Abstract: A package structure including a first leadframe, a second leadframe, a power pin, a ground pin, a first pin, several first wires, several second wires, and a package body is disclosed. The first leadframe is used for electrically coupling to the drains of a first power transistor and the second power transistor. The ground pin is electrically coupled to the first leadframe. The first pin is connected with the first leadframe through a conductive region used for increasing the amount of current which can be loaded by the first pin. The first wires are used for electrically coupling between the first leadframe and the source of the second power transistor, for reducing the internal resistance of the second power transistor. The second wires are used for electrically coupling between the ground pin and the source of the first power transistor, for reducing the internal resistance of the first power transistor.

Abstract: A packaging structure comprises a first leadframe, a second leadframe, two grounding pins, two first pins, a plurality of first wires, a plurality of second wires, and a package body. The second leadframe is coupled to the drains of a first power transistor and a second power transistor. The two grounding pins are adjacent together and coupled to the first leadframe. The two first pins are coupled to the source of the second power transistor. The two first pins are connected together through a conductive region for increasing capability of loading current. The plurality of first wires is coupled between the source of the second power transistor and the first pin to decrease the internal resistance of the second power transistor. The plurality of second wires is coupled between the first leadframe and the source of the first power transistor to decrease the internal resistance of the first power transistor.

Abstract: A three-dimensional printing device includes a top bracket, a side bracket, and a pivoting member. The top bracket includes a pair of sidewalls cooperatively defining a receiving space to receive an inkjet head. The side bracket includes a pair of sidewalls cooperatively defining a receiving space to receive the top bracket. The pivoting member includes a pair of sidewalls cooperatively defining a receiving space to receive an inkjet head. The pivoting member is rotatably mounted in the receiving space of the side bracket.

Abstract: Systems and methods are hereby provided for enclosures having integrated handle features for storing one or more storage devices. The system includes a rigid frame and multiple bays. Each bay includes a body movably attached to the frame, wherein repositioning of the body with respect to the frame is restricted by at least one holding element of the frame to a limited range of motion. The body defines a receptacle for receiving and holding a storage device. Each bay also includes a lever arm rotatably attached to the frame, the lever arm comprising a cam surface to engage with the body and to move the body upon rotation of the lever arm. When the lever arm achieves a first position, the body engages the storage device with a communication channel, and when the lever arm achieves a second position, the body disengages the storage device from the communication channel.

Abstract: A change point finding method applied to a logic circuit is provided. The method first defines an indication map and performs a functional equivalent check to judge whether the indication map is correct. When a result is confirmative, the method adds a trap to an RTL HDL of the logic circuit, so that a plurality of comparing points are generated in an APR gate level HDL of the logic circuit. Then the method performs a backward functional equivalent check on the APR gate level HDL of the logic circuit to find a change point according to the comparing points.

Abstract: An ink-jet device for jetting ink on an outer surface of a workpiece, includes an ink jet head including a nozzle, a fixing platform to fix the workpiece, a pair of light sources for emitting light to heat ink from the nozzle, and one or more reflection assemblies positioned on opposite sides of the fixing platform and below the ink jet head. The light sources are positioned in the corresponding reflection assembly. Each of the reflection assembly reflects light to be transmitted parallel to the nozzle, for heating and drying the ink on the outer surface of the workpiece.

Abstract: A manual fork truck using a tightening device is disclosed. The tightening device applied to a manual fork truck, comprises a tightening rod; a fixing portion on one end of the tightening rod; and a plurality of tightening assemblies separately assembled to the tightening rod axially; each of the plurality of tightening assemblies comprising at least one tightening arm on the tightening rod, and a tightening belt having one end connected to the at least one tightening arm.

Abstract: A battery storage module and a mounting seat for the battery storage module are disclosed. The battery storage module includes a sliding base and a storage battery. The sliding base includes a container, a plurality of wheels, a pair of conducting members and at least one mounting member. The container has a first end and a second end opposite to the first end, the plurality of wheels are mounted on the container, the pair of conducting members are mounted on the first end of the container, and the at least one mounting member is mounted on the second end of the container. The storage battery is received in the container and electrically connected to the pair of conducting members.

Abstract: A print head includes a nozzle plate, a fixing plate fixed to the nozzle plate, an oscillation sheet, and a security assembly. The fixing plate defines a receiving groove. The oscillation sheet is fixed between the fixing plate and the nozzle plate and covers the receiving groove. The security assembly includes a fixing component, an elastic component, a fixing element, an anti-detachable component, and a pointed tip extending from a distal end of the anti-detachable component. The security assembly is fixed to the fixing plate, the elastic component and the anti-detachable component are received in the receiving groove with the pointed tip pointed towards the oscillation sheet. A first end of the compressed elastic component resists against the fixing component and a second end of the elastic component resists the anti-detachable component.

Abstract: An inkjet head includes a main body, a film, a piezoelectric atomizer, a cover and a nozzle plate. The main body includes a cavity receiving a fluid with an opening connecting the cavity. The cover is fastened to a top end of the main body. The film is interposed between the cover and the main body. The nozzle plate includes a plurality of nozzles. The nozzle plate is disposed on a bottom end of the main body. The piezoelectric atomizer is interposed between the cover and the film. The piezoelectric atomizer introduces pressure variations in a static pressure to atomize the fluid.

Abstract: An inkjet printer includes an inkjet cartridge, an inkjet head, a controller, a viscosity adjustment device and a viscometer. The inkjet cartridge is filled with ink. The inkjet head is connected to the inkjet cartridge. The catcher plate is opposite to the inkjet head, and connected to the cartridge. The viscometer is configured for determining a viscosity of ink in the inkjet cartridge. The viscosity adjustment device is configured for adjusting viscosity of ink in the inkjet cartridge. The controller is electrically connected to the inkjet head, the viscometer, and the viscosity adjustment device, respectively.

