Patents by Inventor CHEN-HSING CHANG

CHEN-HSING CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF
    Publication number: 20240170381
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Application
    Filed: February 1, 2024
    Publication date: May 23, 2024
    Inventors: Chun-Hsien HUANG, Peng-Fu HSU, Yu-Syuan CAI, Min-Hsiu HUNG, Chen-Yuan KAO, Ken-Yu CHANG, Chun-I TSAI, Chia-Han LAI, Chih-Wei CHANG, Ming-Hsing TSAI
  • Interconnect structures including a fin structure and a metal cap
    Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • MULTIFUNCTION CAMERA WITH AN ENVIRONMENT SENSING FUNCTION
    Publication number: 20090146807
    Abstract: A multifunction camera includes an image capturing unit, a sensing unit, a storing unit, a control unit, and a warning unit. The image capturing unit is for capturing images. The sensing unit is for obtaining current environmental parameters of an immediate environment where the multifunction camera is used. The storing unit is for storing the images, the current environmental parameters, and predetermined safe environmental parameters. The control unit is for receiving the current environmental parameters, and comparing the current environmental parameters with the predetermined safe environmental parameters, and generating a warning signal if any of the current environmental parameters is outside a range of the corresponding predetermined safe environmental parameter. The warning unit is for activating a warning indicator in response to the warning signal.
    Type: Application
    Filed: April 23, 2008
    Publication date: June 11, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHEN-HSING CHANG