being capable of synchronously transmitting the images of a living organism to the display module for display and enabling the images to be clearer.

Abstract: A cross connect terminal block, comprising: a base; at least one set of terminals disposed in the base, the terminal having a first end and a second end, the first end being used for connecting with a first set of wires and the second end being used for connecting with a second set of wires; at least a first cover removably disposed on the base and having a support means for supporting the first set of wires, the support means of the first cover being located at a position corresponding to the first end of the terminal; and at least a second cover removably disposed on the base and having a support means for supporting the second set of wires, the support means of the second cover being located at a position corresponding to the second end of the terminal.

Abstract: A cross connect terminal block, comprising: a base; at least one set of terminals disposed in the base, the terminal having a first end and a second end, the first end being used for connecting with a first set of wires and the second end being used for connecting with a second set of wires; at least a first cover removably disposed on the base and having a support means for supporting the first set of wires, the support means of the first cover being located at a position corresponding to the first end of the terminal; and at least a second cover removably disposed on the base and having a support means for supporting the second set of wires, the support means of the second cover being located at a position corresponding to the second end of the terminal.