Abstract: A congestive placement preventing apparatus applied to a circuit layout including electrical devices is provided. The congestive placement preventing apparatus includes an analyzing module, a reserving module and a placing module. The analyzing module performs a routing congestion analysis on the circuit layout to generate an analysis result of the circuit layout. The reserving module correspondingly disposes a plurality of blockages in the circuit layout according to the analysis result, so that a first space with the blockages and a second space are formed in the circuit layout. After the placing module places the electrical devices in the second space, the placing module removes the blockages from the first space, and redistributes the electrical devices in the first space and the second space according to a redistribution rule.

Abstract: A multi-chip module is disclosed to include a pin frame, an electric power switch chip, and a battery protection chip. The pin frame has a chip placement region and six pins. The second pin and the fifth pin are electrically connected at the chip placement region, and the other pins are set electrically isolated from each other. A bottom surface of the electric power switch chip is electrically connected at the chip placement region, and a top surface thereof is electrically connected to the first pin and the third pin. A bottom surface of the battery protection chip is disposed at the top surface of the electric power switch chip in an electrically isolated fashion. A top surface of the battery protection chip is electrically connected to the top surface of the electric power switch chip, the first pin, the fourth pin, and the sixth pin.

Abstract: A print head includes a nozzle plate, a fixing plate fixed to the nozzle plate, an oscillation sheet, and a security assembly. The fixing plate defines a receiving groove. The oscillation sheet is fixed between the fixing plate and the nozzle plate and covers the receiving groove. The security assembly includes a fixing component, an elastic component, a fixing element, an anti-detachable component, and a pointed tip extending from a distal end of the anti-detachable component. The security assembly is fixed to the fixing plate, the elastic component and the anti-detachable component are received in the receiving groove with the pointed tip pointed towards the oscillation sheet. A first end of the compressed elastic component resists against the fixing component and a second end of the elastic component resists the anti-detachable component.

Abstract: A congestive placement preventing apparatus, applied in a logic circuit layout having 2K logic circuits, where K is a positive integer, is provided. The congestive placement preventing apparatus includes a restructuring module and a synthesizing module. The restructuring module adds a selecting unit in the logic circuit layout, and adds (N?K) buffers in each of the 2K logic circuits, where N is a positive integer. The synthesizing module synthesizes the restructured logic circuit layout according to a plurality of “don't touch” synthesizing commands associated with the added buffers. In the synthesized logic circuit layout, all of the 2K logic circuits are independent and not coupled or merged with one another.

Abstract: An apparatus of preventing congestive placement is provided. The apparatus comprises a judging module, a pattern generating module, and a placement module. The judging module judges whether a circuit layout comprises a congestive region according to a judging rule. When a judgment result of the judging module is affirmative, the pattern generating module generates a redistribution pattern with a density distribution of blockages. The density distribution gradually decreases outward. The placement module regards the congestive region as the center redistributes the blockages and electronic cells according to the redistribution pattern.

Abstract: An inkjet printing apparatus includes an inkjet print-head, an ink inlet conduit, a vacuum device, and a cleaning assembly. The inkjet print-head defines a number of nozzles. The ink inlet conduit is connected to the inkjet print-head and communicates with the nozzles. The cleaning assembly includes a cleaning member defining a cleaning groove. The vacuum device is connected to the inkjet print-head to impel cleaner received in the cleaning groove to flow through the nozzles along a direction reverse of a direction the ink is jetted.

Abstract: A congestive placement preventing apparatus for modifying a circuit layout includes an analyzing module, a defining module and an extension module. The analyzing module performs a congestion analysis on the circuit layout to generate an analysis result. The defining module defines a congestion region and a share region adjacent to the congestion region on the circuit layout according to the analysis result. A density of electronic cells of the congestion region is higher than that of electronic cells of the share region. The extension module arranges a plurality of electronic cells in the congestion region to the congestion region and the share region, thereby reducing the density of electronic cells in the congestion region.

Abstract: An exemplary clamping apparatus includes a supporting body, a plurality of clamping units installed on the supporting body, a PWM controller, and a detection unit. Each clamping unit includes a magnet, a clamping pin, an electrical coil, and a coil core mechanically engaged with the clamping pin. The magnet is configured for holding the clamping pin at a target position. The PWM controller is configured for supplying a pulse signal to the respective electrical coil of each clamping unit and for thereby creating a magnetic force causing a corresponding coil core and a corresponding clamping pin to, synchronously, move. The detection unit is configured for detecting a back electromotive force representative of the arrival to the target position of a clamping pin and signaling the PWM controller to stop supplying the pulse signal. A clamping process utilizing the clamping apparatus is also provided.

Abstract: A static voltage drop analyzing apparatus applied to a Multi-Threshold Complementary Metal-Oxide-Semiconductor (MTCMOS) transistor is provided. The static voltage drop analyzing apparatus includes a calculating module, a processing module, and a measuring module. The calculating module calculates a voltage drop tolerance according to the voltage drop characteristic of the MTCMOS transistor. The processing module selects a simulation metal layer corresponding to the voltage drop tolerance from a plurality of candidate simulation metal layers, and adds the simulation metal layer into the MTCMOS transistor. The measuring module measures the voltage drop of the simulation metal layer added into the MTCMOS transistor. The measured voltage drop of the simulation layer added into the MTCMOS is substantially the static voltage drop of the MTCMOS transistor.